Capacitors or dielectric substances

Industry

CPC
H05K1/0231

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0231Capacitors or dielectric substances

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multi-layer line structure
- Patent number 12,255,145
- Issue date Mar 18, 2025
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlaced crosstalk controlled traces, vias, and capacitors
- Patent number 12,225,658
- Issue date Feb 11, 2025
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and circuit board
- Patent number 12,185,452
- Issue date Dec 31, 2024
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Rui Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 12,177,964
- Issue date Dec 24, 2024
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-dielectric printed circuit board
- Patent number 12,120,811
- Issue date Oct 15, 2024
- Intel Corporation
- Arvind S
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 12,112,891
- Issue date Oct 8, 2024
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical receiver
- Patent number 12,104,950
- Issue date Oct 1, 2024
- Sumitomo Electric Industries, Ltd.
- Hiroshi Hara
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board including on-board integrated enclosure for e...
- Patent number 12,028,966
- Issue date Jul 2, 2024
- Marvell Asia Pte, Ltd.
- Shaowu Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged semiconductor device
- Patent number 11,955,479
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 11,950,361
- Issue date Apr 2, 2024
- VEEA INC.
- Shaun Joseph Greaney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 11,915,987
- Issue date Feb 27, 2024
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a computer device
- Patent number 11,889,615
- Issue date Jan 30, 2024
- Graphcore Limited
- Stephen Felix
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,889,616
- Issue date Jan 30, 2024
- Mitsubishi Electric Corporation
- Masatoshi Toyonaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer line structure and method for manufacturing thereof
- Patent number 11,862,564
- Issue date Jan 2, 2024
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter module for reducing differential and common mode noise and m...
- Patent number 11,849,537
- Issue date Dec 19, 2023
- Mahle International GmbH
- Juan Francisco Pardo Peris
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Circuit board with compact passive component arrangement
- Patent number 11,837,588
- Issue date Dec 5, 2023
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-phase step-down DC/DC power source device
- Patent number 11,824,429
- Issue date Nov 21, 2023
- Sony Interactive Entertainment Inc.
- Kazuki Sasao
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Substrate comprising an inductor and a capacitor located in an enca...
- Patent number 11,817,379
- Issue date Nov 14, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply system and electronic device
- Patent number 11,812,545
- Issue date Nov 7, 2023
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic module and electronic apparatus
- Patent number 11,792,917
- Issue date Oct 17, 2023
- Canon Kabushiki Kaisha
- Takuya Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlaced crosstalk controlled traces, vias, and capacitors
- Patent number 11,785,706
- Issue date Oct 10, 2023
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor integrated structure
- Patent number 11,756,989
- Issue date Sep 12, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Wei-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply system and electronic device
- Patent number 11,758,645
- Issue date Sep 12, 2023
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 11,749,597
- Issue date Sep 5, 2023
- Renesas Electronics Corporation
- Ryuichi Oikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density power module
- Patent number 11,678,468
- Issue date Jun 13, 2023
- DANA TM4 INC.
- Benoit Blanchard St-Jacques
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 11,636,978
- Issue date Apr 25, 2023
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including heat dissipation structure
- Patent number 11,627,654
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Chunghyo Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 11,626,363
- Issue date Apr 11, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and display device including the same
- Patent number 11,612,052
- Issue date Mar 21, 2023
- Samsung Display Co., Ltd.
- Hyo-Chul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250096073
- Publication date Mar 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Chiung-Ying KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING POWER SUPPLY DEVICE
- Publication number 20250096673
- Publication date Mar 20, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya HOSOTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND LAMINATED WIRING BOARD
- Publication number 20250081329
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20250056712
- Publication date Feb 13, 2025
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Capacitor and Circuit Board Containing the Same
- Publication number 20250029785
- Publication date Jan 23, 2025
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY BOARDS FOR WIRELESS COMMUNICATIONS DEVICES
- Publication number 20250008646
- Publication date Jan 2, 2025
- Plume Design, Inc.
- Chiu-Wen CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURALLY ENHANCED FILTERING OF CIRCUIT BOARD PLANES
- Publication number 20240422895
- Publication date Dec 19, 2024
- Microsoft Technology Licensing, LLC
- Jason HARRIGAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...
- Publication number 20240365464
- Publication date Oct 31, 2024
- Canon Kabushiki Kaisha
- HIROYUKI YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE AND SEMICONDUCTOR COMPOSITE APPARATUS
- Publication number 20240334591
- Publication date Oct 3, 2024
- Murata Manufacturing Co., Ltd.
- Takeshi FURUKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL CIRCUIT AND POWER SUPPLY DEVICE
- Publication number 20240314924
- Publication date Sep 19, 2024
- Sharp Kabushiki Kaisha
- TAKESHI SHIOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240306288
- Publication date Sep 12, 2024
- Hitachi Astemo, Ltd.
- Takashi OGURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH PERFORMANCE CAPACITORS AND CURRENT PATH ARRANGEMENTS
- Publication number 20240258034
- Publication date Aug 1, 2024
- Resonant Link, Inc.
- Aaron Stein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS
- Publication number 20240107661
- Publication date Mar 28, 2024
- KYOCERA DOCUMENT SOLUTIONS INC.
- Shotaro Ikegami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20240088040
- Publication date Mar 14, 2024
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ARRANGEMENT, PRINTED CIRCUIT BOARD ARRANGEMENT, ELECTRIC DR...
- Publication number 20240074040
- Publication date Feb 29, 2024
- ZF Friedrichshafen AG
- Florian Ullrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230403785
- Publication date Dec 14, 2023
- Mitsubishi Electric Corporation
- Masatoshi TOYONAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Semiconductor Device, Power Conversion Device, and Electric S...
- Publication number 20230395457
- Publication date Dec 7, 2023
- Hitachi Astemo, Ltd.
- Takahiro ARAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROSTRIP ROUTING CIRCUITS WITH DIELECTRIC FILMS
- Publication number 20230371172
- Publication date Nov 16, 2023
- Intel Corporation
- Alberto Carrillo Vazquez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLACED CROSSTALK CONTROLLED TRACES, VIAS, AND CAPACITORS
- Publication number 20230371169
- Publication date Nov 16, 2023
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL POWER SUPPLY SYSTEM AND MANUFACTURING METHOD OF CONNECTION...
- Publication number 20230363084
- Publication date Nov 9, 2023
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Hui LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STAND OFF STRUCTURES FOR ELECTRONIC CIRCUITS
- Publication number 20230135363
- Publication date May 4, 2023
- KROMEK LIMITED
- Franklin Dean Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME
- Publication number 20230119994
- Publication date Apr 20, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Moon Soo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND CIRCUIT BOARD
- Publication number 20230108158
- Publication date Apr 6, 2023
- HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Rui WANG
- G02 - OPTICS
Information Patent Application
ON-BOARD INTEGRATED ENCLOSURE FOR ELECTROMAGNETIC COMPATIBILITY SHI...
- Publication number 20230089254
- Publication date Mar 23, 2023
- Marvell Asia Pte, Ltd.
- Shaowu Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SYSTEM WITH POWER DISTRIBUTION NETWORK INCLUDING CAPACIT...
- Publication number 20230075019
- Publication date Mar 9, 2023
- SMOLTEK AB
- M Shafiqul Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTER CIRCUIT
- Publication number 20230047936
- Publication date Feb 16, 2023
- Mitsubishi Electric Corporation
- Fujiyuki NAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH COMPACT PASSIVE COMPONENT ARRANGEMENT
- Publication number 20230047285
- Publication date Feb 16, 2023
- ADVANCED MICRO DEVICES, INC.
- MILIND S. BHAGAVAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE WIRING SUBSTRATE INCORPORATING HIGH-FREQUENCY FILTER, HI...
- Publication number 20230039184
- Publication date Feb 9, 2023
- TOPPAN INC.
- Susumu MANIWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROWAVE DIELECTRIC ANALYZER
- Publication number 20230036023
- Publication date Feb 2, 2023
- Compass Technology Group, LLC
- John Weber Schultz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Procedure for Miniaturing a Multi-layer PCB
- Publication number 20230017840
- Publication date Jan 19, 2023
- Veea Inc.
- Shaun Joseph GREANEY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Capacitors or dielectric substances

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-layer line structure

Interlaced crosstalk controlled traces, vias, and capacitors

Display device and circuit board

Circuit board and manufacturing method thereof and electronic device

Multi-dielectric printed circuit board

Multilayer capacitor and circuit board containing the same

Optical receiver

Bonded structures with integrated passive component

Printed circuit board including on-board integrated enclosure for e...

Packaged semiconductor device

Method and procedure for miniaturing a multi-layer PCB

Semiconductor device

Method of manufacturing a computer device

Circuit board

Multi-layer line structure and method for manufacturing thereof

Filter module for reducing differential and common mode noise and m...

Circuit board with compact passive component arrangement

Multi-phase step-down DC/DC power source device

Substrate comprising an inductor and a capacitor located in an enca...

Power supply system and electronic device

Electronic module and electronic apparatus

Interlaced crosstalk controlled traces, vias, and capacitors

Capacitor integrated structure

Power supply system and electronic device

Semiconductor device

High density power module

Multilayer capacitor and circuit board containing the same

Electronic device including heat dissipation structure

Bonded structures with integrated passive component

Circuit board and display device including the same

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

SWITCHING POWER SUPPLY DEVICE

WIRING BOARD AND LAMINATED WIRING BOARD

MANUFACTURING METHOD OF CIRCUIT BOARD

Multilayer Capacitor and Circuit Board Containing the Same

POWER SUPPLY BOARDS FOR WIRELESS COMMUNICATIONS DEVICES

STRUCTURALLY ENHANCED FILTERING OF CIRCUIT BOARD PLANES

CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...

MODULE AND SEMICONDUCTOR COMPOSITE APPARATUS

CONTROL CIRCUIT AND POWER SUPPLY DEVICE

ELECTRONIC DEVICE

HIGH PERFORMANCE CAPACITORS AND CURRENT PATH ARRANGEMENTS

SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS

MULTI-LAYER LINE STRUCTURE

CIRCUIT ARRANGEMENT, PRINTED CIRCUIT BOARD ARRANGEMENT, ELECTRIC DR...

CIRCUIT BOARD

Power Semiconductor Device, Power Conversion Device, and Electric S...

MICROSTRIP ROUTING CIRCUITS WITH DIELECTRIC FILMS

INTERLACED CROSSTALK CONTROLLED TRACES, VIAS, AND CAPACITORS

VERTICAL POWER SUPPLY SYSTEM AND MANUFACTURING METHOD OF CONNECTION...

STAND OFF STRUCTURES FOR ELECTRONIC CIRCUITS

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME

DISPLAY DEVICE AND CIRCUIT BOARD

ON-BOARD INTEGRATED ENCLOSURE FOR ELECTROMAGNETIC COMPATIBILITY SHI...

ELECTRONIC SYSTEM WITH POWER DISTRIBUTION NETWORK INCLUDING CAPACIT...

FILTER CIRCUIT

CIRCUIT BOARD WITH COMPACT PASSIVE COMPONENT ARRANGEMENT

GLASS CORE WIRING SUBSTRATE INCORPORATING HIGH-FREQUENCY FILTER, HI...

MICROWAVE DIELECTRIC ANALYZER

Method and Procedure for Miniaturing a Multi-layer PCB