Membership
Tour
Register
Log in
by soldering
Follow
Industry
CPC
H05K3/34
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00
Apparatus or processes for manufacturing printed circuits
Current Industry
H05K3/34
by soldering
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Electronic component and method for manufacturing the same
Patent number
11,973,486
Issue date
Apr 30, 2024
Kyocera Corporation
Sinichiro Kitanishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing circuit boards
Patent number
11,974,404
Issue date
Apr 30, 2024
TOPPAN INC.
Yuki Nitta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Efficient wave guide transition between package and PCB using solde...
Patent number
11,963,291
Issue date
Apr 16, 2024
NXP B.V.
Leo van Gemert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vacuum-assisted BGA joint formation
Patent number
11,963,307
Issue date
Apr 16, 2024
International Business Machines Corporation
Matthew Doyle
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board and method of manufacturing the same
Patent number
11,963,311
Issue date
Apr 16, 2024
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Jae Woong Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board, inverter, motor vehicle and method for produ...
Patent number
11,956,895
Issue date
Apr 9, 2024
ZF Friedrichshafen AG
Michael Sperber
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solder recovery device
Patent number
11,956,902
Issue date
Apr 9, 2024
FUJI CORPORATION
Naoki Matsuzaki
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Apparatus for performing compensation associated with screen printe...
Patent number
11,950,374
Issue date
Apr 2, 2024
Koh Young Technology Inc.
Duk Young Lee
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Electrical connection test for unpopulated printed circuit boards
Patent number
11,940,481
Issue date
Mar 26, 2024
Dyconex AG
Daniel Luchsinger
G01 - MEASURING TESTING
Information
Patent Grant
Quad flat no-lead package with wettable flanges
Patent number
11,935,821
Issue date
Mar 19, 2024
Texas Instruments Incorporated
Nazila Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die-beam alignment for laser-assisted bonding
Patent number
11,929,334
Issue date
Mar 12, 2024
STATS ChipPAC Pte. Ltd.
Wagno Alves Braganca
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,923,825
Issue date
Mar 5, 2024
Advanced Semiconductor Engineering, Inc.
Cheng-Yuan Kung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low cost panel AESA with thermal management
Patent number
11,917,746
Issue date
Feb 27, 2024
Raytheon Company
Miroslav Micovic
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Socket having solder balls
Patent number
11,916,328
Issue date
Feb 27, 2024
Tyco Electronics Japan G.K.
Naoki Hashimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate structure and manufacturing method thereof, electronic de...
Patent number
11,917,758
Issue date
Feb 27, 2024
PANELSEMI CORPORATION
Ya-Che Hsueh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tombstone prevention for a surface mount device
Patent number
11,917,761
Issue date
Feb 27, 2024
Western Digital Technologies, Inc.
Joyce Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Mechatronic curtain for a process chamber for carrying out thermal...
Patent number
11,910,539
Issue date
Feb 20, 2024
Rehm Thermal Systems GmbH
Paul Wild
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit board with solder mask on internal copper pad
Patent number
11,910,540
Issue date
Feb 20, 2024
Pui Yin Yu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Crack sensor for sensing cracks in a solder pad, and method for pro...
Patent number
11,908,809
Issue date
Feb 20, 2024
STMicroelectronics (Crolles 2) SAS
Eric Sabouret
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit assembly
Patent number
11,898,915
Issue date
Feb 13, 2024
Autonetworks Technologies, Ltd.
Akira Haraguchi
G01 - MEASURING TESTING
Information
Patent Grant
Electronic component
Patent number
11,894,195
Issue date
Feb 6, 2024
TDK Corporation
Yoji Tozawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible inlay and manufacturing method thereof
Patent number
11,895,777
Issue date
Feb 6, 2024
IDEX Biometrics ASA
David N. Light
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Smart yarn and method for manufacturing a yarn containing an electr...
Patent number
11,891,730
Issue date
Feb 6, 2024
SIREN CARE, INC.
Jie Fu
A41 - WEARING APPAREL
Information
Patent Grant
Modular power electronics converters with enhanced connectivity rel...
Patent number
11,895,775
Issue date
Feb 6, 2024
University of Maryland, College Park
Yongwan Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame, packaged integrated circuit board, power chip, and circ...
Patent number
11,887,918
Issue date
Jan 30, 2024
Huawei Technologies Co., Ltd.
Xuanwei Fang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic component and method of forming
Patent number
11,887,766
Issue date
Jan 30, 2024
GE Aviation Systems LLC
Ramanujam Ramabhadran
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Antenna and assembly
Patent number
11,888,219
Issue date
Jan 30, 2024
Japan Aviation Electronics Industry, Limited
Osamu Hashiguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board and manufacturing method thereof, and electro...
Patent number
11,882,665
Issue date
Jan 23, 2024
Huawei Technologies Co., Ltd.
Zhengbao Sun
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Core material, electronic component and method for forming bump ele...
Patent number
11,872,656
Issue date
Jan 16, 2024
Senju Metal Industry Co., Ltd.
Shigeki Kondoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
PCB production by laser systems
Patent number
11,877,398
Issue date
Jan 16, 2024
IO Tech Group Ltd.
Michael Zenou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
CONNECTING ARRANGEMENT
Publication number
20240155766
Publication date
May 9, 2024
ROBERT BOSCH GmbH
Guenter Gera
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEXIBLE WIRING BOARD AND LIGHT CONTROL UNIT
Publication number
20240155762
Publication date
May 9, 2024
TOPPAN INC.
Masaki TSUJI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD
Publication number
20240147632
Publication date
May 2, 2024
YAZAKI CORPORATION
Mitsuaki Maeda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE
Publication number
20240147621
Publication date
May 2, 2024
Hitachi Astemo, Ltd.
Narutoshi YAMADA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
Publication number
20240145351
Publication date
May 2, 2024
STMicroelectronics S.r.l
Matteo DE SANTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE STRUCTURE CONNECTED ON BASIS OF SOLDER BALL AND ELASTIC BODY
Publication number
20240147619
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Jongwan SHIM
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...
Publication number
20240147624
Publication date
May 2, 2024
Canon Kabushiki Kaisha
NORITAKE TSUBOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
Publication number
20240131633
Publication date
Apr 25, 2024
Sekisui Chemical Co., Ltd.
Hidefumi YASUI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
Publication number
20240136325
Publication date
Apr 25, 2024
NHK Spring Co., Ltd.
Ryo TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL
Publication number
20240138074
Publication date
Apr 25, 2024
International Business Machines Corporation
Theron Lee Lewis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240138063
Publication date
Apr 25, 2024
Unimicron Technology Corp.
Ping-Tsung Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuit Board and Manufacturing Method Thereof, and Terminal Device
Publication number
20240138056
Publication date
Apr 25, 2024
Honor Device Co., Ltd.
Junjie Yang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Sulfide Solid-State Battery, Printed Circuit Board with Sulfide Sol...
Publication number
20240120552
Publication date
Apr 11, 2024
Toyota Jidosha Kabushiki Kaisha
Shinji NAKANISHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD
Publication number
20240114620
Publication date
Apr 4, 2024
Samsung Electro-Mechanics Co., Ltd.
Seung Min LEE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PROTECTING METHOD FOR PREVENTING SOLDER CRACK FAILURE IN ELECTRONIC...
Publication number
20240114631
Publication date
Apr 4, 2024
SOLID STATE STORAGE TECHNOLOGY CORPORATION
Tsung-Lung LIN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
Publication number
20240107682
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Company Limited
Chao-Wei Chiu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
A CIRCUIT
Publication number
20240098906
Publication date
Mar 21, 2024
NXP B.V.
Xin Yang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SWITCHING MODULE, POWER CONVERSION DEVICE, AND MANUFACTURING METHOD...
Publication number
20240098926
Publication date
Mar 21, 2024
Kabushiki Kaisha Yaskawa Denki
Kenshiro MORISHITA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20240098907
Publication date
Mar 21, 2024
JCET STATS ChipPAC Korea Limited
HyoDong RYU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
Publication number
20240098912
Publication date
Mar 21, 2024
Samsung Electronics Co., Ltd.
Jinhwan JEON
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLEXIBLE CIRCUIT BOARD, DISPLAY PANEL AND METHOD FOR MANUFACTURING...
Publication number
20240090127
Publication date
Mar 14, 2024
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
Yonglin CHEN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MA...
Publication number
20240088001
Publication date
Mar 14, 2024
Advanced Semiconductor Engineering, Inc.
Cheng-Lin HO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING S...
Publication number
20240090125
Publication date
Mar 14, 2024
KIOXIA Corporation
Takashi YAMAMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR SHIELDING A PRINTED CIRCUIT BOARD FROM ELECTROMAGNETIC I...
Publication number
20240090122
Publication date
Mar 14, 2024
Skyworks Solutions, Inc.
Cesar Verdugo Muñoz
G01 - MEASURING TESTING
Information
Patent Application
LEADFRAME MOUNTING WITH LEAD INSERTION FOR LEAD WALL BONDING
Publication number
20240090130
Publication date
Mar 14, 2024
Semiconductor Components Industries, LLC
Chad CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Inductive Position Sensor for Electronic Throttle Control
Publication number
20240077335
Publication date
Mar 7, 2024
Integrated Device Technology, Inc.
Andreas Buchinger
B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information
Patent Application
SOLDER MATERIAL
Publication number
20240075559
Publication date
Mar 7, 2024
Fuji Electric Co., Ltd.
Hirohiko WATANABE
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
EXTENDED PAD AREA TO PREVENT PRINTED CIRCUIT BOARD DAMAGE
Publication number
20240074067
Publication date
Feb 29, 2024
KOLLMORGEN CORPORATION
Jeffery Todd BREWSTER
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
Publication number
20240074048
Publication date
Feb 29, 2024
Micron Technology, Inc.
Ling Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PCB PRODUCTION BY LASER SYSTEMS
Publication number
20240064897
Publication date
Feb 22, 2024
IO Tech Group Ltd.
Michael Zenou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR