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CPC
H05K3/34

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/34by soldering

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Squeegee holder with an integrated clamp bar
- Patent number 12,226,062
- Issue date Feb 18, 2025
- Transition Automation, Inc.
- Mark J. Curtin
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Printed circuit board including conductive pad and electric device...
- Patent number 12,232,259
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Bongsoo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method of providing a tray for holding an op...
- Patent number 12,228,771
- Issue date Feb 18, 2025
- JABIL INC.
- Wenlu Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabric with embedded electrical components
- Patent number 12,232,270
- Issue date Feb 18, 2025
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING
Information Patent Grant
Power semiconductor device and method for manufacturing power semic...
- Patent number 12,232,300
- Issue date Feb 18, 2025
- Mitsubishi Electric Corporation
- Noriyuki Besshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly, display assembly and assembling method ther...
- Patent number 12,230,897
- Issue date Feb 18, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Fengxian Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste and electronic device
- Patent number 12,224,081
- Issue date Feb 11, 2025
- BEIJING DREAM INK TECHNOLOGIES CO., LTD.
- Zhongwei Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal device
- Patent number 12,219,714
- Issue date Feb 4, 2025
- HONOR DEVICE CO., LTD.
- Yihe Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof, and terminal device
- Patent number 12,219,695
- Issue date Feb 4, 2025
- HONOR DEVICE CO., LTD.
- Junjie Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line capacitor and circuit board including the same em...
- Patent number 12,213,243
- Issue date Jan 28, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel molded electronic assemblies with integral terminals
- Patent number 12,200,862
- Issue date Jan 14, 2025
- Vicor Corporation
- Patrizio Vinciarelli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 12,191,241
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for step-soldering
- Patent number 12,179,291
- Issue date Dec 31, 2024
- Senju Metal Industry Co., Ltd.
- Takashi Saito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic laminated substrate, module, and method of manufacturing ce...
- Patent number 12,183,666
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Takuya Goitsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 12,185,476
- Issue date Dec 31, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 12,185,475
- Issue date Dec 31, 2024
- Advanced Semiconductor Engineering, Inc.
- Tun-Ching Pi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Smart connector and method of manufacturing same using an applicati...
- Patent number 12,176,659
- Issue date Dec 24, 2024
- Molex, LLC
- Victor Zaderej
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component and method for manufacturing a component
- Patent number 12,177,986
- Issue date Dec 24, 2024
- TDK ELECTRONICS AG
- Jan Ihle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct wire attachment methods and apparatus for a BGA component
- Patent number 12,177,989
- Issue date Dec 24, 2024
- ATL TECHNOLOGY, LLC
- Donovan M. Finnestad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High powered RF part for improved manufacturability
- Patent number 12,176,592
- Issue date Dec 24, 2024
- TTM Technologies Inc.
- Michael Len
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level bump stack for chip scale package
- Patent number 12,177,988
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module, and method of manufacturing electronic...
- Patent number 12,177,990
- Issue date Dec 24, 2024
- Murata Manufacturing Co., Ltd.
- Takahiro Kitazume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plug-in connector device and method for producing a plug-in connect...
- Patent number 12,170,415
- Issue date Dec 17, 2024
- Vitesco Technologies GmbH
- Gregory Drew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component, multi-layer ceramic elect...
- Patent number 12,170,174
- Issue date Dec 17, 2024
- Taiyo Yuden Co., Ltd.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 12,165,950
- Issue date Dec 10, 2024
- Vitesco Technologies GmbH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder mask arrangement for a component carrier
- Patent number 12,167,543
- Issue date Dec 10, 2024
- AT&S(Chongqing) Company Limited
- Ismadi Bin Ismail
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode for low temperature applications
- Patent number 12,159,961
- Issue date Dec 3, 2024
- Azenta Life Sciences, Inc.
- Aarash Navabi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance semiconductor device
- Patent number 12,159,817
- Issue date Dec 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency filter
- Patent number 12,160,217
- Issue date Dec 3, 2024
- Mitsubishi Electric Corporation
- Motomi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL MODULE PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE...
- Publication number 20250062592
- Publication date Feb 20, 2025
- PRIMAX ELECTRONICS LTD.
- CHING-HUI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD
- Publication number 20250063665
- Publication date Feb 20, 2025
- TDK Corporation
- Yukari WADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Mask Arrangement for a Component Carrier
- Publication number 20250056735
- Publication date Feb 13, 2025
- AT&S (Chongqing) Company Limited
- Ismadi Bin Ismail
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
- Publication number 20250056715
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Chao WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYS...
- Publication number 20250048561
- Publication date Feb 6, 2025
- Tesla, Inc.
- Vijaykumar KRITHIVASAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE
- Publication number 20250039529
- Publication date Jan 30, 2025
- LG Innotek Co., Ltd.
- JONG HO CHUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR MOUNTING AN ELECTRONIC DEVICE ON A FLEXIBLE SUBSTRATE AN...
- Publication number 20250031317
- Publication date Jan 23, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Capacitor and Circuit Board Containing the Same
- Publication number 20250029785
- Publication date Jan 23, 2025
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20250024608
- Publication date Jan 16, 2025
- Innolux Corporation
- Yi Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS
- Publication number 20250024606
- Publication date Jan 16, 2025
- MELLANOX TECHNOLOGIES, LTD.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna-in-Package Devices and Methods of Making
- Publication number 20250023227
- Publication date Jan 16, 2025
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL FORM FACTOR SHUNTED SOCKET PINS AND CONFIGURATION FOR IMPROVE...
- Publication number 20250015527
- Publication date Jan 9, 2025
- Intel Corporation
- Landon HANKS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS
- Publication number 20250006510
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-SOLDER BUMP PREVENTIVE OVERCOATING
- Publication number 20240428821
- Publication date Dec 26, 2024
- Western Digital Technologies, Inc.
- Irizo Naniwa
- G11 - INFORMATION STORAGE
Information Patent Application
PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...
- Publication number 20240422904
- Publication date Dec 19, 2024
- Chongqing BOE Electronic Technology Co., Ltd.
- Jie ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY PACK AND METHOD OF MANUFACTURE
- Publication number 20240421365
- Publication date Dec 19, 2024
- Black & Decker Inc.
- Moriah Counts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT ELECTRICAL DEVICES AND METHODS
- Publication number 20240412937
- Publication date Dec 12, 2024
- BOURNS, INC
- Kelly C. CASEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240414847
- Publication date Dec 12, 2024
- DENSO CORPORATION
- Takeshi KAZAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20240414842
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240414843
- Publication date Dec 12, 2024
- GOERTEK INC.
- Katsumi SAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240414850
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS
- Publication number 20240414851
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...
- Publication number 20240407096
- Publication date Dec 5, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Ihab KHOURY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240397633
- Publication date Nov 28, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-HSIANG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240389241
- Publication date Nov 21, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Min-Geun JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20240383035
- Publication date Nov 21, 2024
- Resonac Corporation
- Yoshinori EJIRI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20240389239
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

by soldering

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Squeegee holder with an integrated clamp bar

Printed circuit board including conductive pad and electric device...

Apparatus, system, and method of providing a tray for holding an op...

Fabric with embedded electrical components

Power semiconductor device and method for manufacturing power semic...

Circuit board assembly, display assembly and assembling method ther...

Conductive paste and electronic device

Terminal device

Circuit board and manufacturing method thereof, and terminal device

Package-on-package assembly with wire bond vias

Transmission line capacitor and circuit board including the same em...

Panel molded electronic assemblies with integral terminals

Fine pitch copper pillar package and method

Method for step-soldering

Ceramic laminated substrate, module, and method of manufacturing ce...

Method and apparatus for flexible circuit cable attachment

Electronic device and method of manufacturing the same

Smart connector and method of manufacturing same using an applicati...

Component and method for manufacturing a component

Direct wire attachment methods and apparatus for a BGA component

High powered RF part for improved manufacturability

Wafer level bump stack for chip scale package

Electronic component module, and method of manufacturing electronic...

Plug-in connector device and method for producing a plug-in connect...

Multi-layer ceramic electronic component, multi-layer ceramic elect...

Power semiconductor component and method for producing a power semi...

Solder mask arrangement for a component carrier

Light emitting diode for low temperature applications

High performance semiconductor device

High frequency filter

Patents Applicationslast 30 patents

OPTICAL MODULE PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD

Solder Mask Arrangement for a Component Carrier

FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME

FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYS...

Advanced Device Assembly Structures And Methods

CAMERA MODULE

METHOD FOR MOUNTING AN ELECTRONIC DEVICE ON A FLEXIBLE SUBSTRATE AN...

Multilayer Capacitor and Circuit Board Containing the Same

CIRCUIT STRUCTURE

METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS

Antenna-in-Package Devices and Methods of Making

SMALL FORM FACTOR SHUNTED SOCKET PINS AND CONFIGURATION FOR IMPROVE...

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS

PRE-SOLDER BUMP PREVENTIVE OVERCOATING

PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...

BATTERY PACK AND METHOD OF MANUFACTURE

SURFACE MOUNT ELECTRICAL DEVICES AND METHODS

MOUNT BOARD AND METHOD OF MANUFACTURING THE SAME

FLEXIBLE CIRCUIT BOARD

CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS

ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...

SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER