by the use of a coupling agent

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CPC
H05K3/389

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/389by the use of a coupling agent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for increasing adhesion strength between a metal and an orga...
- Patent number 11,991,835
- Issue date May 21, 2024
- Atotech Deutschland GmbH
- Felix Tang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of improving the adhesion strength of metal-organic interfac...
- Patent number 11,919,036
- Issue date Mar 5, 2024
- YIELD ENGINEERING SYSTEMS, INC.
- Kenneth Sautter
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,882,656
- Issue date Jan 23, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of directly patterning stretchable substrate and stretchable...
- Patent number 11,839,033
- Issue date Dec 5, 2023
- Korea University Research and Business Foundation
- Soong Ju Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Increasing adhesion of metal-organic interfaces by silane vapor tre...
- Patent number 11,818,849
- Issue date Nov 14, 2023
- YIELD ENGINEERING SYSTEMS, INC.
- Kenneth Sautter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,792,929
- Issue date Oct 17, 2023
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated copper foil, and copper-clad laminate plate, resin-...
- Patent number 11,770,904
- Issue date Sep 26, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Kitai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded-type transparent electrode substrate and method for manufa...
- Patent number 11,716,818
- Issue date Aug 1, 2023
- LG Chem, Ltd.
- Yong Goo Son
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method of manufacturing the same
- Patent number 11,690,178
- Issue date Jun 27, 2023
- Toppan Printing Co., Ltd.
- Hiroshi Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,617,262
- Issue date Mar 28, 2023
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 11,375,615
- Issue date Jun 28, 2022
- Sumitomo Electric Industries, Ltd.
- Yuichiro Yamanaka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fluororesin base material, printed wiring board, and circuit module
- Patent number 11,364,714
- Issue date Jun 21, 2022
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Satoshi Kiya
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electrodeposited copper foil and electrode, and lithium-ion seconda...
- Patent number 11,362,337
- Issue date Jun 14, 2022
- Chang Chun Petrochemical Co., Ltd.
- Huei-Fang Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminate and method for manufacturing the same
- Patent number 11,317,507
- Issue date Apr 26, 2022
- Arisawa Mfg. Co., Ltd.
- Naoki Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrodeposited copper foil, current collector, electrode, and lit...
- Patent number 11,283,080
- Issue date Mar 22, 2022
- Chang Chun Petrochemical Co., Ltd.
- Huei-Fang Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Embedded-type transparent electrode substrate and method for manufa...
- Patent number 11,259,417
- Issue date Feb 22, 2022
- LG Chem, Ltd.
- Yong Goo Son
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treated copper foil
- Patent number 11,145,867
- Issue date Oct 12, 2021
- Chang Chun Petrochemical Co., Ltd.
- Chien-Ming Lai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Coating metal foil with N-heterocyclic carbene compounds containing...
- Patent number 11,102,892
- Issue date Aug 24, 2021
- International Business Machines Corporation
- Dylan J. Boday
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper or copper alloy article comprising surface-modified polyeste...
- Patent number 11,053,593
- Issue date Jul 6, 2021
- ADVANCED TECHNOLOGIES, INC.
- Kinji Hirai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,993,331
- Issue date Apr 27, 2021
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treated copper foil, surface treated copper foil with resin...
- Patent number 10,925,171
- Issue date Feb 16, 2021
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface treated copper foil, surface treated copper foil with resin...
- Patent number 10,925,170
- Issue date Feb 16, 2021
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-clad laminate, method for producing same, metal foil with res...
- Patent number 10,897,818
- Issue date Jan 19, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Kitai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Prepreg, printed circuit board, semiconductor package, and method f...
- Patent number 10,856,423
- Issue date Dec 1, 2020
- SHOWA DENKO MATERIALS CO., LTD.
- Yuji Tosaka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electrolytic copper foil for printed circuit board with low transmi...
- Patent number 10,765,010
- Issue date Sep 1, 2020
- Chang Chun Petrochemical Co., Ltd.
- Jian-Ming Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive-attached copper foil, copper-clad laminate, and wiring sub...
- Patent number 10,660,213
- Issue date May 19, 2020
- Kyocera Corporation
- Kazumichi Uchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-planar on-package via capacitor
- Patent number 10,595,410
- Issue date Mar 17, 2020
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating metal foil with n-heterocyclic carbene compounds containing...
- Patent number 10,588,222
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Dylan J. Boday
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electroconductive paste, electronic substrate, and method for manuf...
- Patent number 10,575,412
- Issue date Feb 25, 2020
- Mitsuboshi Belting Ltd.
- Hiroji Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional wiring board production method, three-dimensional...
- Patent number 10,537,021
- Issue date Jan 14, 2020
- Meiko Electronics Co., Ltd.
- Shigeru Michiwaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH IMPROVED INTERFACIAL ADHESION OF METAL-ORGAN...
- Publication number 20240357749
- Publication date Oct 24, 2024
- Yield Engineering Systems, Inc.
- Kenneth Sautter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR...
- Publication number 20240179851
- Publication date May 30, 2024
- Atotech Deutschland GmbH & Co. KG
- Valentina BELOVA-MAGRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20230422393
- Publication date Dec 28, 2023
- KYOCERA CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE COPPER COMPONENTS
- Publication number 20230142375
- Publication date May 11, 2023
- Namics Corporation
- Naoki OBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230069980
- Publication date Mar 9, 2023
- IBIDEN CO., LTD.
- Tomoyuki IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...
- Publication number 20230047699
- Publication date Feb 16, 2023
- Hayato SAWAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20220418098
- Publication date Dec 29, 2022
- KYOCERA CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF DIRECTLY PATTERNING STRETCHABLE SUBSTRATE AND STRETCHABLE...
- Publication number 20220386477
- Publication date Dec 1, 2022
- Korea University Research and Business Foundation
- Soong Ju OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220338347
- Publication date Oct 20, 2022
- IBIDEN CO., LTD.
- Takema ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220248533
- Publication date Aug 4, 2022
- IBIDEN CO., LTD.
- Takema ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220248531
- Publication date Aug 4, 2022
- IBIDEN CO., LTD.
- Takema ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INCREASING ADHESION STRENGTH BETWEEN A METAL AND AN ORGA...
- Publication number 20220151080
- Publication date May 12, 2022
- Atotech Deutschland GmbH
- Felix TANG
- B32 - LAYERED PRODUCTS
Information Patent Application
EMBEDDED-TYPE TRANSPARENT ELECTRODE SUBSTRATE AND METHOD FOR MANUFA...
- Publication number 20220132675
- Publication date Apr 28, 2022
- LG CHEM, LTD.
- Yong Goo SON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE PLATE, RESIN-...
- Publication number 20220087032
- Publication date Mar 17, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki KITAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRODEPOSITED COPPER FOIL AND ELECTRODE, AND LITHIUM-ION SECONDA...
- Publication number 20210305580
- Publication date Sep 30, 2021
- CHANG CHUN PETROCHEMICAL CO., LTD.
- Huei-Fang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER OR COPPER ALLOY ARTICLE COMPRISING SURFACE-MODIFIED POLYESTE...
- Publication number 20210285108
- Publication date Sep 16, 2021
- ADVANCED TECHNOLOGIES, INC.
- Kinji HIRAI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRODEPOSITED COPPER FOIL, CURRENT COLLECTOR, ELECTRODE, AND LIT...
- Publication number 20210242467
- Publication date Aug 5, 2021
- CHANG CHUN PETROCHEMICAL CO., LTD.
- Huei-Fang HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED-TYPE TRANSPARENT ELECTRODE SUBSTRATE AND METHOD FOR MANUFA...
- Publication number 20210195760
- Publication date Jun 24, 2021
- LG CHEM, LTD.
- Yong Goo SON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, METHOD...
- Publication number 20210007227
- Publication date Jan 7, 2021
- Sumitomo Electric Industries, Ltd.
- Kazuhiro MIYATA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LAMINATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200413535
- Publication date Dec 31, 2020
- Arisawa Mfg. Co., Ltd.
- Naoki Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLYTIC COPPER FOIL FOR PRINTED CIRCUIT BOARD WITH LOW TRANSMI...
- Publication number 20200253061
- Publication date Aug 6, 2020
- CHANG CHUN PETROCHEMICAL CO., LTD.
- Jian-Ming Huang
- B32 - LAYERED PRODUCTS
Information Patent Application
SURFACE TREATED COPPER FOIL
- Publication number 20200248330
- Publication date Aug 6, 2020
- CHANG CHUN PETROCHEMICAL CO., LTD.
- Chien-Ming LAI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COATING METAL FOIL WITH N-HETEROCYCLIC CARBENE COMPOUNDS CONTAINING...
- Publication number 20200053886
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Dylan J. Boday
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ADHESIVE-ATTACHED COPPER FOIL, COPPER-CLAD LAMINATE, AND WIRING SUB...
- Publication number 20200029442
- Publication date Jan 23, 2020
- Kyocera Corporation
- Kazumichi UCHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electroconductive Paste, Electronic Substrate, and Method for Manuf...
- Publication number 20190132961
- Publication date May 2, 2019
- MITSUBOSHI BELTING LTD.
- Hiroji Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL...
- Publication number 20190124763
- Publication date Apr 25, 2019
- MEIKO ELECTRONICS CO., LTD.
- Shigeru MICHIWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD F...
- Publication number 20190021175
- Publication date Jan 17, 2019
- Hitachi Chemical Company, Ltd.
- Yuji TOSAKA
- B32 - LAYERED PRODUCTS
Information Patent Application
HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS
- Publication number 20180332720
- Publication date Nov 15, 2018
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
- Publication number 20180324956
- Publication date Nov 8, 2018
- Elite Electronic Material (Zhongshan) Co., Ltd.
- Xiang XIONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...
- Publication number 20180279482
- Publication date Sep 27, 2018
- JX NIPPON MINING & METALS CORPORATION
- Masafumi ISHII
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

by the use of a coupling agent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for increasing adhesion strength between a metal and an orga...

Method of improving the adhesion strength of metal-organic interfac...

Wiring substrate and method for manufacturing wiring substrate

Method of directly patterning stretchable substrate and stretchable...

Increasing adhesion of metal-organic interfaces by silane vapor tre...

Wiring substrate and method for manufacturing wiring substrate

Surface-treated copper foil, and copper-clad laminate plate, resin-...

Embedded-type transparent electrode substrate and method for manufa...

Multilayer printed wiring board and method of manufacturing the same

Wiring substrate and method for manufacturing wiring substrate

Substrate for printed circuit board, printed circuit board, and met...

Fluororesin base material, printed wiring board, and circuit module

Electrodeposited copper foil and electrode, and lithium-ion seconda...

Laminate and method for manufacturing the same

Electrodeposited copper foil, current collector, electrode, and lit...

Embedded-type transparent electrode substrate and method for manufa...

Surface treated copper foil

Coating metal foil with N-heterocyclic carbene compounds containing...

Copper or copper alloy article comprising surface-modified polyeste...

High-speed interconnects for printed circuit boards

Surface treated copper foil, surface treated copper foil with resin...

Surface treated copper foil, surface treated copper foil with resin...

Metal-clad laminate, method for producing same, metal foil with res...

Prepreg, printed circuit board, semiconductor package, and method f...

Electrolytic copper foil for printed circuit board with low transmi...

Adhesive-attached copper foil, copper-clad laminate, and wiring sub...

Non-planar on-package via capacitor

Coating metal foil with n-heterocyclic carbene compounds containing...

Electroconductive paste, electronic substrate, and method for manuf...

Three-dimensional wiring board production method, three-dimensional...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH IMPROVED INTERFACIAL ADHESION OF METAL-ORGAN...

MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR...

WIRING BOARD

COMPOSITE COPPER COMPONENTS

METHOD FOR MANUFACTURING WIRING SUBSTRATE

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...

WIRING BOARD

METHOD OF DIRECTLY PATTERNING STRETCHABLE SUBSTRATE AND STRETCHABLE...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

METHOD FOR INCREASING ADHESION STRENGTH BETWEEN A METAL AND AN ORGA...

EMBEDDED-TYPE TRANSPARENT ELECTRODE SUBSTRATE AND METHOD FOR MANUFA...

SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE PLATE, RESIN-...

ELECTRODEPOSITED COPPER FOIL AND ELECTRODE, AND LITHIUM-ION SECONDA...

COPPER OR COPPER ALLOY ARTICLE COMPRISING SURFACE-MODIFIED POLYESTE...

ELECTRODEPOSITED COPPER FOIL, CURRENT COLLECTOR, ELECTRODE, AND LIT...

EMBEDDED-TYPE TRANSPARENT ELECTRODE SUBSTRATE AND METHOD FOR MANUFA...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, METHOD...

LAMINATE AND METHOD FOR MANUFACTURING THE SAME

ELECTROLYTIC COPPER FOIL FOR PRINTED CIRCUIT BOARD WITH LOW TRANSMI...

SURFACE TREATED COPPER FOIL

COATING METAL FOIL WITH N-HETEROCYCLIC CARBENE COMPOUNDS CONTAINING...

ADHESIVE-ATTACHED COPPER FOIL, COPPER-CLAD LAMINATE, AND WIRING SUB...

Electroconductive Paste, Electronic Substrate, and Method for Manuf...

THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL...

PREPREG, PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD F...

HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...