Calibration means

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H01L2224/78001

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78001Calibration means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of calibrating an ultrasonic characteristic on a wire bondi...
- Patent number 12,113,043
- Issue date Oct 8, 2024
- Kulicke and Soffa Industries, Inc.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus, method for measuring opening amount of clam...
- Patent number 12,087,725
- Issue date Sep 10, 2024
- Shinkawa Ltd.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for calibrating an ultrasonic bonding machine
- Patent number 11,646,291
- Issue date May 9, 2023
- Infineon Technologies AG
- Florian Eacock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with rotating bonding stage
- Patent number 11,273,515
- Issue date Mar 15, 2022
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for calibrating wire clamp device
- Patent number 11,257,781
- Issue date Feb 22, 2022
- Shinkawa Ltd.
- Noboru Fujino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus with rotating bonding stage
- Patent number 11,173,567
- Issue date Nov 16, 2021
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
On-bonder automatic overhang die optimization tool for wire bonding...
- Patent number 10,665,564
- Issue date May 26, 2020
- Kulicke and Soffa Industries, Inc.
- Aashish Shah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automatic bonding force calibration
- Patent number 10,634,572
- Issue date Apr 28, 2020
- Hesse GmbH
- Frank Walther
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
On-bonder automatic overhang die optimization tool for wire bonding...
- Patent number 10,121,759
- Issue date Nov 6, 2018
- Kulicke and Soffa Industries, Inc.
- Aashish Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire payout measurement and calibration techniques for a wire bondi...
- Patent number 8,302,841
- Issue date Nov 6, 2012
- Kulicke and Soffa Industries
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus with means and method for automatic calibration u...
- Patent number 4,759,073
- Issue date Jul 19, 1988
- Kulicke & Soffa Industries, Inc.
- Gautam N. Shah
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
- Publication number 20240404986
- Publication date Dec 5, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20240105672
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Shigeru HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20230178510
- Publication date Jun 8, 2023
- SHINKAWA LTD.
- Shigeru HAYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
- Publication number 20230154888
- Publication date May 18, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS, METHOD FOR MEASURING OPENING AMOUNT OF CLAM...
- Publication number 20220310552
- Publication date Sep 29, 2022
- SHINKAWA LTD.
- Toshihiko TOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM
- Publication number 20200238433
- Publication date Jul 30, 2020
- KAIJO CORPORATION
- Yuji KOMAGINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Calibrating an Ultrasonic Bonding Machine
- Publication number 20200043883
- Publication date Feb 6, 2020
- Florian Eacock
- G05 - CONTROLLING REGULATING
Information Patent Application
METHOD FOR CALIBRATING WIRE CLAMP DEVICE, AND WIRE BONDING APPARATUS
- Publication number 20190237428
- Publication date Aug 1, 2019
- SHINKAWA LTD.
- Noboru FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING...
- Publication number 20190027463
- Publication date Jan 24, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Aashish Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING...
- Publication number 20170125311
- Publication date May 4, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Aashish Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE PAYOUT MEASUREMENT AND CALIBRATION TECHNIQUES FOR A WIRE BONDI...
- Publication number 20110000951
- Publication date Jan 6, 2011
- KULICKE AND SOFFA INDUSTRIES, INC.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Calibration means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of calibrating an ultrasonic characteristic on a wire bondi...

Wire bonding apparatus, method for measuring opening amount of clam...

Method for calibrating an ultrasonic bonding machine

Bonding process with rotating bonding stage

Method for calibrating wire clamp device

Bonding apparatus with rotating bonding stage

On-bonder automatic overhang die optimization tool for wire bonding...

Automatic bonding force calibration

On-bonder automatic overhang die optimization tool for wire bonding...

Wire payout measurement and calibration techniques for a wire bondi...

Bonding apparatus with means and method for automatic calibration u...

Patents Applicationslast 30 patents

METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

WIRE BONDING APPARATUS

METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...

WIRE BONDING APPARATUS, METHOD FOR MEASURING OPENING AMOUNT OF CLAM...

BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM

Method for Calibrating an Ultrasonic Bonding Machine

METHOD FOR CALIBRATING WIRE CLAMP DEVICE, AND WIRE BONDING APPARATUS

ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING...

ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING...

WIRE PAYOUT MEASUREMENT AND CALIBRATION TECHNIQUES FOR A WIRE BONDI...