by soldering

Industry

CPC
H05K3/34

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/34by soldering

Industries

Patents Grantslast 30 patents

Information Patent Grant
Plug-in connector device and method for producing a plug-in connect...
- Patent number 12,170,415
- Issue date Dec 17, 2024
- Vitesco Technologies GmbH
- Gregory Drew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component, multi-layer ceramic elect...
- Patent number 12,170,174
- Issue date Dec 17, 2024
- Taiyo Yuden Co., Ltd.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 12,165,950
- Issue date Dec 10, 2024
- Vitesco Technologies GmbH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder mask arrangement for a component carrier
- Patent number 12,167,543
- Issue date Dec 10, 2024
- AT&S(Chongqing) Company Limited
- Ismadi Bin Ismail
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode for low temperature applications
- Patent number 12,159,961
- Issue date Dec 3, 2024
- Azenta Life Sciences, Inc.
- Aarash Navabi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance semiconductor device
- Patent number 12,159,817
- Issue date Dec 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency filter
- Patent number 12,160,217
- Issue date Dec 3, 2024
- Mitsubishi Electric Corporation
- Motomi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip having elongated...
- Patent number 12,154,847
- Issue date Nov 26, 2024
- Murata Manufacturing Co., Ltd.
- Mizuho Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and configuration for stacking multiple printed circuit boards
- Patent number 12,156,333
- Issue date Nov 26, 2024
- Mellanox Technologies, Ltd.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, electronic device, and production method for circuit...
- Patent number 12,156,346
- Issue date Nov 26, 2024
- HONOR DEVICE CO., LTD.
- Leiwen Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic compatibility contact between metal castings and pr...
- Patent number 12,150,251
- Issue date Nov 19, 2024
- Harman International Industries, Incorporated
- Jianing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module having a soldering portion coupling a driving device...
- Patent number 12,149,811
- Issue date Nov 19, 2024
- LG Innotek Co., Ltd
- Jong Ho Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electromagnetic compatibility contact between metal castings and pr...
- Patent number 12,150,252
- Issue date Nov 19, 2024
- Harman International Industries, Incorporated
- Jianing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for driving a compressor and processes for mounting the device
- Patent number 12,138,989
- Issue date Nov 12, 2024
- HANON SYSTEMS
- Hendrik Varain
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic device including coin-cell battery
- Patent number 12,144,123
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Kiwook Han
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Antenna-in-package devices and methods of making
- Patent number 12,136,759
- Issue date Nov 5, 2024
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding methods for fine-pitch components and corresponding compo...
- Patent number 12,136,580
- Issue date Nov 5, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure and fabrication method thereof
- Patent number 12,133,337
- Issue date Oct 29, 2024
- INNOLUX CORPORATION
- Yi Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die, probe and ultrasound system
- Patent number 12,128,443
- Issue date Oct 29, 2024
- Koninklijke Philips N.V.
- Wojtek Sudol
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Maintaining the shape of a circuit board
- Patent number 12,127,334
- Issue date Oct 22, 2024
- Dis Tech America, LLC
- Heng-Kit Too
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Barrier for preventing SMD components from drifting
- Patent number 12,127,350
- Issue date Oct 22, 2024
- ZKW GROUP GMBH
- Christoph Haiden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,120,818
- Issue date Oct 15, 2024
- LG Innotek Co., Ltd
- Myung Gu Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing textile with conductive yarns and integrate...
- Patent number 12,120,823
- Issue date Oct 15, 2024
- Myant Inc.
- Tony Chahine
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Grant
Chip package positioning and fixing structure
- Patent number 12,119,287
- Issue date Oct 15, 2024
- Hitachi Astemo, Ltd.
- Binti Haridan Fatin Farhanah
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 12,112,891
- Issue date Oct 8, 2024
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and electronic device
- Patent number 12,114,418
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Yongyao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronic component, substrate and an optical s...
- Patent number 12,114,434
- Issue date Oct 8, 2024
- Canon Kabushiki Kaisha
- Shunsuke Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount technology method and magnetic carrier system
- Patent number 12,114,435
- Issue date Oct 8, 2024
- SanDisk Technologies, Inc.
- Virgil Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for creating orthogonal solder interconnects
- Patent number 12,108,542
- Issue date Oct 1, 2024
- Raytheon Company
- Justin A. Kasemodel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...
- Publication number 20240422904
- Publication date Dec 19, 2024
- Chongqing BOE Electronic Technology Co., Ltd.
- Jie ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY PACK AND METHOD OF MANUFACTURE
- Publication number 20240421365
- Publication date Dec 19, 2024
- Black & Decker Inc.
- Moriah Counts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT ELECTRICAL DEVICES AND METHODS
- Publication number 20240412937
- Publication date Dec 12, 2024
- BOURNS, INC
- Kelly C. CASEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240414847
- Publication date Dec 12, 2024
- DENSO CORPORATION
- Takeshi KAZAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20240414842
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240414843
- Publication date Dec 12, 2024
- GOERTEK INC.
- Katsumi SAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240414850
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS
- Publication number 20240414851
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...
- Publication number 20240407096
- Publication date Dec 5, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Ihab KHOURY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240397633
- Publication date Nov 28, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-HSIANG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240389241
- Publication date Nov 21, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Min-Geun JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20240383035
- Publication date Nov 21, 2024
- Resonac Corporation
- Yoshinori EJIRI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20240389239
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240381530
- Publication date Nov 14, 2024
- LG Innotek Co., Ltd.
- Se Woong NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ALIGNING CONTACT SURFACES OF AN ELECTRICAL AND/OR ELECTR...
- Publication number 20240381542
- Publication date Nov 14, 2024
- ROBERT BOSCH GmbH
- Jivan Kapoor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC ASSEMBLY COMPRISING TWO PRINTED CIRCUIT BOARDS
- Publication number 20240381534
- Publication date Nov 14, 2024
- Endress+Hauser SE+Co. KG
- Romuald Girardey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR ROUTABLE CIRCUIT BOARD CONDUCTOR BLOCKS
- Publication number 20240381541
- Publication date Nov 14, 2024
- Microsoft Technology Licensing, LLC
- Jason HARRIGAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240373545
- Publication date Nov 7, 2024
- Siliconware Precision Industries Co., Ltd.
- Hsiang-Hua HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
- Publication number 20240373548
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...
- Publication number 20240365464
- Publication date Oct 31, 2024
- Canon Kabushiki Kaisha
- HIROYUKI YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MOUNTING ELECTRONIC DEVICES AND PARTIALLY SHIELDED BOARD...
- Publication number 20240365523
- Publication date Oct 31, 2024
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Sei UEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THIN SEMICOND...
- Publication number 20240355719
- Publication date Oct 24, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly
- Publication number 20240347939
- Publication date Oct 17, 2024
- TE Connectivity Solutions GMBH
- Wei (David) Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY HAVING A POWER SEMICONDUCTOR COMPONENT BETWEEN...
- Publication number 20240349429
- Publication date Oct 17, 2024
- ROBERT BOSCH GmbH
- Arne Stephen Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20240347414
- Publication date Oct 17, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLOW FURNACE
- Publication number 20240344771
- Publication date Oct 17, 2024
- Illinois Tool Works Inc.
- Yuwei WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND A...
- Publication number 20240341040
- Publication date Oct 10, 2024
- Dell Products L.P.
- Subramanian Vasudevan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

by soldering

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plug-in connector device and method for producing a plug-in connect...

Multi-layer ceramic electronic component, multi-layer ceramic elect...

Power semiconductor component and method for producing a power semi...

Solder mask arrangement for a component carrier

Light emitting diode for low temperature applications

High performance semiconductor device

High frequency filter

Semiconductor device including semiconductor chip having elongated...

Method and configuration for stacking multiple printed circuit boards

Circuit board, electronic device, and production method for circuit...

Electromagnetic compatibility contact between metal castings and pr...

Camera module having a soldering portion coupling a driving device...

Electromagnetic compatibility contact between metal castings and pr...

Device for driving a compressor and processes for mounting the device

Electronic device including coin-cell battery

Antenna-in-package devices and methods of making

Embedding methods for fine-pitch components and corresponding compo...

Circuit structure and fabrication method thereof

Bridge interconnection with layered interconnect structures

IC die, probe and ultrasound system

Maintaining the shape of a circuit board

Barrier for preventing SMD components from drifting

Printed circuit board

Method of manufacturing textile with conductive yarns and integrate...

Chip package positioning and fixing structure

Multilayer capacitor and circuit board containing the same

Electronic module and electronic device

Method of mounting electronic component, substrate and an optical s...

Surface mount technology method and magnetic carrier system

System and method for creating orthogonal solder interconnects

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...

BATTERY PACK AND METHOD OF MANUFACTURE

SURFACE MOUNT ELECTRICAL DEVICES AND METHODS

MOUNT BOARD AND METHOD OF MANUFACTURING THE SAME

FLEXIBLE CIRCUIT BOARD

CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS

ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...

SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

METHOD FOR ALIGNING CONTACT SURFACES OF AN ELECTRICAL AND/OR ELECTR...

ELECTRIC ASSEMBLY COMPRISING TWO PRINTED CIRCUIT BOARDS

MODULAR ROUTABLE CIRCUIT BOARD CONDUCTOR BLOCKS

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Method for Soldering an Electronic Component to a Circuit Board by...

Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...

CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...

Lead-Free Solder Ball

METHOD OF MOUNTING ELECTRONIC DEVICES AND PARTIALLY SHIELDED BOARD...

THIN SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THIN SEMICOND...

Electronic Assembly

ELECTRONIC ASSEMBLY HAVING A POWER SEMICONDUCTOR COMPONENT BETWEEN...

Methods And Heat Distribution Devices For Thermal Management Of Chi...

REFLOW FURNACE

PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND A...