by soldering

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H05K3/34

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/34by soldering

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,369,250
- Issue date Jul 22, 2025
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic component
- Patent number 12,369,254
- Issue date Jul 22, 2025
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board assembly
- Patent number 12,369,260
- Issue date Jul 22, 2025
- Vitesco Technologies GmbH
- Stefan Peck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pre-solder bump preventive overcoating
- Patent number 12,361,966
- Issue date Jul 15, 2025
- Western Digital Technologies, Inc.
- Irizo Naniwa
- G11 - INFORMATION STORAGE
Information Patent Grant
System and method for controlling flow of solder in a wave solderin...
- Patent number 12,363,833
- Issue date Jul 15, 2025
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package geometries to enable visual inspection of solder fillets
- Patent number 12,354,918
- Issue date Jul 8, 2025
- Texas Instruments Incorporated
- LongTing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for controlling flow of solder in a wave solderin...
- Patent number 12,356,555
- Issue date Jul 8, 2025
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,349,287
- Issue date Jul 1, 2025
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board module and electronic device comprising same
- Patent number 12,349,280
- Issue date Jul 1, 2025
- LG Innotek Co., Ltd
- Seung Min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adaptable lens assembly
- Patent number 12,339,502
- Issue date Jun 24, 2025
- Mellanox Technologies, Ltd.
- Hen Seri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating layer disposed on a plurality of conductive particles betwe...
- Patent number 12,336,396
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- Sang Hyeon Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices including vent openings and associated methods
- Patent number 12,334,405
- Issue date Jun 17, 2025
- Infineon Technologies AG
- Michael Stadler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder pads with concave edges for ball grid arrays
- Patent number 12,328,826
- Issue date Jun 10, 2025
- MOTOROLA SOLUTIONS, INC.
- Edwin L Bradley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and method of manufacturing electronic...
- Patent number 12,328,857
- Issue date Jun 10, 2025
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module, intermediate connection member, and electronic d...
- Patent number 12,327,938
- Issue date Jun 10, 2025
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protecting method for preventing solder crack failure in electronic...
- Patent number 12,328,827
- Issue date Jun 10, 2025
- SOLID STATE STORAGE TECHNOLOGY CORPORATION
- Tsung-Lung Lin
- G01 - MEASURING TESTING
Information Patent Grant
Ball attachment apparatus
- Patent number 12,318,870
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder mask for thermal pad of a printed circuit board to provide r...
- Patent number 12,322,692
- Issue date Jun 3, 2025
- STMicroelectronics Pte Ltd
- Daniel Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling an ejector, and related system
- Patent number 12,318,871
- Issue date Jun 3, 2025
- Mycronic AB
- Gustaf Martensson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderable waveguide antenna
- Patent number 12,315,999
- Issue date May 27, 2025
- Aptiv Technologies AG
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,309,941
- Issue date May 20, 2025
- LG Innotek Co., Ltd
- Se Woong Na
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux and method for producing assembly
- Patent number 12,304,008
- Issue date May 20, 2025
- Senju Metal Industry Co., Ltd.
- Yasuhisa Sukawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module, sub-module, and method for manufacturi...
- Patent number 12,309,932
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Tsuyoshi Takakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting of capacitors on printed circuit boards for non-volatile m...
- Patent number 12,309,942
- Issue date May 20, 2025
- SanDisk Technologies, Inc.
- Uthayarajan A L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with conductive or magnetic nanowires for localized heating...
- Patent number 12,300,591
- Issue date May 13, 2025
- Regents of The University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material
- Patent number 12,296,409
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer structure and an electronic device including the same
- Patent number 12,302,495
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yeonkyung Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device mountable in an electrical motor and method for m...
- Patent number 12,301,069
- Issue date May 13, 2025
- Melexis Bulgaria Ltd
- Dirk Leman
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Multi-pitch ball grid array
- Patent number 12,288,741
- Issue date Apr 29, 2025
- Juniper Networks, Inc.
- Granthana Kattehalli Rangaswamy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Plating a Printed Circuit Board
- Publication number 20250234462
- Publication date Jul 17, 2025
- AGFA-GEVAERT N.V.
- Kevin Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE REMOVAL OF ADHESIVE FROM COVERLAY FOR PRINTED CIRCUIT BOA...
- Publication number 20250227837
- Publication date Jul 10, 2025
- Rockwell Collins, Inc.
- John A. Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED STRUCTURE, METHOD FOR PRODUCING SAME, CONDUCTIVE MEMBER FOR...
- Publication number 20250222533
- Publication date Jul 10, 2025
- Murata Manufacturing Co., Ltd.
- Yasunori HIOKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD WITH AN EMBEDDED S...
- Publication number 20250220823
- Publication date Jul 3, 2025
- Hitron Technologies Inc.
- KUO-HAO PAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMART YARN AND METHOD FOR MANUFACTURING A YARN CONTAINING AN ELECTR...
- Publication number 20250207302
- Publication date Jun 26, 2025
- Siren Care, Inc.
- Jie Fu
- A41 - WEARING APPAREL
Information Patent Application
METHOD FOR ACCOMMODATING SUBSTRATE WARPAGE IN PRINTED CIRCUIT BOARD...
- Publication number 20250212320
- Publication date Jun 26, 2025
- Rockwell Collins, Inc.
- James B. Mayfield
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GRID ARRAY ELECTRICAL CONNECTORS
- Publication number 20250210894
- Publication date Jun 26, 2025
- Intel Corporation
- Arturo PACHON MUNOZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20250203770
- Publication date Jun 19, 2025
- Chipbond Technology Corporation
- Ting-Yi Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
- Publication number 20250203773
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT ASSEMBLY FOR ELECTROLYTIC CAPACITORS ON SOLID STATE DRIVES
- Publication number 20250194016
- Publication date Jun 12, 2025
- Western Digital Technologies, Inc.
- Dibin Gangadharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transmission Line Capacitor and Circuit Board Including the Same Em...
- Publication number 20250185154
- Publication date Jun 5, 2025
- KYOCRA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS, SYSTEM, AND METHOD OF PROVIDING A TRAY FOR HOLDING AN OP...
- Publication number 20250172759
- Publication date May 29, 2025
- Jabil Inc.
- Wenlu WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE DISPENSING FEEDBACK SYSTEM AND CIRCUIT BOARD PRINTER U...
- Publication number 20250162052
- Publication date May 22, 2025
- Illinois Tool Works Inc.
- Yuexin Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD
- Publication number 20250168986
- Publication date May 22, 2025
- TDK Corporation
- Akiko SEKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE MEMBER
- Publication number 20250168982
- Publication date May 22, 2025
- Canon Kabushiki Kaisha
- Yoshihiko Fujise
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
- Publication number 20250168985
- Publication date May 22, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Toshiharu MOTOFUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250159812
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRIC-MOTOR DRIVE CONTROL DEVICE
- Publication number 20250158494
- Publication date May 15, 2025
- Hitachi Astemo, Ltd.
- Kazuhiko NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...
- Publication number 20250151191
- Publication date May 8, 2025
- Dell Products L.P.
- Earl BOONE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATED STANDOFF FEATURE FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...
- Publication number 20250151194
- Publication date May 8, 2025
- Dell Products L.P.
- Steven R. ETHRIDGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CREATING A SOLDER BARRIER BY CHANGING A MATERIAL PROPERTY OF A TRAC...
- Publication number 20250151206
- Publication date May 8, 2025
- Sandsik Technologies, Inc.
- John Patrick Burke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM-TYPE CIRCUIT AND METHOD OF CONNECTING PRINTED CIRCUIT BOARDS V...
- Publication number 20250142726
- Publication date May 1, 2025
- DENSO WAVE INCORPORATED
- Natsuki SUGIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD OF PRINTING SOLDER ON PRINTED CIRCUIT BOARD FO...
- Publication number 20250142735
- Publication date May 1, 2025
- Xilinx, Inc.
- Gamal REFAI-AHMED
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERIN...
- Publication number 20250133663
- Publication date Apr 24, 2025
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERIN...
- Publication number 20250133664
- Publication date Apr 24, 2025
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING SYSTEM AND METHOD OF USE
- Publication number 20250128344
- Publication date Apr 24, 2025
- Illinois Tool Works Inc.
- Gerardus Johannes Adrianus Maria Diepstraten
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MASKING METHOD AND MASKED PRODUCT
- Publication number 20250133661
- Publication date Apr 24, 2025
- P2i Ltd.
- Graham HUBBARD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250133662
- Publication date Apr 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Tun-Ching PI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SIGNAL TRACE TRANSITION FOR HIGH DATA RATE APPLICATIONS
- Publication number 20250120020
- Publication date Apr 10, 2025
- Marvell Asia Pte Ltd.
- Fei Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS

by soldering

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board structure and manufacturing method thereof

Method of manufacturing electronic component

Printed circuit board assembly

Pre-solder bump preventive overcoating

System and method for controlling flow of solder in a wave solderin...

Package geometries to enable visual inspection of solder fillets

System and method for controlling flow of solder in a wave solderin...

Method for soldering an electronic component to a circuit board by...

Printed circuit board module and electronic device comprising same

Adaptable lens assembly

Coating layer disposed on a plurality of conductive particles betwe...

Electronic devices including vent openings and associated methods

Solder pads with concave edges for ball grid arrays

Electronic component module and method of manufacturing electronic...

Electronic module, intermediate connection member, and electronic d...

Protecting method for preventing solder crack failure in electronic...

Ball attachment apparatus

Solder mask for thermal pad of a printed circuit board to provide r...

Method for controlling an ejector, and related system

Solderable waveguide antenna

Wiring board, semiconductor device, and method of manufacturing wir...

Circuit board

Flux and method for producing assembly

Electronic component module, sub-module, and method for manufacturi...

Mounting of capacitors on printed circuit boards for non-volatile m...

Devices with conductive or magnetic nanowires for localized heating...

Solder material

Interposer structure and an electronic device including the same

Electronic device mountable in an electrical motor and method for m...

Multi-pitch ball grid array

Patents Applicationslast 30 patents

Method of Plating a Printed Circuit Board

SELECTIVE REMOVAL OF ADHESIVE FROM COVERLAY FOR PRINTED CIRCUIT BOA...

BONDED STRUCTURE, METHOD FOR PRODUCING SAME, CONDUCTIVE MEMBER FOR...

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD WITH AN EMBEDDED S...

SMART YARN AND METHOD FOR MANUFACTURING A YARN CONTAINING AN ELECTR...

METHOD FOR ACCOMMODATING SUBSTRATE WARPAGE IN PRINTED CIRCUIT BOARD...

GRID ARRAY ELECTRICAL CONNECTORS

FLEXIBLE CIRCUIT BOARD

SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION

EFFICIENT ASSEMBLY FOR ELECTROLYTIC CAPACITORS ON SOLID STATE DRIVES

Transmission Line Capacitor and Circuit Board Including the Same Em...

APPARATUS, SYSTEM, AND METHOD OF PROVIDING A TRAY FOR HOLDING AN OP...

SOLDER PASTE DISPENSING FEEDBACK SYSTEM AND CIRCUIT BOARD PRINTER U...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD

BASE MEMBER

CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

INTEGRATED CIRCUIT STRUCTURE

ELECTRIC-MOTOR DRIVE CONTROL DEVICE

DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...

PLATED STANDOFF FEATURE FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...

CREATING A SOLDER BARRIER BY CHANGING A MATERIAL PROPERTY OF A TRAC...

FILM-TYPE CIRCUIT AND METHOD OF CONNECTING PRINTED CIRCUIT BOARDS V...

APPARATUS AND METHOD OF PRINTING SOLDER ON PRINTED CIRCUIT BOARD FO...

SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERIN...

SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERIN...

SOLDERING SYSTEM AND METHOD OF USE

MASKING METHOD AND MASKED PRODUCT

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SIGNAL TRACE TRANSITION FOR HIGH DATA RATE APPLICATIONS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS