This application claims the benefit of the filing date under 35 U.S.C. § 119(a)-(d) of German Patent Application No. 102018213639.4, filed on Aug. 14, 2018.
The present invention relates to an attachment of a contact element and, more particularly, to an attachment of a contact element to a conductive path of a conductor plate.
A contact element can be attached to a conductive path of a conductor plate according to various methods. The contact element can be attached by soldering, for example. To do this, it is necessary to use flux which, where appropriate, must be removed later in the production method. A further possibility is production using through-hole technology (THT), however, this requires the drilling of holes. The current methods of attaching the contact element to the conductive path are thus complex.
A method of attaching a contact element to a conductor plate includes welding the contact element to a conductive path of the conductor plate in a surface-mounted manner with a laser beam.
The invention will now be described by way of example with reference to the accompanying Figures, of which:
The invention is explained below by way of example and in greater detail with reference to the drawings. The embodiments and configurations depicted are each independent of one another and can be combined with one another as desired, depending on necessity in the specific application.
A pin header 100 according to an embodiment is shown in
As shown in
In other embodiments, the angle 107 can be smaller or larger, depending on the distance between the individual rows 105 and the distance 130 between the individual contact elements 10 in a row 105.
As shown in
A laser beam 30, as shown in
The striking of the laser beam 30 onto the contact element 10 causes a heating, in particular a melting, so that the contact element 10 is welded with or onto the conductive path 21. A width 131 of the laser beam 30, shown in
In an embodiment, the laser beam 30 fuses a material 60 of the contact element 10 in the fused region 40 having a radius which corresponds to 3.0 times the width 131 of the laser beam 30. In other embodiments, the region 40 may be smaller, for example twice the width 131 of the laser beam 30 or equal to a single width 131 of the laser beam 30. The width 131 of the laser beam 30 can be defined as, for example, the distance between two opposing points at which the intensity has dropped to 1/e2.
In an embodiment shown in
As shown in
As shown in
The pin header 100 is configured such that all of the contact elements 10 shown can be mounted on the conductor plate 20 in a surface-mounted manner; it is not necessary to bore holes into the conductor plate 20. Further, it is not necessary to use flux. The outlay in terms of manufacture is therefore reduced. Through the use of the laser beam 30 that achieves heating only locally in a small region 40, it is nevertheless possible to bring about a welding between the contact element 10 and the conductive path 21 without the conductor plate 20 being exposed to high temperatures.
Number | Date | Country | Kind |
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102018213639.4 | Aug 2018 | DE | national |
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Number | Date | Country | |
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20200059056 A1 | Feb 2020 | US |