Cap enclosing a plurality of side-by-side cavities [

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CPC
H01L2924/16153

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/16153Cap enclosing a plurality of side-by-side cavities [

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,183,651
- Issue date Dec 31, 2024
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having lid with protrusion and manufacturing meth...
- Patent number 12,094,792
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor including enclosed accommodation space with sealed...
- Patent number 11,914,072
- Issue date Feb 27, 2024
- Pixart Imaging Incorporation
- Nientse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable device with combined sensing capabilities
- Patent number 11,885,689
- Issue date Jan 30, 2024
- Pixart Imaging Incorporation
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Lid structure and semiconductor device package including the same
- Patent number 11,776,862
- Issue date Oct 3, 2023
- Advanced Semiconductor Engineering, Inc.
- Chun-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,488,886
- Issue date Nov 1, 2022
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor including enclosed accommodation space with sealed...
- Patent number 11,397,243
- Issue date Jul 26, 2022
- Pixart Imaging Incorporation
- Nientse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,037,852
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor including enclosed accomodation space with sealed...
- Patent number 10,969,472
- Issue date Apr 6, 2021
- Pixart Imaging Incorporation
- Nientse Chen
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor structure
- Patent number 10,937,721
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable device with combined sensing capabilities
- Patent number 10,852,192
- Issue date Dec 1, 2020
- Pixart Imaging Incorporation
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronics package with improved thermal performance
- Patent number 10,840,165
- Issue date Nov 17, 2020
- Qorvo US, Inc.
- Jonathan J. Fain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lid structure and semiconductor device package including the same
- Patent number 10,804,173
- Issue date Oct 13, 2020
- Advanced Semiconductor Engineering, Inc.
- Chun-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader having electromagnetically-formed features
- Patent number 10,763,188
- Issue date Sep 1, 2020
- Intel Corporation
- Aravindha R. Antoniswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor including enclosed accomodation space with sealed...
- Patent number 10,634,768
- Issue date Apr 28, 2020
- Pixart Imaging Corporation
- Nientse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for thermal interface material (TIM) bond lin...
- Patent number 10,529,645
- Issue date Jan 7, 2020
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 10,461,009
- Issue date Oct 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 10,461,022
- Issue date Oct 29, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making electrical components in handle wafers of integrated circuit...
- Patent number 10,431,648
- Issue date Oct 1, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 10,236,227
- Issue date Mar 19, 2019
- Siliconware Prescision Industries Co., Ltd.
- Lung-Shan Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making electrical components in handle wafers of integrated circuit...
- Patent number 10,204,977
- Issue date Feb 12, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable device with combined sensing capabilities
- Patent number 10,168,219
- Issue date Jan 1, 2019
- Pixart Imaging Incorporation
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 10,157,813
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with embedded electronic components and a waveguide cavity...
- Patent number 10,109,604
- Issue date Oct 23, 2018
- Sony Corporation
- Ali Eray Topak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing cap for electronic component
- Patent number 10,103,077
- Issue date Oct 16, 2018
- Tanaka Kikinzoku Kogyo K.K.
- Sadatoshi Sonoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-MEMS module
- Patent number 10,015,600
- Issue date Jul 3, 2018
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Circuit assemblies with multiple interposer substrates, and methods...
- Patent number 9,905,507
- Issue date Feb 27, 2018
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-side cooling of RF products in air cavity composite packages
- Patent number 9,899,292
- Issue date Feb 20, 2018
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with reinforcement frames, and method...
- Patent number 9,887,166
- Issue date Feb 6, 2018
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379609
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Wei-Shen HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371715
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
- Publication number 20240222218
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY SENSOR INCLUDING ENCLOSED ACCOMMODATION SPACE WITH SEALED...
- Publication number 20240159873
- Publication date May 16, 2024
- PixArt Imaging Incorporation
- Nientse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
- Publication number 20240118141
- Publication date Apr 11, 2024
- PIXART IMAGING INCORPORATION
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE ASSEMBLY LID AND METHODS FOR FORMING THE SAME
- Publication number 20230378007
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE, METHOD FOR ASSEMBLING A POWER SEMICONDU...
- Publication number 20230170287
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Ulrich Nolten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Assembly Including Lid With Additional Stress Mitigating Fe...
- Publication number 20230018343
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY INCLUDING A PACKAGE LID HAVING AN INNER FOOT AND M...
- Publication number 20230018359
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY SENSOR INCLUDING ENCLOSED ACCOMODATION SPACE WITH SEALED...
- Publication number 20220317257
- Publication date Oct 6, 2022
- PixArt Imaging Incorporation
- Nientse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY SENSOR INCLUDING ENCLOSED ACCOMODATION SPACE WITH SEALED...
- Publication number 20210208252
- Publication date Jul 8, 2021
- PixArt Imaging Incorporation
- Nientse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
- Publication number 20210041298
- Publication date Feb 11, 2021
- PIXART IMAGING INCORPORATION
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROXIMITY SENSOR INCLUDING ENCLOSED ACCOMODATION SPACE WITH SEALED...
- Publication number 20200225326
- Publication date Jul 16, 2020
- PixArt Imaging Incorporation
- Nientse Chen
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200035582
- Publication date Jan 30, 2020
- J-DEVICES CORPORATION
- Masao HIROBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING ELECTRICAL COMPONENTS IN HANDLE WAFERS OF INTEGRATED CIRCUIT...
- Publication number 20190172903
- Publication date Jun 6, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
- Publication number 20190113390
- Publication date Apr 18, 2019
- PIXART IMAGING INCORPORATION
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20190096781
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR THERMAL INTERFACE MATERIAL (TIM) BOND LIN...
- Publication number 20180358280
- Publication date Dec 13, 2018
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING ELECTRICAL COMPONENTS IN HANDLE WAFERS OF INTEGRATED CIRCUIT...
- Publication number 20180076278
- Publication date Mar 15, 2018
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING CAP FOR ELECTRONIC COMPONENT
- Publication number 20180033706
- Publication date Feb 1, 2018
- TANAKA KIKINZOKU KOGYO K.K.
- Sadatoshi SONODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20170345732
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Temperature Sensor
- Publication number 20140131709
- Publication date May 15, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Compartment Semiconductor Package
- Publication number 20140131767
- Publication date May 15, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC WIRELESS TRANSMISSION DEVICE
- Publication number 20130293428
- Publication date Nov 7, 2013
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Jean-Charles SOURIAU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130256864
- Publication date Oct 3, 2013
- Toshihiko NAGANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Compartment Semiconductor Package with Temperature Sensor
- Publication number 20120248564
- Publication date Oct 4, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20120104571
- Publication date May 3, 2012
- Samsung Electro-Mechanics CO., LTD.
- Jin O. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSITION FROM A CHIP TO A WAVEGUIDE PORT
- Publication number 20120068316
- Publication date Mar 22, 2012
- TELEFONAKTIEBOLAGET L M ERICSSON (publ)
- Per Ligander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEMICONDUCTOR DEVICE PROTECTION
- Publication number 20120005875
- Publication date Jan 12, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Kazuhiro Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO LEAD PACKAGE WITH HEAT SPREADER
- Publication number 20110304032
- Publication date Dec 15, 2011
- Mary Jean Bajacan Ramos
- H01 - BASIC ELECTRIC ELEMENTS

Cap enclosing a plurality of side-by-side cavities [

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Package structure having lid with protrusion and manufacturing meth...

3DIC packaging with hot spot thermal management features

Proximity sensor including enclosed accommodation space with sealed...

Wearable device with combined sensing capabilities

Lid structure and semiconductor device package including the same

Semiconductor device

Proximity sensor including enclosed accommodation space with sealed...

3DIC packaging with hot spot thermal management features

Proximity sensor including enclosed accomodation space with sealed...

Semiconductor structure

Wearable device with combined sensing capabilities

Electronics package with improved thermal performance

Lid structure and semiconductor device package including the same

Integrated heat spreader having electromagnetically-formed features

Proximity sensor including enclosed accomodation space with sealed...

Methods and apparatus for thermal interface material (TIM) bond lin...

3DIC packaging with hot spot thermal management features

Semiconductor package structure and manufacturing method thereof

Making electrical components in handle wafers of integrated circuit...

Electronic package and fabrication method thereof

Making electrical components in handle wafers of integrated circuit...

Wearable device with combined sensing capabilities

3DIC packaging with hot spot thermal management features

Package with embedded electronic components and a waveguide cavity...

Sealing cap for electronic component

Multi-MEMS module

Circuit assemblies with multiple interposer substrates, and methods...

Top-side cooling of RF products in air cavity composite packages

Integrated circuit assemblies with reinforcement frames, and method...

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES

PROXIMITY SENSOR INCLUDING ENCLOSED ACCOMMODATION SPACE WITH SEALED...

WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES

PACKAGE ASSEMBLY LID AND METHODS FOR FORMING THE SAME

POWER SEMICONDUCTOR MODULE, METHOD FOR ASSEMBLING A POWER SEMICONDU...

Package Assembly Including Lid With Additional Stress Mitigating Fe...

PACKAGE ASSEMBLY INCLUDING A PACKAGE LID HAVING AN INNER FOOT AND M...

PROXIMITY SENSOR INCLUDING ENCLOSED ACCOMODATION SPACE WITH SEALED...

PROXIMITY SENSOR INCLUDING ENCLOSED ACCOMODATION SPACE WITH SEALED...

WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES

PROXIMITY SENSOR INCLUDING ENCLOSED ACCOMODATION SPACE WITH SEALED...

SEMICONDUCTOR DEVICE

MAKING ELECTRICAL COMPONENTS IN HANDLE WAFERS OF INTEGRATED CIRCUIT...

WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES

3DIC Packaging with Hot Spot Thermal Management Features

METHODS AND APPARATUS FOR THERMAL INTERFACE MATERIAL (TIM) BOND LIN...

MAKING ELECTRICAL COMPONENTS IN HANDLE WAFERS OF INTEGRATED CIRCUIT...

SEALING CAP FOR ELECTRONIC COMPONENT

3DIC Packaging with Hot Spot Thermal Management Features

Semiconductor Package with Temperature Sensor

Dual Compartment Semiconductor Package

MICROELECTRONIC WIRELESS TRANSMISSION DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Dual Compartment Semiconductor Package with Temperature Sensor

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

TRANSITION FROM A CHIP TO A WAVEGUIDE PORT

METHOD OF SEMICONDUCTOR DEVICE PROTECTION

NO LEAD PACKAGE WITH HEAT SPREADER