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by ultrasonic vibrations

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  • CPC
  • H01L2224/77343
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/77343by ultrasonic vibrations
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    FLEX BONDED INTEGRATED CIRCUITS
    • Publication number 20230299035
    • Publication date Sep 21, 2023
    • META PLATFORMS, INC.
    • Sandeep Rekhi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
    • Publication number 20140048584
    • Publication date Feb 20, 2014
    • Orthodyne Electronics Corporation
    • Christoph B. Luechinger
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR