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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CUTTING APPARATUS

    • Publication number 20230191511
    • Publication date Jun 22, 2023
    • Disco Corporation
    • Takashi FUKAZAWA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DICING BLADE INCLUDING DIAMOND PARTICLES

    • Publication number 20230039736
    • Publication date Feb 9, 2023
    • Samsung Electronics Co., Ltd.
    • Youngja KIM
    • C01 - INORGANIC CHEMISTRY
  • Information Patent Application

    ULTRASONIC RESONATOR SUPPORT STRUCTURE AND ULTRASONIC VIBRATION MAC...

    • Publication number 20220266298
    • Publication date Aug 25, 2022
    • TAKADA CORPORATION
    • Keiichi Yotsumoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EDGE TRIMMING METHOD

    • Publication number 20220184768
    • Publication date Jun 16, 2022
    • Disco Corporation
    • Takashi OKAMURA
    • B24 - GRINDING POLISHING
  • Information Patent Application

    METHOD AND APPARATUS FOR MANUFACTURING HIGH-HARDNESS DIAMOND SIMULA...

    • Publication number 20220063135
    • Publication date Mar 3, 2022
    • DIA&CO Inc.
    • YOUNG DAE KIM
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    BLADE REPLACING APPARATUS AND ADJUSTING METHOD OF BLADE REPLACING A...

    • Publication number 20210354257
    • Publication date Nov 18, 2021
    • Disco Corporation
    • Kazuki TERADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER TRIMMING DEVICE

    • Publication number 20210320000
    • Publication date Oct 14, 2021
    • Samsung Electronics Co., Ltd.
    • Jungseok AHN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BLADE HOLDING JIG

    • Publication number 20210316477
    • Publication date Oct 14, 2021
    • Disco Corporation
    • Zhibo SU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CUTTING APPARATUS, CUTTING BLADE REPLACEMENT METHOD, AND BOARD REPL...

    • Publication number 20210316468
    • Publication date Oct 14, 2021
    • Disco Corporation
    • Kazuki TERADA
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING
  • Information Patent Application

    EDGE ALIGNMENT METHOD

    • Publication number 20210291404
    • Publication date Sep 23, 2021
    • Disco Corporation
    • Atsushi KOMATSU
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    PROCESSING APPARATUS

    • Publication number 20210107180
    • Publication date Apr 15, 2021
    • Disco Corporation
    • Kazuki TERADA
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING BLADE AND MANUFACTURING METHOD OF CUTTING BLADE

    • Publication number 20210078204
    • Publication date Mar 18, 2021
    • Disco Corporation
    • Takashi FUKAZAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CUTTING APPARATUS

    • Publication number 20200391410
    • Publication date Dec 17, 2020
    • Disco Corporation
    • Takeomi FUKUOKA
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    HUBBED BLADE

    • Publication number 20200324390
    • Publication date Oct 15, 2020
    • Disco Corporation
    • Ryoji TAGUCHI
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    HUBBED BLADE

    • Publication number 20200324391
    • Publication date Oct 15, 2020
    • Disco Corporation
    • Ryoji TAGUCHI
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    PATTERN STRUCTURE AND METHOD OF MANUFACTURING THE PATTERN STRUCTURE

    • Publication number 20200249384
    • Publication date Aug 6, 2020
    • Samsung Electronics Co., Ltd.
    • Sunghoon LEE
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING BLADE MOUNTING METHOD

    • Publication number 20200198183
    • Publication date Jun 25, 2020
    • Disco Corporation
    • Kazuma Sekiya
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    A Method of Machining Brittle Materials

    • Publication number 20200039109
    • Publication date Feb 6, 2020
    • UNIVERSITY OF NEWCASTLE UPON TYNE
    • Zi Jie Choong
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING APPARATUS

    • Publication number 20200030928
    • Publication date Jan 30, 2020
    • Disco Corporation
    • Kazuki TERADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor Sawing Method and System

    • Publication number 20190389091
    • Publication date Dec 26, 2019
    • TEXAS INSTRUMENTS INCORPORATED
    • Chi-Hung Chen
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    WAFER PROCESSING METHOD

    • Publication number 20190378745
    • Publication date Dec 12, 2019
    • Disco Corporation
    • Shigenori HARADA
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    TRANSFER JIG AND CUTTING BLADE CHANGING METHOD

    • Publication number 20190358757
    • Publication date Nov 28, 2019
    • Disco Corporation
    • Kazuki TERADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CORE DRILL BIT AND METHODS OF FORMING THE SAME

    • Publication number 20190329449
    • Publication date Oct 31, 2019
    • Saint-Gobain Abrasives, Inc.
    • Ji WANG
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING APPARATUS

    • Publication number 20190295850
    • Publication date Sep 26, 2019
    • Disco Corporation
    • Hisashi ARAKIDA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CHUCK TABLE AND PROCESSING APPARATUS INCLUDING THE SAME

    • Publication number 20190275700
    • Publication date Sep 12, 2019
    • Disco Corporation
    • Kazuma Sekiya
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    PROCESSING APPARATUS

    • Publication number 20190229018
    • Publication date Jul 25, 2019
    • Disco Corporation
    • Kenji Takenouchi
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING BLADE MOUNTING METHOD

    • Publication number 20190001526
    • Publication date Jan 3, 2019
    • Disco Corporation
    • Kazuma Sekiya
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING BLADE DETECTING MECHANISM FOR CUTTING APPARATUS

    • Publication number 20180333895
    • Publication date Nov 22, 2018
    • Disco Corporation
    • Satoshi Sawaki
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    METHOD OF PROCESSING WORKPIECE

    • Publication number 20180286757
    • Publication date Oct 4, 2018
    • Disco Corporation
    • Kenji Takenouchi
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    WAFER PROCESSING METHOD

    • Publication number 20180229396
    • Publication date Aug 16, 2018
    • Disco Corporation
    • Kazuma Sekiya
    • B28 - WORKING CEMENT, CLAY, OR STONE