Cap comprising an aperture

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CPC
H01L2924/16151

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/16151Cap comprising an aperture

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Embedded liquid cooling
- Patent number 12,199,011
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,002,735
- Issue date Jun 4, 2024
- Tien-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable device with combined sensing capabilities
- Patent number 11,885,689
- Issue date Jan 30, 2024
- Pixart Imaging Incorporation
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Image sensor and light source driver integrated in a same semicondu...
- Patent number RE49748
- Issue date Dec 5, 2023
- Google LLC
- Cheng-Yi Andrew Lin
Information Patent Grant
Image sensor and light source driver integrated in a same semicondu...
- Patent number RE49664
- Issue date Sep 19, 2023
- Google LLC
- Cheng-Yi Andrew Lin
Information Patent Grant
Method for producing power semiconductor module arrangement
- Patent number 11,557,522
- Issue date Jan 17, 2023
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and electronic device having the same
- Patent number 11,437,295
- Issue date Sep 6, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to enhance reliability in connection with arrange...
- Patent number 11,264,301
- Issue date Mar 1, 2022
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity wall structure for semiconductor packaging
- Patent number 11,139,233
- Issue date Oct 5, 2021
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to enhance solder joint reliability
- Patent number 11,094,604
- Issue date Aug 17, 2021
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module arrangement
- Patent number 11,081,414
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable device with combined sensing capabilities
- Patent number 10,852,192
- Issue date Dec 1, 2020
- Pixart Imaging Incorporation
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor, in particular a microphone with improved layout
- Patent number 10,822,227
- Issue date Nov 3, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Philippe Robert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor module and method of making the same
- Patent number 10,794,784
- Issue date Oct 6, 2020
- Rohm Co., Ltd.
- Yuto Nishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity wall structure for semiconductor packaging
- Patent number 10,707,161
- Issue date Jul 7, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having an electric device with a recess
- Patent number 10,658,238
- Issue date May 19, 2020
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method to enhance solder joint reliability
- Patent number 10,636,722
- Issue date Apr 28, 2020
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and electronic device having the same
- Patent number 10,636,721
- Issue date Apr 28, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device and process
- Patent number 10,560,784
- Issue date Feb 11, 2020
- Cirrus Logic, Inc.
- Colin Robert Jenkins
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic devices with environmental sensors
- Patent number 10,545,038
- Issue date Jan 28, 2020
- Apple Inc.
- Henry H. Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 10,510,668
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with integrated microphone device using through-silicon vias (T...
- Patent number 10,455,308
- Issue date Oct 22, 2019
- Intel Corporation
- Kevin J. Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS transducer package
- Patent number 10,455,309
- Issue date Oct 22, 2019
- Cirrus Logic, Inc.
- Tsjerk Hoekstra
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS transducer package
- Patent number 10,405,102
- Issue date Sep 3, 2019
- Cirrus Logic, Inc.
- Tsjerk Hoekstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor
- Patent number 10,388,593
- Issue date Aug 20, 2019
- LG Electronics Inc.
- Insung Hwang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor packages and methods for forming semiconductor package
- Patent number 10,381,280
- Issue date Aug 13, 2019
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and process
- Patent number 10,375,481
- Issue date Aug 6, 2019
- Cirrus Logic, Inc.
- Colin Robert Jenkins
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Imaging device, manufacturing device, and manufacturing method
- Patent number 10,356,295
- Issue date Jul 16, 2019
- Sony Corporation
- Eiichiro Dobashi
- G02 - OPTICS
Information Patent Grant
Heat dissipation structure
- Patent number 10,356,946
- Issue date Jul 16, 2019
- Kaneka Corporation
- Keisuke Oguma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor device with ingress protection
- Patent number 10,291,973
- Issue date May 14, 2019
- Knowles Electronics, LLC
- Tony K. Lim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE INCLUDING PACKAGE LID WITH A RECESS AND METHODS O...
- Publication number 20250070084
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH A REINFORCING LAYER
- Publication number 20240395731
- Publication date Nov 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED LIQUID COOLING
- Publication number 20240222222
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE
- Publication number 20240203825
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Seogwoo HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
- Publication number 20240118141
- Publication date Apr 11, 2024
- PIXART IMAGING INCORPORATION
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method for Partial EMI Shielding
- Publication number 20240063137
- Publication date Feb 22, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240038607
- Publication date Feb 1, 2024
- STMicroelectronics (Grenoble 2) SAS
- Fanny LAPORTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Sensing External Condition in H...
- Publication number 20240003768
- Publication date Jan 4, 2024
- UTAC Headquarters Pte. Ltd.
- Paweena Phatto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH GAS RELEASE HOLES
- Publication number 20230307302
- Publication date Sep 28, 2023
- STMicroelectronics LTD
- David GANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230178451
- Publication date Jun 8, 2023
- Siliconware Precision Industries Co., Ltd.
- Hsin-Jou Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSO...
- Publication number 20230103894
- Publication date Apr 6, 2023
- NEC Corporation
- Yuki YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20210407886
- Publication date Dec 30, 2021
- Tien-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING POWER SEMICONDUCTOR MODULE ARRANGEMENT
- Publication number 20210335682
- Publication date Oct 28, 2021
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
- Publication number 20210041298
- Publication date Feb 11, 2021
- PIXART IMAGING INCORPORATION
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20200219784
- Publication date Jul 9, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method to Enhance Solder Joint Reliability
- Publication number 20200219787
- Publication date Jul 9, 2020
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200194328
- Publication date Jun 18, 2020
- Advanced Semiconductor Engineering, Inc.
- Cheng-Ling HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200140262
- Publication date May 7, 2020
- Advanced Semiconductor Engineering, Inc.
- Ching-Han HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY
- Publication number 20190326194
- Publication date Oct 24, 2019
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DEVICE AND PROCESS
- Publication number 20190306630
- Publication date Oct 3, 2019
- Cirrus Logic International Semiconductor Ltd.
- Colin Robert Jenkins
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electronic Devices With Environmental Sensors
- Publication number 20190154471
- Publication date May 23, 2019
- Apple Inc.
- Henry H. Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
- Publication number 20190113390
- Publication date Apr 18, 2019
- PIXART IMAGING INCORPORATION
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH RELIABILITY HOUSING FOR A SEMICONDUCTOR PACKAGE
- Publication number 20190096938
- Publication date Mar 28, 2019
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY
- Publication number 20190096783
- Publication date Mar 28, 2019
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE, MANUFACTURING DEVICE, AND MANUFACTURING METHOD
- Publication number 20180367716
- Publication date Dec 20, 2018
- SONY CORPORATION
- Eiichiro DOBASHI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Electronic Component Package Structure and Electronic Device
- Publication number 20180049351
- Publication date Feb 15, 2018
- Huawei Technologies Co., Ltd
- Xuequan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS
- Publication number 20180040514
- Publication date Feb 8, 2018
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SEMICONDUCTOR PACKAGE
- Publication number 20170294401
- Publication date Oct 12, 2017
- UTAC Headquarters Pte. Ltd.
- Nathapong SUTHIWONGSUNTHORN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170263587
- Publication date Sep 14, 2017
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140370660
- Publication date Dec 18, 2014
- Takumi IHARA
- H01 - BASIC ELECTRIC ELEMENTS

Cap comprising an aperture

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded liquid cooling

Semiconductor package

Wearable device with combined sensing capabilities

Image sensor and light source driver integrated in a same semicondu...

Image sensor and light source driver integrated in a same semicondu...

Method for producing power semiconductor module arrangement

Semiconductor package and electronic device having the same

System and method to enhance reliability in connection with arrange...

Cavity wall structure for semiconductor packaging

System and method to enhance solder joint reliability

Power semiconductor module arrangement

Wearable device with combined sensing capabilities

Pressure sensor, in particular a microphone with improved layout

Sensor module and method of making the same

Cavity wall structure for semiconductor packaging

Semiconductor packages having an electric device with a recess

System and method to enhance solder joint reliability

Semiconductor package and electronic device having the same

MEMS device and process

Electronic devices with environmental sensors

Method of fabricating semiconductor device

Die with integrated microphone device using through-silicon vias (T...

MEMS transducer package

MEMS transducer package

Sensor

Semiconductor packages and methods for forming semiconductor package

MEMS device and process

Imaging device, manufacturing device, and manufacturing method

Heat dissipation structure

Sensor device with ingress protection

Patents Applicationslast 30 patents

PACKAGE STRUCTURE INCLUDING PACKAGE LID WITH A RECESS AND METHODS O...

ELECTRONIC DEVICE WITH A REINFORCING LAYER

EMBEDDED LIQUID COOLING

SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE

WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES

Semiconductor Device and Method for Partial EMI Shielding

INTEGRATED CIRCUIT PACKAGE

Semiconductor Device and Method for Sensing External Condition in H...

SEMICONDUCTOR PACKAGE WITH GAS RELEASE HOLES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSO...

Semiconductor Package

METHOD FOR PRODUCING POWER SEMICONDUCTOR MODULE ARRANGEMENT

WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING THE SAME

System and Method to Enhance Solder Joint Reliability

DEVICE PACKAGES AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY

MEMS DEVICE AND PROCESS

Electronic Devices With Environmental Sensors

WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES

HIGH RELIABILITY HOUSING FOR A SEMICONDUCTOR PACKAGE

SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY

IMAGING DEVICE, MANUFACTURING DEVICE, AND MANUFACTURING METHOD

Electronic Component Package Structure and Electronic Device

SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME