by welding

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CPC
H05K3/328

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/328by welding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Transceiver antenna for wireless charging, apparatus and method of...
- Patent number 12,219,717
- Issue date Feb 4, 2025
- Passcon Co., LTD.
- Hyejoong Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gold finger type fan frame and double-layer connection structure th...
- Patent number 12,193,186
- Issue date Jan 7, 2025
- Asia Vital Components (China) Co., Ltd.
- Helen Huang
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Sensor module
- Patent number 12,177,987
- Issue date Dec 24, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yutaro Yamashita
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device and method for manufacturing electronic device
- Patent number 12,171,068
- Issue date Dec 17, 2024
- PANASONIC AUTOMOTIVE SYSTEMS CO., LTD.
- Koji Dobashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board PCB assembly and electronic device
- Patent number 12,127,347
- Issue date Oct 22, 2024
- HONOR DEVICE CO., LTD.
- Zhijie Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Welding structure and display module
- Patent number 12,108,541
- Issue date Oct 1, 2024
- GUANGZHOU GOVISIONOX TECHNOLOGY CO., LTD.
- Yangchun Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic welding systems, methods of using the same, and related...
- Patent number 12,070,814
- Issue date Aug 27, 2024
- Kulicke and Soffa Industries, Inc.
- Theodore J. Copperthite
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and manufacturing method of display device
- Patent number 12,069,910
- Issue date Aug 20, 2024
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery system with flexible printed circuit
- Patent number 12,015,175
- Issue date Jun 18, 2024
- Samsung SDI Co., Ltd.
- Michael Erhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus having grooved terminals
- Patent number 11,997,901
- Issue date May 28, 2024
- Samsung Display Co., Ltd.
- Byoungyong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structural lead frame
- Patent number 11,923,151
- Issue date Mar 5, 2024
- KEMET Electronics Corporation
- Galen W. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biocompatible electromechanical connection for ceramic substrate el...
- Patent number 11,904,073
- Issue date Feb 20, 2024
- Verily Life Sciences LLC
- Alexander Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attaching a contact element to a conductive path a conduc...
- Patent number 11,888,279
- Issue date Jan 30, 2024
- TE Connectivity Germany GmbH
- Andre Martin Dressel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly method and AP device
- Patent number 11,876,282
- Issue date Jan 16, 2024
- Huawei Technologies Co., Ltd.
- Shikang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FPC connection structure and method for connecting to printed circu...
- Patent number 11,864,328
- Issue date Jan 2, 2024
- LG Energy Solution, Ltd.
- Dong-Kwan Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic welding systems, methods of using the same, and related...
- Patent number 11,850,676
- Issue date Dec 26, 2023
- Kulicke and Soffa Industries, Inc.
- Theodore J. Copperthite
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a camera module, camera module
- Patent number 11,818,449
- Issue date Nov 14, 2023
- Robert Bosch GmbH
- Michael Gockel
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Bonding apparatus and method of fabricating display device using th...
- Patent number 11,798,912
- Issue date Oct 24, 2023
- Samsung Display Co., Ltd.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with buried component and manufacture method thereof
- Patent number 11,792,939
- Issue date Oct 17, 2023
- Unimicron Technology Corp.
- Yu-Shen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component assemblies and embedding for high density electronics
- Patent number 11,744,018
- Issue date Aug 29, 2023
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery system with flexible printed circuit
- Patent number 11,695,189
- Issue date Jul 4, 2023
- Samsung SDI Co., Ltd.
- Michael Erhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery pack and manufacturing method therefor
- Patent number 11,670,803
- Issue date Jun 6, 2023
- Samsung SDI Co., Ltd.
- Sang Hun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Welding system
- Patent number 11,637,407
- Issue date Apr 25, 2023
- TE CONNECTIVITY SOLUTIONS GmbH
- Changjun Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus having grooved terminals
- Patent number 11,605,697
- Issue date Mar 14, 2023
- Samsung Display Co., Ltd.
- Byoungyong Kim
- G02 - OPTICS
Information Patent Grant
Planar transformer and switching power adapter
- Patent number 11,551,848
- Issue date Jan 10, 2023
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Yanjun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical three-dimensional printing and soldering
- Patent number 11,535,947
- Issue date Dec 27, 2022
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Information handling system with high current battery planar tab in...
- Patent number 11,515,606
- Issue date Nov 29, 2022
- Dell Products L.P.
- Andrew T. Sultenfuss
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Biocompatible electromechanical connection for ceramic substrate el...
- Patent number 11,504,453
- Issue date Nov 22, 2022
- Verily Life Sciences LLC
- Alexander Loo
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for producing a printed circuit board using a mould for cond...
- Patent number 11,395,411
- Issue date Jul 19, 2022
- JUMATECH GMBH
- Markus Wölfel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for working a first component and a second component by lase...
- Patent number 11,292,085
- Issue date Apr 5, 2022
- Webasto SE
- Thorsten Kabelitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND ELECTRICAL CONTACT ELEMENT
- Publication number 20250031305
- Publication date Jan 23, 2025
- Rohde& Schwarz GmbH & Co. KG
- Mathias NAGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...
- Publication number 20250015021
- Publication date Jan 9, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC WELDING SYSTEMS, METHODS OF USING THE SAME, AND RELATED...
- Publication number 20240359255
- Publication date Oct 31, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Theodore J. Copperthite
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD PCB ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240268032
- Publication date Aug 8, 2024
- Honor Device Co., Ltd.
- Zhijie XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING POWER MODULE PACKAGE, POWER MODULE PACKAGE AND E...
- Publication number 20240172375
- Publication date May 23, 2024
- Delta Electronics, Inc.
- Quansong Luo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY SYSTEM WITH FLEXIBLE PRINTED CIRCUIT
- Publication number 20240106083
- Publication date Mar 28, 2024
- Samsung SDI Co., Ltd.
- Michael ERHART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC WELDING SYSTEMS, METHODS OF USING THE SAME, AND RELATED...
- Publication number 20240091876
- Publication date Mar 21, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Theodore J. Copperthite
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY SYSTEM WITH FLEXIBLE PRINTED CIRCUIT
- Publication number 20240097284
- Publication date Mar 21, 2024
- Samsung SDI Co., Ltd.
- Michael ERHART
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED COMPONENT ARRAY STRUCTURE
- Publication number 20240015887
- Publication date Jan 11, 2024
- Tesla, Inc.
- Jin Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GOLD FINGER TYPE FAN FRAME AND DOUBLE-LAYER CONNECTION STRUCTURE TH...
- Publication number 20240015924
- Publication date Jan 11, 2024
- Huizhou Sanchuang Technology Co., Ltd.
- Helen Huang
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
ELECTROOPTICAL DISPLAY DEVICE
- Publication number 20240015941
- Publication date Jan 11, 2024
- Continental Automotive Technologies GmbH
- Marius-Andrei Muntean
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY SYSTEM WITH FLEXIBLE PRINTED CIRCUIT
- Publication number 20230299429
- Publication date Sep 21, 2023
- Samsung SDI Co., Ltd.
- Michael ERHART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20230254982
- Publication date Aug 10, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Koji DOBASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY APPARATUS HAVING GROOVED TERMINALS AND METHOD OF MANUFACTUR...
- Publication number 20230172021
- Publication date Jun 1, 2023
- SAMSUNG DISPLAY CO., LTD.
- Byoungyong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROCHEMICAL THREE-DIMENSIONAL PRINTING AND SOLDERING
- Publication number 20230129434
- Publication date Apr 27, 2023
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SENSOR MODULE
- Publication number 20230054092
- Publication date Feb 23, 2023
- Sony Semiconductor Solutions Corporation
- YUTARO YAMASHITA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SUBSTRATE WITH BURIED COMPONENT AND MANUFACTURE METHOD THEREOF
- Publication number 20230058180
- Publication date Feb 23, 2023
- Unimicron Technology Corp.
- Yu-Shen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BIOCOMPATIBLE ELECTROMECHANICAL CONNECTION FOR CERAMIC SUBSTRATE EL...
- Publication number 20230049960
- Publication date Feb 16, 2023
- Verily Life Sciences LLC
- Alexander Loo
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
WELDING STRUCTURE AND DISPLAY MODULE
- Publication number 20230035388
- Publication date Feb 2, 2023
- GUANGZHOU GOVISIONOX TECHNOLOGY CO., LTD.
- Yangchun LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECHARGEABLE BATTERY PACK
- Publication number 20230006310
- Publication date Jan 5, 2023
- ROBERT BOSCH GmbH
- Simon Buck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220384321
- Publication date Dec 1, 2022
- Fuji Electric Co., Ltd.
- Yoshihiko KAWAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transceiver Antenna for Wireless Charging, Apparatus and Method of...
- Publication number 20220352633
- Publication date Nov 3, 2022
- Passcon Co., Ltd.
- Hyejoong Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL AND/OR ELECTRONIC COMPONENT AND CONTACT SYSTEM
- Publication number 20220270956
- Publication date Aug 25, 2022
- Robert Bosch GmbH
- Thomas Suenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CAMERA MODULE, CAMERA MODULE
- Publication number 20220046150
- Publication date Feb 10, 2022
- ROBERT BOSCH GmbH
- Michael Gockel
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
BASE WITH ELECTRONIC COMPONENT AND VOICE COIL MOTOR
- Publication number 20220034980
- Publication date Feb 3, 2022
- SUZHOU GYZ ELECTRONIC TECHNOLOGY CO., LTD.
- Couquan MO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Assembly Method and AP Device
- Publication number 20210384611
- Publication date Dec 9, 2021
- Huawei Technologies Co., Ltd
- Shikang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE
- Publication number 20210320168
- Publication date Oct 14, 2021
- SAMSUNG DISPLAY CO., LTD.
- Joo-nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...
- Publication number 20210305201
- Publication date Sep 30, 2021
- SAMSUNG DISPLAY CO., LTD.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AN...
- Publication number 20210249190
- Publication date Aug 12, 2021
- Murata Manufacturing Co., Ltd.
- Yasuhiro NISHISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Assemblies and Embedding for High Density Electronics
- Publication number 20210227693
- Publication date Jul 22, 2021
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transceiver antenna for wireless charging, apparatus and method of...

Gold finger type fan frame and double-layer connection structure th...

Sensor module

Electronic device and method for manufacturing electronic device

Printed circuit board PCB assembly and electronic device

Welding structure and display module

Ultrasonic welding systems, methods of using the same, and related...

Display device and manufacturing method of display device

Battery system with flexible printed circuit

Display apparatus having grooved terminals

Structural lead frame

Biocompatible electromechanical connection for ceramic substrate el...

Method of attaching a contact element to a conductive path a conduc...

Assembly method and AP device

FPC connection structure and method for connecting to printed circu...

Ultrasonic welding systems, methods of using the same, and related...

Method for producing a camera module, camera module

Bonding apparatus and method of fabricating display device using th...

Substrate with buried component and manufacture method thereof

Component assemblies and embedding for high density electronics

Battery system with flexible printed circuit

Battery pack and manufacturing method therefor

Welding system

Display apparatus having grooved terminals

Planar transformer and switching power adapter

Electrochemical three-dimensional printing and soldering

Information handling system with high current battery planar tab in...

Biocompatible electromechanical connection for ceramic substrate el...

Method for producing a printed circuit board using a mould for cond...

Method for working a first component and a second component by lase...

Patents Applicationslast 30 patents

METHOD AND ELECTRICAL CONTACT ELEMENT

HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...

ULTRASONIC WELDING SYSTEMS, METHODS OF USING THE SAME, AND RELATED...

PRINTED CIRCUIT BOARD PCB ASSEMBLY AND ELECTRONIC DEVICE

METHOD FOR FORMING POWER MODULE PACKAGE, POWER MODULE PACKAGE AND E...

BATTERY SYSTEM WITH FLEXIBLE PRINTED CIRCUIT

ULTRASONIC WELDING SYSTEMS, METHODS OF USING THE SAME, AND RELATED...

BATTERY SYSTEM WITH FLEXIBLE PRINTED CIRCUIT

STACKED COMPONENT ARRAY STRUCTURE

GOLD FINGER TYPE FAN FRAME AND DOUBLE-LAYER CONNECTION STRUCTURE TH...

ELECTROOPTICAL DISPLAY DEVICE

BATTERY SYSTEM WITH FLEXIBLE PRINTED CIRCUIT

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

DISPLAY APPARATUS HAVING GROOVED TERMINALS AND METHOD OF MANUFACTUR...

ELECTROCHEMICAL THREE-DIMENSIONAL PRINTING AND SOLDERING

SENSOR MODULE

SUBSTRATE WITH BURIED COMPONENT AND MANUFACTURE METHOD THEREOF

BIOCOMPATIBLE ELECTROMECHANICAL CONNECTION FOR CERAMIC SUBSTRATE EL...

WELDING STRUCTURE AND DISPLAY MODULE

RECHARGEABLE BATTERY PACK

SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING THE SAME

Transceiver Antenna for Wireless Charging, Apparatus and Method of...

ELECTRICAL AND/OR ELECTRONIC COMPONENT AND CONTACT SYSTEM

METHOD FOR PRODUCING A CAMERA MODULE, CAMERA MODULE

BASE WITH ELECTRONIC COMPONENT AND VOICE COIL MOTOR

Assembly Method and AP Device

DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE

BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...

ELECTRONIC COMPONENT, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AN...

Component Assemblies and Embedding for High Density Electronics