Cap-in-cap assemblies

Industry

CPC
H01L2924/1626

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1626Cap-in-cap assemblies

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,853,851
- Issue date Oct 7, 2014
- Fujitsu Semiconductor Limited
- Takumi Ihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system for shielding electromagnetic int...
- Patent number 8,178,956
- Issue date May 15, 2012
- Stats Chippac Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for sealing and cooling multi-chip modules
- Patent number 6,890,799
- Issue date May 10, 2005
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for sealing and cooling multi-chip modules
- Patent number 6,528,878
- Issue date Mar 4, 2003
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402398
- Publication date Dec 14, 2023
- Siliconware Precision Industries Co., Ltd.
- Che-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140370660
- Publication date Dec 18, 2014
- Takumi IHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging an Integrated Circuit Die
- Publication number 20130207246
- Publication date Aug 15, 2013
- ST-ERICSSON SA
- Nedyalko Slavov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120241942
- Publication date Sep 27, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Takumi Ihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM FOR SHIELDING ELECTROMAGNETIC INT...
- Publication number 20090152688
- Publication date Jun 18, 2009
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device for sealing and cooling multi-chip modules
- Publication number 20030103333
- Publication date Jun 5, 2003
- Hitachi, Ltd
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package enclosing multiple packaged chips
- Publication number 20030089977
- Publication date May 15, 2003
- Xilinx, Inc.
- Soon-Shin Chee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Cap-in-cap assemblies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing the same

Integrated circuit package system for shielding electromagnetic int...

Device for sealing and cooling multi-chip modules

Device for sealing and cooling multi-chip modules

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Packaging an Integrated Circuit Die

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGE SYSTEM FOR SHIELDING ELECTROMAGNETIC INT...

Device for sealing and cooling multi-chip modules

Package enclosing multiple packaged chips