Cap comprising a cavity for hosting the device

Industry

CPC
H01L2924/16152

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/16152Cap comprising a cavity for hosting the device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 11,984,381
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach process and dispenser head
- Patent number 11,972,956
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation sheet, manufacturing method of heat dissipation sh...
- Patent number 11,967,539
- Issue date Apr 23, 2024
- Fujitsu Limited
- Shinichi Hirose
- B32 - LAYERED PRODUCTS
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,923,230
- Issue date Mar 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 11,916,023
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with memory
- Patent number 11,901,210
- Issue date Feb 13, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 11,881,443
- Issue date Jan 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,876,011
- Issue date Jan 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for producing a 3D semiconductor device and structure with m...
- Patent number 11,862,503
- Issue date Jan 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with lid
- Patent number 11,855,009
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,854,857
- Issue date Dec 26, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and light source driver integrated in a same semicondu...
- Patent number RE49748
- Issue date Dec 5, 2023
- Google LLC
- Cheng-Yi Andrew Lin
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,830,757
- Issue date Nov 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,804,396
- Issue date Oct 31, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,784,082
- Issue date Oct 10, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
- Patent number 11,776,868
- Issue date Oct 3, 2023
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image sensor and light source driver integrated in a same semicondu...
- Patent number RE49664
- Issue date Sep 19, 2023
- Google LLC
- Cheng-Yi Andrew Lin
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 11,735,501
- Issue date Aug 22, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,735,462
- Issue date Aug 22, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Manufacturable RGB laser diode source and system
- Patent number 11,710,944
- Issue date Jul 25, 2023
- KYOCERA SLD Laser, Inc.
- Melvin McLaurin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with underfilled sealant
- Patent number 11,710,672
- Issue date Jul 25, 2023
- Intel Corporation
- Taylor William Gaines
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,705,438
- Issue date Jul 18, 2023
- Kabushiki Kaisha Toshiba
- Tatsuya Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 11,694,944
- Issue date Jul 4, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 11,615,977
- Issue date Mar 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 11,616,004
- Issue date Mar 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
- Patent number 11,610,831
- Issue date Mar 21, 2023
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a 3D semiconductor device and structure with s...
- Patent number 11,610,802
- Issue date Mar 21, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 11,594,473
- Issue date Feb 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package with reduced radio frequency losses
- Patent number 11,574,879
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Pedro Augusto Borrego Lambin Torres Amaral
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturable laser diode formed on c-plane gallium and nitrogen m...
- Patent number 11,569,637
- Issue date Jan 31, 2023
- KYOCERA SLD Laser, Inc.
- Melvin McLaurin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
- Publication number 20240128165
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SIDE INTEGRATION SEMICONDUCTOR PACKAGE AND METHOD OF FORMING...
- Publication number 20230402438
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
- Publication number 20230343679
- Publication date Oct 26, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230317564
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
- Publication number 20230253296
- Publication date Aug 10, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223365
- Publication date Jul 13, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
- Publication number 20230197573
- Publication date Jun 22, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230058480
- Publication date Feb 23, 2023
- KIOXIA Corporation
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20220301970
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SHEET, MANUFACTURING METHOD OF HEAT DISSIPATION SH...
- Publication number 20220139800
- Publication date May 5, 2022
- Fujitsu Limited
- Shinichi Hirose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220093572
- Publication date Mar 24, 2022
- Kabushiki Kaisha Toshiba
- Tatsuya HIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Conducting Sheet, Method for Manufacturing Thermal Conducti...
- Publication number 20220084902
- Publication date Mar 17, 2022
- DEXERIALS CORPORATION
- Hiroki Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURABLE RGB LASER DIODE SOURCE AND SYSTEM
- Publication number 20220077658
- Publication date Mar 10, 2022
- KYOCERA SLD Laser, Inc.
- Melvin McLaurin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
- Publication number 20210343570
- Publication date Nov 4, 2021
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH PARTITIONED LOGIC AND ASS...
- Publication number 20210217734
- Publication date Jul 15, 2021
- Micron Technology, Inc.
- Jian Li
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SPREADERS OR L...
- Publication number 20210202343
- Publication date Jul 1, 2021
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210020591
- Publication date Jan 21, 2021
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH LID
- Publication number 20210013160
- Publication date Jan 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interface Material Having Different Thicknesses in Packages
- Publication number 20200402926
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID ATTACH PROCESS AND DISPENSER HEAD
- Publication number 20200286748
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods For Establishing Thermal Joints Between Heat Spreaders Or L...
- Publication number 20200219785
- Publication date Jul 9, 2020
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR A MEMS TRANSDUCER
- Publication number 20200148531
- Publication date May 14, 2020
- INFINEON TECHNOLOGIES AG
- Andreas Wiesbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200083143
- Publication date Mar 12, 2020
- Advanced Semiconductor Engineering, Inc.
- Jung-Che TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Establishing Thermal Joints Between Heat Spreaders or L...
- Publication number 20190371697
- Publication date Dec 5, 2019
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D SEMICONDUCTOR DEVICE WITH ISOLATION LAYERS
- Publication number 20190363179
- Publication date Nov 28, 2019
- MonolithIC 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR A SUBSTRATE ASSOCIATED WITH A BACKSIDE REVEAL
- Publication number 20190355683
- Publication date Nov 21, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE HEAT SINK FIN SPACING
- Publication number 20190346214
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Paul F. Bodenweber
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ADJUSTABLE HEAT SINK FIN SPACING
- Publication number 20190346215
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Paul F. Bodenweber
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
POWER MANAGEMENT APPLICATION OF INTERCONNECT SUBSTRATES
- Publication number 20190341344
- Publication date Nov 7, 2019
- Volterra Semiconductor Corporation
- Mihalis Michael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING HERMETIC SEALING LID MEMBER
- Publication number 20190289738
- Publication date Sep 19, 2019
- Hitachi Metals, Ltd.
- Masayuki Yokota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Cap comprising a cavity for hosting the device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package structure and method for forming the same

Lid attach process and dispenser head

Heat dissipation sheet, manufacturing method of heat dissipation sh...

3D semiconductor device and structure with bonding

Thermal interface material having different thicknesses in packages

3D semiconductor device and structure with memory

3D semiconductor device and structure with metal layers and a conne...

3D semiconductor device and structure with single-crystal layers

Method for producing a 3D semiconductor device and structure with m...

Chip package with lid

Methods for producing a 3D semiconductor device and structure with...

Image sensor and light source driver integrated in a same semicondu...

3D semiconductor device and structure with bonding

Methods for producing a 3D semiconductor device and structure with...

3D semiconductor device and structure with bonding

Methods for establishing thermal joints between heat spreaders or l...

Image sensor and light source driver integrated in a same semicondu...

3D semiconductor device and structure with metal layers and a conne...

3D semiconductor device and structure with single-crystal layers

Manufacturable RGB laser diode source and system

Microelectronic package with underfilled sealant

Semiconductor device

3D semiconductor device and structure with metal layers and a conne...

3D semiconductor memory device and structure

3D semiconductor device and structure with metal layers and a conne...

Methods for establishing thermal joints between heat spreaders or l...

Method for producing a 3D semiconductor device and structure with s...

3D semiconductor device and structure with metal layers and a conne...

Device package with reduced radio frequency losses

Manufacturable laser diode formed on c-plane gallium and nitrogen m...

Patents Applicationslast 30 patents

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...

DOUBLE SIDE INTEGRATION SEMICONDUCTOR PACKAGE AND METHOD OF FORMING...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...

SEMICONDUCTOR PACKAGES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

HEAT DISSIPATION SHEET, MANUFACTURING METHOD OF HEAT DISSIPATION SH...

SEMICONDUCTOR DEVICE

Thermal Conducting Sheet, Method for Manufacturing Thermal Conducti...

MANUFACTURABLE RGB LASER DIODE SOURCE AND SYSTEM

METHOD FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH PARTITIONED LOGIC AND ASS...

METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SPREADERS OR L...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE WITH LID

Thermal Interface Material Having Different Thicknesses in Packages

LID ATTACH PROCESS AND DISPENSER HEAD

Methods For Establishing Thermal Joints Between Heat Spreaders Or L...

SYSTEM AND METHOD FOR A MEMS TRANSDUCER

ELECTRONIC DEVICE

Methods for Establishing Thermal Joints Between Heat Spreaders or L...

3D SEMICONDUCTOR DEVICE WITH ISOLATION LAYERS

INTERCONNECTIONS FOR A SUBSTRATE ASSOCIATED WITH A BACKSIDE REVEAL

ADJUSTABLE HEAT SINK FIN SPACING

ADJUSTABLE HEAT SINK FIN SPACING

POWER MANAGEMENT APPLICATION OF INTERCONNECT SUBSTRATES

METHOD FOR MANUFACTURING HERMETIC SEALING LID MEMBER