Capacitors

Industry

CPC
H01L28/40

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

Current Industry

H01L28/40Capacitors

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Body tie optimization for stacked transistor amplifier
- Patent number 12,231,087
- Issue date Feb 18, 2025
- pSemi Corporation
- Simon Edward Willard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal structure
- Patent number 12,230,566
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact capacitor structure
- Patent number 12,218,257
- Issue date Feb 4, 2025
- Realtek Semiconductor Corporation
- Jian Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) packages employing a capacitor-embedded, re...
- Patent number 12,218,041
- Issue date Feb 4, 2025
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,211,836
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring
- Patent number 12,205,885
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench pattern for trench capacitor yield improvement
- Patent number 12,205,982
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar capacitor and method of fabricating such
- Patent number 12,200,941
- Issue date Jan 14, 2025
- Kepler Computing Inc.
- Gaurav Thareja
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor arrangement and method of making
- Patent number 12,191,248
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wan-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective area metal process for improved metallurgical bonding of...
- Patent number 12,191,346
- Issue date Jan 7, 2025
- SARAS MICRO DEVICES, INC.
- Bartlet DeProspo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density metal insulator metal capacitor
- Patent number 12,191,347
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Kai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including capacitor and resistor
- Patent number 12,183,670
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded interconnects in bridges for integrated-circuit packages
- Patent number 12,183,722
- Issue date Dec 31, 2024
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,302
- Issue date Dec 31, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Atsushi Umezaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming capacitor via
- Patent number 12,183,776
- Issue date Dec 31, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chunyang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable metal—insulator—metal capacitor and devices
- Patent number 12,183,669
- Issue date Dec 31, 2024
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor structure and semiconductor stru...
- Patent number 12,170,201
- Issue date Dec 17, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qiang Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal insulator metal structure
- Patent number 12,170,241
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits including composite dielectric layer
- Patent number 12,170,310
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Guruvayurappan S. Mathur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure and methods thereof
- Patent number 12,166,104
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitors for semiconductor devices
- Patent number 12,160,986
- Issue date Dec 3, 2024
- Micron Technology, Inc.
- Sujeet Ayyapureddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric MFM capacitor array and methods of making the same
- Patent number 12,154,938
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Chieh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacitance MIM device with self aligned spacer
- Patent number 12,154,939
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip electrostatic discharge sensor
- Patent number 12,148,748
- Issue date Nov 19, 2024
- The Regents of the University of California
- Subramanian Iyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor array substrate and organic light-emitting dio...
- Patent number 12,150,345
- Issue date Nov 19, 2024
- Samsung Display Co., Ltd.
- Won-Se Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer broadband ceramic capacitor with internal air gap capaci...
- Patent number 12,136,522
- Issue date Nov 5, 2024
- Presidio Components. Inc.
- Hung Van Trinh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,136,591
- Issue date Nov 5, 2024
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and method of forming the same
- Patent number 12,136,449
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-sided embeddable capacitors for packaged semiconductor devices
- Patent number 12,136,601
- Issue date Nov 5, 2024
- SARAS MICRO DEVICES, INC.
- Carlos Andres Riera Cercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,132,006
- Issue date Oct 29, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH-FREQUENCY HIGH-POWER DENSITY MODULE POWER SUPPLY, PARALLEL COM...
- Publication number 20250062243
- Publication date Feb 20, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250054877
- Publication date Feb 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE INCLUDING BRIDGE STRUCTURE AND METHOD OF MANUFACTUR...
- Publication number 20250054867
- Publication date Feb 13, 2025
- SILICON BOX PTE. LTD.
- Byung Joon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL DEVICE WITH HIGH-K LAYER CAPPING STRUCTURE
- Publication number 20250056820
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Liang-Shiuan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY MODULE
- Publication number 20250038157
- Publication date Jan 30, 2025
- Murata Manufacturing Co., Ltd.
- Takami MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR ARRAY SUBSTRATE AND ORGANIC LIGHT-EMITTING DIO...
- Publication number 20250040349
- Publication date Jan 30, 2025
- SAMSUNG DISPLAY CO., LTD.
- Won-Se Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC SUBSTRATE WITH SUPPORT STRUCTURE AND FUNCTIONAL INLAYS THEREIN
- Publication number 20250038117
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald WEIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A BOOSTER LAYER AND METHOD FOR FABRICATIN...
- Publication number 20250022655
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Se-Hun KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250015064
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Yoon Young JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH COVERED MAGNETIC MOLD COMPOUND
- Publication number 20250006575
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING THIN FIL...
- Publication number 20250006571
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Integrated Voltage Regulator For Integrated Circuits
- Publication number 20250006706
- Publication date Jan 2, 2025
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP MODULE
- Publication number 20250006715
- Publication date Jan 2, 2025
- LG Innotek Co., Ltd.
- Byung Hyun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING A CAPACITIVE ELEMENT, AND CORRESPONDIN...
- Publication number 20240429232
- Publication date Dec 26, 2024
- STMicroelectronics International N.V.
- Abderrezak MARZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING
- Publication number 20240429131
- Publication date Dec 26, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH INDUCTORS AND CAPACITORS THAT ARE EMBEDDED WITHIN...
- Publication number 20240429217
- Publication date Dec 26, 2024
- Monolithic Power Systems, Inc.
- Daocheng HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240420954
- Publication date Dec 19, 2024
- SK HYNIX INC.
- Se-Hun KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE
- Publication number 20240421059
- Publication date Dec 19, 2024
- TOPPAN Holdings Inc.
- Tsukasa Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240412971
- Publication date Dec 12, 2024
- SK HYNIX INC.
- Se-Hun KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING AN ELECTRONIC COMPONENT IN A CORE OF AN INTEGRATED CIRCUI...
- Publication number 20240413029
- Publication date Dec 12, 2024
- Microsoft Technology Licensing, LLC
- Jon Thomas Woodyard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20240405006
- Publication date Dec 5, 2024
- Intel Corporation
- Chong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHICALLY INTEGRATED SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20240404967
- Publication date Dec 5, 2024
- ENKRIS SEMICONDUCTOR (WUXI), LTD.
- Guoqiao TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240395719
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC DEVICES AND FERROELECTRIC MEMORY CELLS
- Publication number 20240395302
- Publication date Nov 28, 2024
- Micron Technology, Inc.
- Albert Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC CIRCUIT, PROCESSING UNIT, ELECTRONIC COMPONENT, AND ELECTRONI...
- Publication number 20240395825
- Publication date Nov 28, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Wataru UESUGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION RESISTANT SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURI...
- Publication number 20240387607
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Hajime SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
- Publication number 20240387354
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wan-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387389
- Publication date Nov 21, 2024
- Sumitomo Electric Industries, Ltd.
- Harutoshi TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CAPACITOR STRUCTURE
- Publication number 20240387606
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Qinghui ZHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Body tie optimization for stacked transistor amplifier

Metal-insulator-metal structure

Compact capacitor structure

Integrated circuit (IC) packages employing a capacitor-embedded, re...

Semiconductor device and manufacturing method thereof

Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring

Trench pattern for trench capacitor yield improvement

Pillar capacitor and method of fabricating such

Semiconductor arrangement and method of making

Selective area metal process for improved metallurgical bonding of...

High density metal insulator metal capacitor

Semiconductor device including capacitor and resistor

Molded interconnects in bridges for integrated-circuit packages

Semiconductor device

Method for forming capacitor via

Configurable metal—insulator—metal capacitor and devices

Method for preparing semiconductor structure and semiconductor stru...

Embedded metal insulator metal structure

Integrated circuits including composite dielectric layer

Gate structure and methods thereof

Decoupling capacitors for semiconductor devices

Ferroelectric MFM capacitor array and methods of making the same

High capacitance MIM device with self aligned spacer

On-chip electrostatic discharge sensor

Thin film transistor array substrate and organic light-emitting dio...

Multilayer broadband ceramic capacitor with internal air gap capaci...

Through electrode substrate and semiconductor device

Capacitor structure and method of forming the same

Single-sided embeddable capacitors for packaged semiconductor devices

Semiconductor package structure

Patents Applicationslast 30 patents

HIGH-FREQUENCY HIGH-POWER DENSITY MODULE POWER SUPPLY, PARALLEL COM...

SEMICONDUCTOR PACKAGE STRUCTURE

FAN-OUT PACKAGE INCLUDING BRIDGE STRUCTURE AND METHOD OF MANUFACTUR...

METAL-INSULATOR-METAL DEVICE WITH HIGH-K LAYER CAPPING STRUCTURE

POWER SUPPLY MODULE

THIN FILM TRANSISTOR ARRAY SUBSTRATE AND ORGANIC LIGHT-EMITTING DIO...

IC SUBSTRATE WITH SUPPORT STRUCTURE AND FUNCTIONAL INLAYS THEREIN

SEMICONDUCTOR DEVICE WITH A BOOSTER LAYER AND METHOD FOR FABRICATIN...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Multi-Die Fine Grain Integrated Voltage Regulation

SEMICONDUCTOR PACKAGE WITH COVERED MAGNETIC MOLD COMPOUND

METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING THIN FIL...

Backside Integrated Voltage Regulator For Integrated Circuits

SIP MODULE

INTEGRATED CIRCUIT INCLUDING A CAPACITIVE ELEMENT, AND CORRESPONDIN...

MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING

POWER MODULE WITH INDUCTORS AND CAPACITORS THAT ARE EMBEDDED WITHIN...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

EMBEDDING AN ELECTRONIC COMPONENT IN A CORE OF AN INTEGRATED CIRCUI...

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

MONOLITHICALLY INTEGRATED SEMICONDUCTOR DEVICE STRUCTURE

SEMICONDUCTOR PACKAGE

FERROELECTRIC DEVICES AND FERROELECTRIC MEMORY CELLS

LOGIC CIRCUIT, PROCESSING UNIT, ELECTRONIC COMPONENT, AND ELECTRONI...

RADIATION RESISTANT SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURI...

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING CAPACITOR STRUCTURE