by ultrasonic vibrations

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H01L2224/78343

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78343by ultrasonic vibrations

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of calibrating an ultrasonic characteristic on a wire bondi...
- Patent number 12,113,043
- Issue date Oct 8, 2024
- Kulicke and Soffa Industries, Inc.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming wire interconnect structures and related wire bo...
- Patent number 12,057,431
- Issue date Aug 6, 2024
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-segment wire-bond
- Patent number 11,869,868
- Issue date Jan 9, 2024
- Semiconductor Components Industries, LLC
- Elmer Cunanan Bayron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wedge tool, bonding device, and bonding inspection method
- Patent number 11,756,919
- Issue date Sep 12, 2023
- Mitsubishi Electric Corporation
- Daisuke Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for calibrating an ultrasonic bonding machine
- Patent number 11,646,291
- Issue date May 9, 2023
- Infineon Technologies AG
- Florian Eacock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-segment wire-bond
- Patent number 11,515,284
- Issue date Nov 29, 2022
- Semiconductor Components Industries, LLC
- Elmer Cunanan Bayron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wedge bonding tools, wedge bonding systems, and related methods
- Patent number 10,987,753
- Issue date Apr 27, 2021
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wedge bonding tools, wedge bonding systems, and related methods
- Patent number 10,449,627
- Issue date Oct 22, 2019
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wire bonding structure, wire bonding struc...
- Patent number 10,115,699
- Issue date Oct 30, 2018
- Rohm Co., Ltd.
- Kazuya Ikoma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire-bonding apparatus and method of manufacturing semiconductor de...
- Patent number 9,793,236
- Issue date Oct 17, 2017
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire-bonding apparatus and method of wire bonding
- Patent number 9,457,421
- Issue date Oct 4, 2016
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 9,230,937
- Issue date Jan 5, 2016
- Renesas Electronics Corporation
- Kaori Sumitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding systems and methods of using the same
- Patent number 8,746,537
- Issue date Jun 10, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding systems and methods of using the same
- Patent number 8,584,922
- Issue date Nov 19, 2013
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Ultrasonic bonding systems and methods of using the same
- Patent number 8,511,536
- Issue date Aug 20, 2013
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Wire bonding apparatus
- Patent number 4,347,964
- Issue date Sep 7, 1982
- Hitachi, Ltd.
- Nobuhiro Takasugi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
- Publication number 20240404986
- Publication date Dec 5, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20240363583
- Publication date Oct 31, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICO...
- Publication number 20240079375
- Publication date Mar 7, 2024
- Fuji Electric Co., Ltd.
- Hiroaki HOKAZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
- Publication number 20230154888
- Publication date May 18, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-SEGMENT WIRE-BOND
- Publication number 20230098210
- Publication date Mar 30, 2023
- Semiconductor Components Industries, LLC
- Elmer Cunanan BAYRON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DETERMINING SHEAR STRENGTH OF BONDED FREE AIR BALLS ON W...
- Publication number 20220270937
- Publication date Aug 25, 2022
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20220199570
- Publication date Jun 23, 2022
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SEGMENT WIRE-BOND
- Publication number 20220020720
- Publication date Jan 20, 2022
- Semiconductor Components Industries, LLC
- Elmer Cunanan BAYRON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Device
- Publication number 20210005571
- Publication date Jan 7, 2021
- F&S Bondtec Semiconductor GmbH
- Siegfried Seidl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Calibrating an Ultrasonic Bonding Machine
- Publication number 20200043883
- Publication date Feb 6, 2020
- Florian Eacock
- G05 - CONTROLLING REGULATING
Information Patent Application
Arrangements and Method for Providing a Bond Connection
- Publication number 20190312008
- Publication date Oct 10, 2019
- INFINEON TECHNOLOGIES AG
- Florian Eacock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLEANING SYSTEMS FOR WIRE BONDING TOOLS, WIRE BONDING MACHINES INCL...
- Publication number 20190237427
- Publication date Aug 1, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Peter Klaerner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Producing Wire Bond Connection And Arrangement For Imple...
- Publication number 20180218996
- Publication date Aug 2, 2018
- F&K Delvotec Bondtechnik GmbH
- Franz Schlicht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRE BONDING STRUCTURE, WIRE BONDING STRUC...
- Publication number 20170062381
- Publication date Mar 2, 2017
- Kazuya IKOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING TOOL CLEANING METHOD
- Publication number 20160351536
- Publication date Dec 1, 2016
- SHINKAWA LTD.
- Toru Maeda
- B08 - CLEANING
Information Patent Application
WIRE BOND STRENGTHENING
- Publication number 20160322329
- Publication date Nov 3, 2016
- SKYWORKS SOLUTIONS, INC.
- Aldrin Quinones GARING
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE-BONDING APPARATUS AND METHOD OF WIRE BONDING
- Publication number 20150246411
- Publication date Sep 3, 2015
- SHINKAWA LTD.
- NAOKI SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20140048584
- Publication date Feb 20, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20130306708
- Publication date Nov 21, 2013
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDER INCLUDING A TRANSDUCER, A BOND HEAD, AND A MOUNTING APP...
- Publication number 20130240605
- Publication date Sep 19, 2013
- Yam Mo WONG
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20130140346
- Publication date Jun 6, 2013
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF
- Publication number 20120286427
- Publication date Nov 15, 2012
- Renesas Electronics Corporation
- Kaori Sumitomo
- H01 - BASIC ELECTRIC ELEMENTS

by ultrasonic vibrations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of calibrating an ultrasonic characteristic on a wire bondi...

Methods of forming wire interconnect structures and related wire bo...

Multi-segment wire-bond

Wedge tool, bonding device, and bonding inspection method

Method for calibrating an ultrasonic bonding machine

Multi-segment wire-bond

Wedge bonding tools, wedge bonding systems, and related methods

Wedge bonding tools, wedge bonding systems, and related methods

Method for manufacturing wire bonding structure, wire bonding struc...

Wire-bonding apparatus and method of manufacturing semiconductor de...

Wire-bonding apparatus and method of wire bonding

Semiconductor device and a manufacturing method thereof

Ultrasonic bonding systems and methods of using the same

Ultrasonic bonding systems and methods of using the same

Ultrasonic bonding systems and methods of using the same

Wire bonding apparatus

Patents Applicationslast 30 patents

METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

BONDING TOOL, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICO...

METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...

MULTI-SEGMENT WIRE-BOND

METHODS OF DETERMINING SHEAR STRENGTH OF BONDED FREE AIR BALLS ON W...

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

MULTI-SEGMENT WIRE-BOND

Bonding Device

Method for Calibrating an Ultrasonic Bonding Machine

Arrangements and Method for Providing a Bond Connection

CLEANING SYSTEMS FOR WIRE BONDING TOOLS, WIRE BONDING MACHINES INCL...

Method For Producing Wire Bond Connection And Arrangement For Imple...

METHOD FOR MANUFACTURING WIRE BONDING STRUCTURE, WIRE BONDING STRUC...

BONDING APPARATUS AND BONDING TOOL CLEANING METHOD

WIRE BOND STRENGTHENING

WIRE-BONDING APPARATUS AND METHOD OF WIRE BONDING

ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME

ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME

WIRE BONDER INCLUDING A TRANSDUCER, A BOND HEAD, AND A MOUNTING APP...

ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF