Calibration means

Industry

CPC
H01L2224/75001

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75001Calibration means

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding apparatus, manufacturing system, and semiconducto...
- Patent number 11,776,931
- Issue date Oct 3, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach systems including a verification substrate
- Patent number 11,574,832
- Issue date Feb 7, 2023
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage-compensated bonded structure including a support chip and a...
- Patent number 11,114,406
- Issue date Sep 7, 2021
- SanDisk Technologies LLC
- Senaka Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of operating bonding machines for bonding semiconductor ele...
- Patent number 9,478,516
- Issue date Oct 25, 2016
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for determining and adjusting a level of parall...
- Patent number 9,425,163
- Issue date Aug 23, 2016
- Kulicke and Soffa Industries, Inc.
- Michael P. Schmidt-Lange
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Handler and part inspection apparatus
- Patent number 9,411,012
- Issue date Aug 9, 2016
- Seiko Epson Corporation
- Nobuo Hasegawa
- G01 - MEASURING TESTING
Information Patent Grant
Methods of operating bonding machines for bonding semiconductor ele...
- Patent number 9,165,902
- Issue date Oct 20, 2015
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for determining and adjusting a level of parall...
- Patent number 9,136,243
- Issue date Sep 15, 2015
- Kulicke and Soffa Industries, Inc.
- Michael P. Schmidt-Lange
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...
- Publication number 20240243094
- Publication date Jul 18, 2024
- Canon Kabushiki Kaisha
- MASAHIRO KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSION SYSTEM CALIBRATION
- Publication number 20230378120
- Publication date Nov 23, 2023
- The Boeing Company
- Peter D. Brewer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20230187285
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- SANG-WON LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
- Publication number 20230148420
- Publication date May 11, 2023
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS, MANUFACTURING SYSTEM, AND SEMICONDUCTO...
- Publication number 20210074670
- Publication date Mar 11, 2021
- Kioxia Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
- Publication number 20200075381
- Publication date Mar 5, 2020
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELE...
- Publication number 20160005709
- Publication date Jan 7, 2016
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELE...
- Publication number 20150171049
- Publication date Jun 18, 2015
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR DETERMINING AND ADJUSTING A LEVEL OF PARALL...
- Publication number 20150155254
- Publication date Jun 4, 2015
- KULICKE AND SOFFA INDUSTRIES, INC.
- Michael P. Schmidt-Lange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER AND PART INSPECTION APPARATUS
- Publication number 20130057310
- Publication date Mar 7, 2013
- SEIKO EPSON CORPORATION
- Nobuo HASEGAWA
- G01 - MEASURING TESTING

Calibration means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate bonding apparatus, manufacturing system, and semiconducto...

Die attach systems including a verification substrate

Warpage-compensated bonded structure including a support chip and a...

Methods of operating bonding machines for bonding semiconductor ele...

Systems and methods for determining and adjusting a level of parall...

Handler and part inspection apparatus

Methods of operating bonding machines for bonding semiconductor ele...

Systems and methods for determining and adjusting a level of parall...

Patents Applicationslast 30 patents

BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...

COMPRESSION SYSTEM CALIBRATION

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...

SUBSTRATE BONDING APPARATUS, MANUFACTURING SYSTEM, AND SEMICONDUCTO...

DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...

METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELE...

METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELE...

SYSTEMS AND METHODS FOR DETERMINING AND ADJUSTING A LEVEL OF PARALL...

HANDLER AND PART INSPECTION APPARATUS