Capacitors

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H01L28/40

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

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H01L28/40Capacitors

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Patents Grantslast 30 patents

Information Patent Grant
Method for preparing semiconductor structure and semiconductor stru...
- Patent number 12,170,201
- Issue date Dec 17, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qiang Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits including composite dielectric layer
- Patent number 12,170,310
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Guruvayurappan S. Mathur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal insulator metal structure
- Patent number 12,170,241
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure and methods thereof
- Patent number 12,166,104
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitors for semiconductor devices
- Patent number 12,160,986
- Issue date Dec 3, 2024
- Micron Technology, Inc.
- Sujeet Ayyapureddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric MFM capacitor array and methods of making the same
- Patent number 12,154,938
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Chieh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacitance MIM device with self aligned spacer
- Patent number 12,154,939
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor array substrate and organic light-emitting dio...
- Patent number 12,150,345
- Issue date Nov 19, 2024
- Samsung Display Co., Ltd.
- Won-Se Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip electrostatic discharge sensor
- Patent number 12,148,748
- Issue date Nov 19, 2024
- The Regents of the University of California
- Subramanian Iyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer broadband ceramic capacitor with internal air gap capaci...
- Patent number 12,136,522
- Issue date Nov 5, 2024
- Presidio Components. Inc.
- Hung Van Trinh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,136,591
- Issue date Nov 5, 2024
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and method of forming the same
- Patent number 12,136,449
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-sided embeddable capacitors for packaged semiconductor devices
- Patent number 12,136,601
- Issue date Nov 5, 2024
- SARAS MICRO DEVICES, INC.
- Carlos Andres Riera Cercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,132,006
- Issue date Oct 29, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with dissimlar materials and methods
- Patent number 12,132,086
- Issue date Oct 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor trench capacitor structure and manufacturing method t...
- Patent number 12,119,414
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching circuit
- Patent number 12,119,206
- Issue date Oct 15, 2024
- ASM AMERICA, INC.
- Anton Mavretic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,119,292
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro through-silicon via for transistor density scaling
- Patent number 12,112,997
- Issue date Oct 8, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor capacitors having different capa...
- Patent number 12,113,096
- Issue date Oct 8, 2024
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Tobias Erlbacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal plate corner structure on metal insulator metal
- Patent number 12,107,041
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,107,025
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Yohei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,107,139
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Guk Il An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a booster layer and method for fabricatin...
- Patent number 12,106,904
- Issue date Oct 1, 2024
- SK Hynix Inc.
- Se-Hun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trimmable inductors for qubit frequency tuning
- Patent number 12,108,689
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Timothy Phung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming on-chip capacitor structures in semiconductor d...
- Patent number 12,108,603
- Issue date Oct 1, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic module, manufacturing method thereof and electronic pack...
- Patent number 12,100,648
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor (MIMCAP) and methods of forming the...
- Patent number 12,094,763
- Issue date Sep 17, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Kwang Sing Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having capacitor and manufacturing method thereof
- Patent number 12,087,809
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated capacitor
- Patent number 12,087,746
- Issue date Sep 10, 2024
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240420954
- Publication date Dec 19, 2024
- SK HYNIX INC.
- Se-Hun KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE
- Publication number 20240421059
- Publication date Dec 19, 2024
- TOPPAN Holdings Inc.
- Tsukasa Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240412971
- Publication date Dec 12, 2024
- SK HYNIX INC.
- Se-Hun KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING AN ELECTRONIC COMPONENT IN A CORE OF AN INTEGRATED CIRCUI...
- Publication number 20240413029
- Publication date Dec 12, 2024
- Microsoft Technology Licensing, LLC
- Jon Thomas Woodyard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20240405006
- Publication date Dec 5, 2024
- Intel Corporation
- Chong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHICALLY INTEGRATED SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20240404967
- Publication date Dec 5, 2024
- ENKRIS SEMICONDUCTOR (WUXI), LTD.
- Guoqiao TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240395719
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC DEVICES AND FERROELECTRIC MEMORY CELLS
- Publication number 20240395302
- Publication date Nov 28, 2024
- Micron Technology, Inc.
- Albert Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC CIRCUIT, PROCESSING UNIT, ELECTRONIC COMPONENT, AND ELECTRONI...
- Publication number 20240395825
- Publication date Nov 28, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Wataru UESUGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
- Publication number 20240387354
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wan-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387389
- Publication date Nov 21, 2024
- Sumitomo Electric Industries, Ltd.
- Harutoshi TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION RESISTANT SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURI...
- Publication number 20240387607
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Hajime SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CAPACITOR STRUCTURE
- Publication number 20240387606
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Qinghui ZHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CAPACITOR DEVICE WITH SELF ALIGNED SPACER
- Publication number 20240387613
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND SUBSTRATES FOR PACKAGES
- Publication number 20240379524
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Daehun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL
- Publication number 20240379529
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY O...
- Publication number 20240371737
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TRENCH CAPACITOR STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20240372014
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- FU-CHIANG KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...
- Publication number 20240363559
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED METAL INSULATOR METAL STRUCTURE
- Publication number 20240363505
- Publication date Oct 31, 2024
- TAIWAN SEMICONDUTOR MANUFACTURING COMPANY, LTD.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE OF CAPACITIVE DEVICE
- Publication number 20240363523
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TAI-YI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240363677
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-JIUN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...
- Publication number 20240363604
- Publication date Oct 31, 2024
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Zero Mask High Density Capacitor
- Publication number 20240363614
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE PASSIVE COMPONENT AND PREPARATION METHOD THEREFOR
- Publication number 20240355869
- Publication date Oct 24, 2024
- Dynax Semiconductor, Inc.
- Chenggong YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240355815
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CAPACITORS
- Publication number 20240355817
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Jyun Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH FERROELECTRIC CAPACITOR
- Publication number 20240349510
- Publication date Oct 17, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Haowen Bu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CAPACITOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240347579
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE STRUCTURE WITH CAPACITOR
- Publication number 20240339369
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for preparing semiconductor structure and semiconductor stru...

Integrated circuits including composite dielectric layer

Embedded metal insulator metal structure

Gate structure and methods thereof

Decoupling capacitors for semiconductor devices

Ferroelectric MFM capacitor array and methods of making the same

High capacitance MIM device with self aligned spacer

Thin film transistor array substrate and organic light-emitting dio...

On-chip electrostatic discharge sensor

Multilayer broadband ceramic capacitor with internal air gap capaci...

Through electrode substrate and semiconductor device

Capacitor structure and method of forming the same

Single-sided embeddable capacitors for packaged semiconductor devices

Semiconductor package structure

Semiconductor devices with dissimlar materials and methods

Semiconductor trench capacitor structure and manufacturing method t...

Switching circuit

Semiconductor device and method of manufacture

Micro through-silicon via for transistor density scaling

Method for producing semiconductor capacitors having different capa...

Metal plate corner structure on metal insulator metal

Semiconductor device

Semiconductor device

Semiconductor device with a booster layer and method for fabricatin...

Trimmable inductors for qubit frequency tuning

Methods for forming on-chip capacitor structures in semiconductor d...

Electronic module, manufacturing method thereof and electronic pack...

Metal-insulator-metal capacitor (MIMCAP) and methods of forming the...

Semiconductor device having capacitor and manufacturing method thereof

Microelectronic assemblies having an integrated capacitor

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

EMBEDDING AN ELECTRONIC COMPONENT IN A CORE OF AN INTEGRATED CIRCUI...

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

MONOLITHICALLY INTEGRATED SEMICONDUCTOR DEVICE STRUCTURE

SEMICONDUCTOR PACKAGE

FERROELECTRIC DEVICES AND FERROELECTRIC MEMORY CELLS

LOGIC CIRCUIT, PROCESSING UNIT, ELECTRONIC COMPONENT, AND ELECTRONI...

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING

SEMICONDUCTOR DEVICE

RADIATION RESISTANT SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURI...

METHOD FOR MANUFACTURING CAPACITOR STRUCTURE

CAPACITOR DEVICE WITH SELF ALIGNED SPACER

SEMICONDUCTOR PACKAGES AND SUBSTRATES FOR PACKAGES

METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL

PACKAGE SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY O...

SEMICONDUCTOR TRENCH CAPACITOR STRUCTURE AND MANUFACTURING METHOD T...

INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...

EMBEDDED METAL INSULATOR METAL STRUCTURE

INTEGRATED CIRCUIT STRUCTURE OF CAPACITIVE DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...

Zero Mask High Density Capacitor

COMPOSITE PASSIVE COMPONENT AND PREPARATION METHOD THEREFOR

STACKED SEMICONDUCTOR DEVICE AND METHOD

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CAPACITORS

INTEGRATED CIRCUIT DEVICE WITH FERROELECTRIC CAPACITOR

SEMICONDUCTOR DEVICE HAVING CAPACITOR AND MANUFACTURING METHOD THEREOF

STRUCTURE AND FORMATION METHOD OF PACKAGE STRUCTURE WITH CAPACITOR