by ultrasonic vibrations

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H01L2224/75343

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75343by ultrasonic vibrations

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and method for using the same
- Patent number 11,552,044
- Issue date Jan 10, 2023
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- G02 - OPTICS
Information Patent Grant
Method and apparatus for embedding semiconductor devices
- Patent number 11,538,699
- Issue date Dec 27, 2022
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding and indexing apparatus
- Patent number 11,362,058
- Issue date Jun 14, 2022
- Nexperia B.V.
- Ralph Huybers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 11,295,996
- Issue date Apr 5, 2022
- Kulicke and Soffa Industries, Inc.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 11,031,368
- Issue date Jun 8, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hitoshi Mukohjima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding apparatus and method for using the same
- Patent number 10,923,453
- Issue date Feb 16, 2021
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting Method of a semiconductor device using a colored auxiliary...
- Patent number 10,786,876
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,692,783
- Issue date Jun 23, 2020
- KULICKE AND SOFFA, INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a connecting medium on an assembly partner, me...
- Patent number 10,615,138
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for the material-bonded connection of connection partners...
- Patent number 10,603,741
- Issue date Mar 31, 2020
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,312,216
- Issue date Jun 4, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,297,568
- Issue date May 21, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for aligning tooling elements of ultrasonic bon...
- Patent number 10,092,984
- Issue date Oct 9, 2018
- Kulicke and Soffa Industries, Inc.
- Jonathan Michael Byars
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device and method for permanent bonding
- Patent number 9,947,638
- Issue date Apr 17, 2018
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for aligning tooling elements of ultrasonic bon...
- Patent number 9,925,624
- Issue date Mar 27, 2018
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,780,065
- Issue date Oct 3, 2017
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing method and associated semiconductor man...
- Patent number 9,704,820
- Issue date Jul 11, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip bonding method and solid-state image pickup device manufa...
- Patent number 9,685,478
- Issue date Jun 20, 2017
- Sharp Kabushiki Kaisha
- Naoki Sakota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a material-bonding connection between a semico...
- Patent number 9,659,793
- Issue date May 23, 2017
- Infineon Technologies AG
- Nicolas Heuck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,633,981
- Issue date Apr 25, 2017
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor devi...
- Patent number 9,627,347
- Issue date Apr 18, 2017
- National Institute of Advanced Industrial Science and Technology
- Masahiro Aoyagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clamping mechanism for processing of a substrate within a substrate...
- Patent number 9,443,819
- Issue date Sep 13, 2016
- Apple Inc.
- Gerard Anthony C. Afable
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods and systems for aligning tooling elements of ultrasonic bon...
- Patent number 9,393,641
- Issue date Jul 19, 2016
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,362,247
- Issue date Jun 7, 2016
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump, method for forming the bump, and method for mounting substrat...
- Patent number 8,492,894
- Issue date Jul 23, 2013
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting electronic component
- Patent number 7,350,685
- Issue date Apr 1, 2008
- Fujitsu Limited
- Takayoshi Matsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS
- Publication number 20240021570
- Publication date Jan 18, 2024
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jiho JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING AND INDEXING METHOD
- Publication number 20220310553
- Publication date Sep 29, 2022
- NEXPERIA B.V.
- Ralph HUYBERS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20200273759
- Publication date Aug 27, 2020
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20190348393
- Publication date Nov 14, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- HITOSHI MUKOHJIMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING APPARATUS AND METHOD FOR USING THE SAME
- Publication number 20190198476
- Publication date Jun 27, 2019
- Samsung Display Co. Ltd.
- Byoung Yong KIM
- G02 - OPTICS
Information Patent Application
AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20180236613
- Publication date Aug 23, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR ALIGNING TOOLING ELEMENTS OF ULTRASONIC BON...
- Publication number 20180169803
- Publication date Jun 21, 2018
- ORTHODYNE ELECTRONICS CORPORATION
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180090395
- Publication date Mar 29, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluidic Self Assembly of Contact Materials
- Publication number 20180076168
- Publication date Mar 15, 2018
- Sharp Laboratories of America, Inc.
- LISA H. STECKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180026006
- Publication date Jan 25, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20170186724
- Publication date Jun 29, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR PERMANENT BONDING
- Publication number 20170053892
- Publication date Feb 23, 2017
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR ALIGNING TOOLING ELEMENTS OF ULTRASONIC BON...
- Publication number 20160297037
- Publication date Oct 13, 2016
- ORTHODYNE ELECTRONICS CORPORATION
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20160254252
- Publication date Sep 1, 2016
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20150348951
- Publication date Dec 3, 2015
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CONNECTING CONNECTION ELEMENTS TO THE SUBS...
- Publication number 20150306701
- Publication date Oct 29, 2015
- SEMIKRON Elektronik GmbH & Co. KG
- Björn TAUSCHER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing Semiconductor Device and Semiconductor Devi...
- Publication number 20150235984
- Publication date Aug 20, 2015
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Masahiro Aoyagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20140295619
- Publication date Oct 2, 2014
- Tanaka Kikinzoku Kogyo K.K.
- TOSHINORI OGASHIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR ALIGNING TOOLING ELEMENTS OF ULTRASONIC BON...
- Publication number 20130228611
- Publication date Sep 5, 2013
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20110272802
- Publication date Nov 10, 2011
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of mounting electronic component
- Publication number 20060091185
- Publication date May 4, 2006
- FUJITSU LIMITED
- Takayoshi Matsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fastening microtool components to objects
- Publication number 20050277244
- Publication date Dec 15, 2005
- Norbert Galster
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip bonding method
- Publication number 20020056740
- Publication date May 16, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Eiji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS

by ultrasonic vibrations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding apparatus and method for using the same

Method and apparatus for embedding semiconductor devices

Bonding and indexing apparatus

Systems and methods for bonding semiconductor elements

Bonding apparatus

Bonding apparatus and method for using the same

Mounting Method of a semiconductor device using a colored auxiliary...

Systems and methods for bonding semiconductor elements

Method for producing a connecting medium on an assembly partner, me...

Apparatus for the material-bonded connection of connection partners...

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Methods and systems for aligning tooling elements of ultrasonic bon...

Device and method for permanent bonding

Methods and systems for aligning tooling elements of ultrasonic bon...

Systems and methods for bonding semiconductor elements

Semiconductor manufacturing method and associated semiconductor man...

Flip-chip bonding method and solid-state image pickup device manufa...

Method for producing a material-bonding connection between a semico...

Systems and methods for bonding semiconductor elements

Method of manufacturing semiconductor device and semiconductor devi...

Clamping mechanism for processing of a substrate within a substrate...

Methods and systems for aligning tooling elements of ultrasonic bon...

Systems and methods for bonding semiconductor elements

Bump, method for forming the bump, and method for mounting substrat...

Method of mounting electronic component

Patents Applicationslast 30 patents

BONDING APPARATUS

BONDING AND INDEXING METHOD

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

BONDING APPARATUS

BONDING APPARATUS AND METHOD FOR USING THE SAME

AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME

METHODS AND SYSTEMS FOR ALIGNING TOOLING ELEMENTS OF ULTRASONIC BON...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

Fluidic Self Assembly of Contact Materials

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

DEVICE AND METHOD FOR PERMANENT BONDING

METHODS AND SYSTEMS FOR ALIGNING TOOLING ELEMENTS OF ULTRASONIC BON...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

METHOD AND APPARATUS FOR CONNECTING CONNECTION ELEMENTS TO THE SUBS...

Method of Manufacturing Semiconductor Device and Semiconductor Devi...

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...

METHODS AND SYSTEMS FOR ALIGNING TOOLING ELEMENTS OF ULTRASONIC BON...

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...

Method of mounting electronic component

Method for fastening microtool components to objects

Flip chip bonding method