by semi-additive methods; masks therefor

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CPC
H05K3/108

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/108by semi-additive methods; masks therefor

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 12,165,881
- Issue date Dec 10, 2024
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring board having a wiring pattern that has a multi-layer structure
- Patent number 12,160,954
- Issue date Dec 3, 2024
- Shinko Electric Industries Co., Ltd.
- Yusuke Gozu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for providing dynamic feedback for selective adhesion PCB pr...
- Patent number 12,150,248
- Issue date Nov 19, 2024
- Honeywell Federal Manufacturing & Technologies, LLC
- Jonathan Douglas Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,107,327
- Issue date Oct 1, 2024
- Dai Nippon Printing Co., Ltd.
- Koichi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing sequences for high density interconnect printed circu...
- Patent number 12,063,751
- Issue date Aug 13, 2024
- Atotech Deutschland GmbH & Co. KG
- Akif Özkök
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 12,058,818
- Issue date Aug 6, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,057,670
- Issue date Aug 6, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,022,621
- Issue date Jun 25, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Jeong Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board (PCB) and method of making the same
- Patent number 12,016,129
- Issue date Jun 18, 2024
- ZF CV Systems Europe BV
- Marcin Calka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 11,979,981
- Issue date May 7, 2024
- Kyocera Corporation
- Takayuki Umemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 11,930,601
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Yuji Kadowaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of substrate having electrical interconnection s...
- Patent number 11,913,121
- Issue date Feb 27, 2024
- Siliconware Precision Industries Co., Ltd.
- Po-Yi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,889,634
- Issue date Jan 30, 2024
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resist layer forming method, method for manufacturing wiring board,...
- Patent number 11,818,847
- Issue date Nov 14, 2023
- Shinko Electric Industries Co., Ltd.
- Yoshihisa Kanbe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board
- Patent number 11,785,721
- Issue date Oct 10, 2023
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing circuit board including metal-containing l...
- Patent number 11,770,903
- Issue date Sep 26, 2023
- Korea Institute of Science and Technology
- Ji Young Byun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 11,756,800
- Issue date Sep 12, 2023
- Rashid Mavliev
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,729,912
- Issue date Aug 15, 2023
- Ibiden Co., Ltd.
- Kosuke Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 11,723,153
- Issue date Aug 8, 2023
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 11,705,624
- Issue date Jul 18, 2023
- Dai Nippon Printing Co., Ltd.
- Koichi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing wiring substrate
- Patent number 11,696,410
- Issue date Jul 4, 2023
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed wiring board production method and printed wiring board pro...
- Patent number 11,672,082
- Issue date Jun 6, 2023
- Sumitomo Electric Industries, Ltd.
- Junichi Motomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing wiring board
- Patent number 11,665,829
- Issue date May 30, 2023
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless and electrolytic deposition process for forming traces...
- Patent number 11,653,453
- Issue date May 16, 2023
- CATLAM, LLC
- Kenneth S Bahl
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Printed wiring board and manufacturing method thereof
- Patent number 11,653,454
- Issue date May 16, 2023
- Sumitomo Electric Printed Circuits, Inc.
- Kohei Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure, preparation method thereof, and display device
- Patent number 11,650,637
- Issue date May 16, 2023
- BOE Technology Group Co., Ltd.
- Haixu Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component package and printed circuit board for the same
- Patent number 11,638,346
- Issue date Apr 25, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seon Ha Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 11,589,457
- Issue date Feb 21, 2023
- Kyocera Corporation
- Seiichirou Itou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing circuit board
- Patent number 11,582,885
- Issue date Feb 14, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20240421471
- Publication date Dec 19, 2024
- DAI NIPPON PRINTING CO., LTD.
- Koichi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341034
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20240341042
- Publication date Oct 10, 2024
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240334598
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Yuki KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD OF FABRICATING OBJECTS USING ADDITIVE MANUFACTURI...
- Publication number 20240324106
- Publication date Sep 26, 2024
- Advanced Printed Electronic Solutions LLC
- Richard Neill
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240284600
- Publication date Aug 22, 2024
- Nitto Denko Corporation
- Hayato TAKAKURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING BOARD
- Publication number 20240215164
- Publication date Jun 27, 2024
- Shinko Electric Industries Co., Ltd.
- Kyota YAMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240215157
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Ki Ran PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...
- Publication number 20240188228
- Publication date Jun 6, 2024
- IBIDEN CO., LTD.
- Yuji KADOWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING LAMINATE
- Publication number 20240179848
- Publication date May 30, 2024
- Namics Corporation
- Naoki OBATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240179853
- Publication date May 30, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD, WIRING CIRCUIT BOARD WIT...
- Publication number 20240164024
- Publication date May 16, 2024
- Nitto Denko Corporation
- Ikuya HASHIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240164017
- Publication date May 16, 2024
- Nitto Denko Corporation
- Hideki MATSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING TRANSFER PLATE, WIRING-EQUIPPED WIRING TRANSFER PLATE, WIRIN...
- Publication number 20240155774
- Publication date May 9, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Takayoshi NIRENGI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20240098889
- Publication date Mar 21, 2024
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240049398
- Publication date Feb 8, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD ASSEMBLY SHEET
- Publication number 20240040705
- Publication date Feb 1, 2024
- Nitto Denko Corporation
- Rihito FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING CIRCUITS OF SUBSTRATE OF DISPLAY DEVICE
- Publication number 20240015891
- Publication date Jan 11, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Tong Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20230422393
- Publication date Dec 28, 2023
- KYOCERA CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230413429
- Publication date Dec 21, 2023
- IBIDEN CO., LTD.
- Atsushi DEGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230403789
- Publication date Dec 14, 2023
- IBIDEN CO., LTD.
- Hiroki WAKAMORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20230369751
- Publication date Nov 16, 2023
- DAI NIPPON PRINTING CO., LTD.
- Koichi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...
- Publication number 20230369065
- Publication date Nov 16, 2023
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND SYSTEM FOR MANUFACTURING FLEXIBLE TRANSPARENT CONDUCTIVE...
- Publication number 20230345641
- Publication date Oct 26, 2023
- QINGDAO UNIVERSITY OF TECHNOLOGY
- Xiaoyang ZHU
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20230337370
- Publication date Oct 19, 2023
- LG Innotek Co., Ltd.
- Yun Mi BAE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230337367
- Publication date Oct 19, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Mi Jeong JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20230318203
- Publication date Oct 5, 2023
- DAI NIPPON PRINTING CO., LTD.
- Kazuki KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...
- Publication number 20230303750
- Publication date Sep 28, 2023
- Showa Denko Materials Co., Ltd.
- Kohei OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20230276576
- Publication date Aug 31, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Making Contact with a Component Embedded in a Printed Ci...
- Publication number 20230189448
- Publication date Jun 15, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by semi-additive methods; masks therefor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and systems of forming metal interconnect layers using engi...

Wiring board having a wiring pattern that has a multi-layer structure

System for providing dynamic feedback for selective adhesion PCB pr...

Wiring board and method for manufacturing wiring board

Manufacturing sequences for high density interconnect printed circu...

Method for manufacturing printed wiring board

Semiconductor package structure and method for manufacturing the same

Printed circuit board and method for manufacturing the same

Printed circuit board (PCB) and method of making the same

Wiring board

Method for manufacturing printed wiring board

Fabrication method of substrate having electrical interconnection s...

Single-layer circuit board, multi-layer circuit board, and manufact...

Printed circuit board and method of manufacturing the same

Resist layer forming method, method for manufacturing wiring board,...

Method for manufacturing wiring board

Method for manufacturing circuit board including metal-containing l...

Methods and systems of forming metal interconnect layers using engi...

Wiring substrate and method for manufacturing wiring substrate

Printed circuit board and method of fabricating the same

Wiring board and method for manufacturing wiring board

Method for producing wiring substrate

Printed wiring board production method and printed wiring board pro...

Method for manufacturing wiring board

Electroless and electrolytic deposition process for forming traces...

Printed wiring board and manufacturing method thereof

Wiring structure, preparation method thereof, and display device

Component package and printed circuit board for the same

Wiring substrate

Circuit board and method for manufacturing circuit board

Patents Applicationslast 30 patents

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

WIRING SUBSTRATE

METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...

WIRING SUBSTRATE

SYSTEM AND METHOD OF FABRICATING OBJECTS USING ADDITIVE MANUFACTURI...

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

WIRING BOARD

PRINTED CIRCUIT BOARD

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...

METHOD FOR MANUFACTURING LAMINATE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR PRODUCING WIRING CIRCUIT BOARD, WIRING CIRCUIT BOARD WIT...

WIRING CIRCUIT BOARD

WIRING TRANSFER PLATE, WIRING-EQUIPPED WIRING TRANSFER PLATE, WIRIN...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING CIRCUIT BOARD ASSEMBLY SHEET

METHOD OF PRODUCING CIRCUITS OF SUBSTRATE OF DISPLAY DEVICE

WIRING BOARD

WIRING SUBSTRATE

WIRING SUBSTRATE

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...

METHOD AND SYSTEM FOR MANUFACTURING FLEXIBLE TRANSPARENT CONDUCTIVE...

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

Method for Making Contact with a Component Embedded in a Printed Ci...