by soldering

Industry

CPC
H05K3/34

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/34by soldering

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-pitch ball grid array
- Patent number 12,288,741
- Issue date Apr 29, 2025
- Juniper Networks, Inc.
- Granthana Kattehalli Rangaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communication device manufacturing system
- Patent number 12,288,115
- Issue date Apr 29, 2025
- Murata Manufacturing Co., Ltd.
- Yoshinori Yamawaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low melting-point bonding member, method for producing same, semico...
- Patent number 12,285,823
- Issue date Apr 29, 2025
- SHINRYO CORPORATION
- Hirotoshi Nishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for shielding a printed circuit board from electromagnetic i...
- Patent number 12,289,822
- Issue date Apr 29, 2025
- Skyworks Solutions, Inc.
- Cesar Verdugo Muñoz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Conformal coating blockage by surface-mount technology solder features
- Patent number 12,284,769
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- David W. Ihms
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module with housed power semiconductors for controllable elec...
- Patent number 12,284,749
- Issue date Apr 22, 2025
- ZF Friedrichshafen AG
- Thomas Maier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,278,160
- Issue date Apr 15, 2025
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a circuit board arrangement
- Patent number 12,279,380
- Issue date Apr 15, 2025
- Continental Automotive GmbH
- Rafael Del Rey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency line structure with lead pin-connected substrates
- Patent number 12,278,413
- Issue date Apr 15, 2025
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flux resin composition, electronic component, method for manufactur...
- Patent number 12,269,945
- Issue date Apr 8, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shohei Sanada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with mold adhesion boundary for die attach pad
- Patent number 12,274,006
- Issue date Apr 8, 2025
- Skyworks Solutions, Inc.
- Andrew Christopher Laib
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, power conversion apparatus, moving body, and...
- Patent number 12,267,955
- Issue date Apr 1, 2025
- Mitsubishi Electric Corporation
- Takeshi Higashihata
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 12,267,964
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 12,262,481
- Issue date Mar 25, 2025
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating device and component mounting machine
- Patent number 12,262,480
- Issue date Mar 25, 2025
- FUJI CORPORATION
- Jinya Imura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting substrate, electronic component mount...
- Patent number 12,256,491
- Issue date Mar 18, 2025
- Sony Group Corporation
- Koji Aoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High current surface mount toroid inductor
- Patent number 12,255,002
- Issue date Mar 18, 2025
- Steering Solutions IP Holding Corporation
- Michael C. Hallman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board edge electrical contact structures
- Patent number 12,250,770
- Issue date Mar 11, 2025
- Nokia Solutions and Networks Oy
- David North
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,243,802
- Issue date Mar 4, 2025
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 12,238,868
- Issue date Feb 25, 2025
- JABIL INC.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module of an inverter and method for mounting thereof
- Patent number 12,235,010
- Issue date Feb 25, 2025
- HANON SYSTEMS
- Bernd Guntermann
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
PCB production by laser systems
- Patent number 12,238,862
- Issue date Feb 25, 2025
- IO Tech Group Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Squeegee holder with an integrated clamp bar
- Patent number 12,226,062
- Issue date Feb 18, 2025
- Transition Automation, Inc.
- Mark J. Curtin
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Printed circuit board including conductive pad and electric device...
- Patent number 12,232,259
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Bongsoo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method of providing a tray for holding an op...
- Patent number 12,228,771
- Issue date Feb 18, 2025
- JABIL INC.
- Wenlu Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabric with embedded electrical components
- Patent number 12,232,270
- Issue date Feb 18, 2025
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING
Information Patent Grant
Power semiconductor device and method for manufacturing power semic...
- Patent number 12,232,300
- Issue date Feb 18, 2025
- Mitsubishi Electric Corporation
- Noriyuki Besshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly, display assembly and assembling method ther...
- Patent number 12,230,897
- Issue date Feb 18, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Fengxian Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste and electronic device
- Patent number 12,224,081
- Issue date Feb 11, 2025
- BEIJING DREAM INK TECHNOLOGIES CO., LTD.
- Zhongwei Ren
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...
- Publication number 20250151191
- Publication date May 8, 2025
- Dell Products L.P.
- Earl BOONE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATED STANDOFF FEATURE FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...
- Publication number 20250151194
- Publication date May 8, 2025
- Dell Products L.P.
- Steven R. ETHRIDGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CREATING A SOLDER BARRIER BY CHANGING A MATERIAL PROPERTY OF A TRAC...
- Publication number 20250151206
- Publication date May 8, 2025
- Sandsik Technologies, Inc.
- John Patrick Burke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM-TYPE CIRCUIT AND METHOD OF CONNECTING PRINTED CIRCUIT BOARDS V...
- Publication number 20250142726
- Publication date May 1, 2025
- DENSO WAVE INCORPORATED
- Natsuki SUGIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD OF PRINTING SOLDER ON PRINTED CIRCUIT BOARD FO...
- Publication number 20250142735
- Publication date May 1, 2025
- Xilinx, Inc.
- Gamal REFAI-AHMED
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERIN...
- Publication number 20250133663
- Publication date Apr 24, 2025
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERIN...
- Publication number 20250133664
- Publication date Apr 24, 2025
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING SYSTEM AND METHOD OF USE
- Publication number 20250128344
- Publication date Apr 24, 2025
- Illinois Tool Works Inc.
- Gerardus Johannes Adrianus Maria Diepstraten
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MASKING METHOD AND MASKED PRODUCT
- Publication number 20250133661
- Publication date Apr 24, 2025
- P2i Ltd.
- Graham HUBBARD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250133662
- Publication date Apr 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Tun-Ching PI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SIGNAL TRACE TRANSITION FOR HIGH DATA RATE APPLICATIONS
- Publication number 20250120020
- Publication date Apr 10, 2025
- Marvell Asia Pte Ltd.
- Fei Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP RESISTOR
- Publication number 20250118464
- Publication date Apr 10, 2025
- KOA Corporation
- Taro KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID TRANSFER DEVICE AND METHOD FOR FORMING LIQUID FILM
- Publication number 20250113444
- Publication date Apr 3, 2025
- FUJI CORPORATION
- Hiroyasu OHASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGIES FOR REDUCING THE IMPACT OF RADIOFREQUENCY INTERFERENCE...
- Publication number 20250113430
- Publication date Apr 3, 2025
- Intel Corporation
- Venkata Mahesh Gunnam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD
- Publication number 20250113428
- Publication date Apr 3, 2025
- Intel Corporation
- Min Suet Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA-INTEGRATED RADIO PRODUCT AND METHOD FOR PRODUCING THE SAME
- Publication number 20250106999
- Publication date Mar 27, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Xuejun Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250107008
- Publication date Mar 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Hyun Hu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD AND ELECTRONIC DEVICE
- Publication number 20250098076
- Publication date Mar 20, 2025
- Kabushiki Kaisha Toshiba
- Kakeru YAMAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL ATTACH TOOL
- Publication number 20250089179
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Hyeon Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER FOR TROUBLESHOOTING A BALL GRID ARRAY (BGA) DEVICE AND C...
- Publication number 20250081357
- Publication date Mar 6, 2025
- Western Digital Technologies, Inc.
- Nadav Tsur
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMART CONNECTOR AND METHOD OF MANUFACTURING SAME USING AN APPLICATI...
- Publication number 20250070520
- Publication date Feb 27, 2025
- Molex, LLC
- Victor Zaderej
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STEP-SOLDERING
- Publication number 20250065449
- Publication date Feb 27, 2025
- SENJU METAL INDUSTRY CO., LTD.
- Takashi SAITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20250071905
- Publication date Feb 27, 2025
- Hitachi, Ltd
- Masako KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20250071909
- Publication date Feb 27, 2025
- HAESUNG DS CO., LTD.
- Soon-Chul KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-ATTACHED FPC MANUFACTURING METHOD
- Publication number 20250071910
- Publication date Feb 27, 2025
- YAZAKI CORPORATION
- Hidehiko SHIMIZU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE...
- Publication number 20250062592
- Publication date Feb 20, 2025
- PRIMAX ELECTRONICS LTD.
- CHING-HUI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD
- Publication number 20250063665
- Publication date Feb 20, 2025
- TDK Corporation
- Yukari WADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Mask Arrangement for a Component Carrier
- Publication number 20250056735
- Publication date Feb 13, 2025
- AT&S (Chongqing) Company Limited
- Ismadi Bin Ismail
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
- Publication number 20250056715
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Chao WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by soldering

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-pitch ball grid array

Wireless communication device manufacturing system

Low melting-point bonding member, method for producing same, semico...

Method for shielding a printed circuit board from electromagnetic i...

Conformal coating blockage by surface-mount technology solder features

Power module with housed power semiconductors for controllable elec...

Methods and heat distribution devices for thermal management of chi...

Method for producing a circuit board arrangement

High-frequency line structure with lead pin-connected substrates

Flux resin composition, electronic component, method for manufactur...

Printed circuit board with mold adhesion boundary for die attach pad

Semiconductor device, power conversion apparatus, moving body, and...

Electronic component module and method for manufacturing electronic...

Electrical devices with electrodes on softening polymers and method...

Coating device and component mounting machine

Electronic component mounting substrate, electronic component mount...

High current surface mount toroid inductor

Board edge electrical contact structures

Methods and heat distribution devices for thermal management of chi...

On-demand method of making PCB pallets using additive manufacturing

Integrated circuit structure

Electronic module of an inverter and method for mounting thereof

PCB production by laser systems

Squeegee holder with an integrated clamp bar

Printed circuit board including conductive pad and electric device...

Apparatus, system, and method of providing a tray for holding an op...

Fabric with embedded electrical components

Power semiconductor device and method for manufacturing power semic...

Circuit board assembly, display assembly and assembling method ther...

Conductive paste and electronic device

Patents Applicationslast 30 patents

DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...

PLATED STANDOFF FEATURE FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...

CREATING A SOLDER BARRIER BY CHANGING A MATERIAL PROPERTY OF A TRAC...

FILM-TYPE CIRCUIT AND METHOD OF CONNECTING PRINTED CIRCUIT BOARDS V...

APPARATUS AND METHOD OF PRINTING SOLDER ON PRINTED CIRCUIT BOARD FO...

SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERIN...

SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERIN...

SOLDERING SYSTEM AND METHOD OF USE

MASKING METHOD AND MASKED PRODUCT

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SIGNAL TRACE TRANSITION FOR HIGH DATA RATE APPLICATIONS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

CHIP RESISTOR

LIQUID TRANSFER DEVICE AND METHOD FOR FORMING LIQUID FILM

TECHNOLOGIES FOR REDUCING THE IMPACT OF RADIOFREQUENCY INTERFERENCE...

TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD

ANTENNA-INTEGRATED RADIO PRODUCT AND METHOD FOR PRODUCING THE SAME

PRINTED CIRCUIT BOARD

BOARD AND ELECTRONIC DEVICE

BALL ATTACH TOOL

INTERPOSER FOR TROUBLESHOOTING A BALL GRID ARRAY (BGA) DEVICE AND C...

SMART CONNECTOR AND METHOD OF MANUFACTURING SAME USING AN APPLICATI...

METHOD FOR STEP-SOLDERING

CONTROL BOARD AND METHOD FOR MANUFACTURING SAME

METHOD OF MANUFACTURING CIRCUIT BOARD

COMPONENT-ATTACHED FPC MANUFACTURING METHOD

OPTICAL MODULE PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD

Solder Mask Arrangement for a Component Carrier

FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME