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H01L2224/82108

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/82108by self-assembly processes

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming stacked integrated circuits using selective ther...
- Patent number 12,027,488
- Issue date Jul 2, 2024
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including electrical connections on an encapsulat...
- Patent number 11,676,928
- Issue date Jun 13, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including electrical connections on an encapsulat...
- Patent number 11,114,404
- Issue date Sep 7, 2021
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized sealing of interconnect structures in small gaps
- Patent number 9,331,043
- Issue date May 3, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 7,955,873
- Issue date Jun 7, 2011
- Infineon Technologies AG
- Manfred Mengel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...
- Publication number 20240347502
- Publication date Oct 17, 2024
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING ELECTRICAL CONNECTIONS ON AN ENCAPSULAT...
- Publication number 20210366865
- Publication date Nov 25, 2021
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING ELECTRICAL CONNECTIONS ON AN ENCAPSULAT...
- Publication number 20200194397
- Publication date Jun 18, 2020
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20100248475
- Publication date Sep 30, 2010
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR