Carbon

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CPC
H01L23/49877

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49877Carbon

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power module and fabrication method of the same, graphite plate, an...
- Patent number 12,046,532
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 11,955,416
- Issue date Apr 9, 2024
- Macronix International Co., Ltd.
- Cheng-Hsien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including thermal circuits and methods of...
- Patent number 11,791,315
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,605,582
- Issue date Mar 14, 2023
- Fuji Electric Co., Ltd.
- Takahiro Mitsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 11,437,309
- Issue date Sep 6, 2022
- STMICROELECTRONICS S.r.l.
- Alberto Arrigoni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphite-laminated chip-on-film-type semiconductor package allowing...
- Patent number 11,437,556
- Issue date Sep 6, 2022
- Hag Mo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package carrier board, method for fabricating the sam...
- Patent number 11,404,348
- Issue date Aug 2, 2022
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and fabrication method of the same, graphite plate, an...
- Patent number 11,367,669
- Issue date Jun 21, 2022
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphite-laminated chip-on-film-type semiconductor package having i...
- Patent number 11,355,687
- Issue date Jun 7, 2022
- Hag Mo Kim
- G02 - OPTICS
Information Patent Grant
Structure and formation method of chip package with shielding struc...
- Patent number 11,270,953
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including thermal circuits and methods of...
- Patent number 11,171,118
- Issue date Nov 9, 2021
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with stabilizing structure for interface adhesion
- Patent number 11,127,670
- Issue date Sep 21, 2021
- AT&S (China) Co. Ltd.
- Artan Baftiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device including a through-silicon via structure
- Patent number 10,658,280
- Issue date May 19, 2020
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with a bypass capacitance comprising dielectric f...
- Patent number 10,568,208
- Issue date Feb 18, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wilhelm Tamm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board
- Patent number 10,424,529
- Issue date Sep 24, 2019
- DENKA COMPANY LIMITED
- Ryota Aono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon nitride substrate and silicon nitride circuit board using t...
- Patent number 10,322,934
- Issue date Jun 18, 2019
- Kabushiki Kaisha Toshiba
- Noritaka Nakayama
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Semiconductor arrangement, semiconductor system and method of formi...
- Patent number 10,115,646
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard structure for signal isolation
- Patent number 9,991,209
- Issue date Jun 5, 2018
- Dunlin Tan
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of manufacturing a flexible substrate with carbon nanotube v...
- Patent number 9,941,198
- Issue date Apr 10, 2018
- SHT SMART HIGH-TECH AB
- Johan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functionalized boron nitride materials and methods for their prepar...
- Patent number 9,859,034
- Issue date Jan 2, 2018
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Angele Sjong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for patterning a graphene layer and method for manufacturing...
- Patent number 9,633,899
- Issue date Apr 25, 2017
- BOE Technology Group Co., Ltd.
- Shi Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride substrate and silicon nitride circuit board using t...
- Patent number 9,630,846
- Issue date Apr 25, 2017
- Kabushiki Kaisha Toshiba
- Noritaka Nakayama
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 9,209,125
- Issue date Dec 8, 2015
- Kabushiki Kaisha Toshiba
- Atsunobu Isobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting and bonding adjacent layers with nanostructures
- Patent number 8,815,332
- Issue date Aug 26, 2014
- Smoltek AB
- Mohammad Shafiqul Kabir
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Carbon nanotube-based conductive connections for integrated circuit...
- Patent number 8,680,677
- Issue date Mar 25, 2014
- NXP B.V.
- Christopher Wyland
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electrochemical-codeposition methods for forming carbon nanotube re...
- Patent number 8,663,446
- Issue date Mar 4, 2014
- University of Central Florida Research Foundation, Inc.
- Quanfang Chen
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Carbon nanotube-reinforced solder caps, and chip packages and syste...
- Patent number 8,391,016
- Issue date Mar 5, 2013
- Intel Corporation
- Chi-won Hwang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Connecting and bonding adjacent layers with nanostructures
- Patent number 8,253,253
- Issue date Aug 28, 2012
- Smoltek AB
- Andrzej Brud
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Connecting and bonding adjacent layers with nanostructures
- Patent number 8,106,517
- Issue date Jan 31, 2012
- Smoltek AB
- Mohammad Shafiqul Kabir
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Nano-powder-based coating and ink compositions
- Patent number 7,736,693
- Issue date Jun 15, 2010
- Cima NanoTech Israel Ltd.
- Arkady Garbar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Making Redistribution Layers wit...
- Publication number 20250022792
- Publication date Jan 16, 2025
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS
- Publication number 20250006781
- Publication date Jan 2, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...
- Publication number 20240332122
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...
- Publication number 20240312865
- Publication date Sep 19, 2024
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming RDL with Graphene-Coated...
- Publication number 20240234291
- Publication date Jul 11, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20240234292
- Publication date Jul 11, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240203858
- Publication date Jun 20, 2024
- Macronix International Co., Ltd.
- Cheng-Hsien LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS
- Publication number 20240063134
- Publication date Feb 22, 2024
- Intel Corporation
- Xiaoning Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME
- Publication number 20230335483
- Publication date Oct 19, 2023
- Kabushiki Kaisha Toshiba
- Kazumitsu MORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND PACKAGING DEVICE ARCHITETCURE AND METHOD OF MAKING F...
- Publication number 20230298964
- Publication date Sep 21, 2023
- Islam Salama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230079160
- Publication date Mar 16, 2023
- Macronix International Co., Ltd.
- Cheng-Hsien LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...
- Publication number 20220310479
- Publication date Sep 29, 2022
- ROHM CO., LTD.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION METHOD OF CHIP PACKAGE
- Publication number 20220189884
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yao CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC CAPACITANCE RECOVERY OF INTER-LAYER DIELECTRIC LAYERS FO...
- Publication number 20220102279
- Publication date Mar 31, 2022
- Intel Corporation
- Atul MADHAVAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220077044
- Publication date Mar 10, 2022
- Fuji Electric Co., Ltd.
- Takahiro MITSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING THERMAL CIRCUITS AND METHODS OF...
- Publication number 20220059508
- Publication date Feb 24, 2022
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHITE-LAMINATED CHIP-ON-FILM-TYPE SEMICONDUCTOR PACKAGE HAVING I...
- Publication number 20210074625
- Publication date Mar 11, 2021
- Hag Mo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING THERMAL CIRCUITS AND METHODS OF...
- Publication number 20210005575
- Publication date Jan 7, 2021
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20200402900
- Publication date Dec 24, 2020
- STMicroelectronics S.r.l.
- Alberto Arrigoni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE CARRIER BOARD, METHOD FOR FABRICATING THE SAM...
- Publication number 20200388552
- Publication date Dec 10, 2020
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier
- Publication number 20200243436
- Publication date Jul 30, 2020
- AT&S (China) Co. Ltd.
- Artan Baftiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICE
- Publication number 20190206778
- Publication date Jul 4, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...
- Publication number 20180145007
- Publication date May 24, 2018
- ROHM CO., LTD.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON NITRIDE SUBSTRATE AND SILICON NITRIDE CIRCUIT BOARD USING T...
- Publication number 20180134558
- Publication date May 17, 2018
- Kabushiki Kaisha Toshiba
- Noritaka NAKAYAMA
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20180090451
- Publication date Mar 29, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoshihisa MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With a Bypass Capacitance Comprising Dielectric F...
- Publication number 20180035543
- Publication date Feb 1, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wilhelm Tamm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FUNCTIONALIZED CARBON NANOTUBES
- Publication number 20170267532
- Publication date Sep 21, 2017
- SHT SMART HIGH TECH AB
- Johan LIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING A FLEXIBLE SUBSTRATE WITH CARBON NANOTUBE V...
- Publication number 20170040250
- Publication date Feb 9, 2017
- SHT SMART HIGH TECH AB
- Johan LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC CIRCUIT BOARD
- Publication number 20160358840
- Publication date Dec 8, 2016
- DENKA COMPANY LIMITED
- Ryota AONO
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
INTEGRATION OF BACKSIDE HEAT SPREADER FOR THERMAL MANAGEMENT
- Publication number 20160093552
- Publication date Mar 31, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module and fabrication method of the same, graphite plate, an...

Semiconductor structure and method for manufacturing the same

Semiconductor assemblies including thermal circuits and methods of...

Semiconductor device

Method of manufacturing semiconductor devices and corresponding sem...

Graphite-laminated chip-on-film-type semiconductor package allowing...

Semiconductor package carrier board, method for fabricating the sam...

Power module and fabrication method of the same, graphite plate, an...

Graphite-laminated chip-on-film-type semiconductor package having i...

Structure and formation method of chip package with shielding struc...

Semiconductor assemblies including thermal circuits and methods of...

Component carrier with stabilizing structure for interface adhesion

Electrical device including a through-silicon via structure

Component carrier with a bypass capacitance comprising dielectric f...

Ceramic circuit board

Silicon nitride substrate and silicon nitride circuit board using t...

Semiconductor arrangement, semiconductor system and method of formi...

Guard structure for signal isolation

Method of manufacturing a flexible substrate with carbon nanotube v...

Functionalized boron nitride materials and methods for their prepar...

Method for patterning a graphene layer and method for manufacturing...

Silicon nitride substrate and silicon nitride circuit board using t...

Semiconductor device and manufacturing method of the same

Connecting and bonding adjacent layers with nanostructures

Carbon nanotube-based conductive connections for integrated circuit...

Electrochemical-codeposition methods for forming carbon nanotube re...

Carbon nanotube-reinforced solder caps, and chip packages and syste...

Connecting and bonding adjacent layers with nanostructures

Connecting and bonding adjacent layers with nanostructures

Nano-powder-based coating and ink compositions

Patents Applicationslast 30 patents

Semiconductor Device and Method of Making Redistribution Layers wit...

CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS

POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...

Semiconductor Device and Method of Forming RDL with Graphene-Coated...

Semiconductor Device and Method of Making a Semiconductor Package w...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS

INSULATING CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME

INTERPOSER AND PACKAGING DEVICE ARCHITETCURE AND METHOD OF MAKING F...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...

FORMATION METHOD OF CHIP PACKAGE

DIELECTRIC CAPACITANCE RECOVERY OF INTER-LAYER DIELECTRIC LAYERS FO...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR ASSEMBLIES INCLUDING THERMAL CIRCUITS AND METHODS OF...

GRAPHITE-LAMINATED CHIP-ON-FILM-TYPE SEMICONDUCTOR PACKAGE HAVING I...

SEMICONDUCTOR ASSEMBLIES INCLUDING THERMAL CIRCUITS AND METHODS OF...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR PACKAGE CARRIER BOARD, METHOD FOR FABRICATING THE SAM...

Component Carrier

ELECTRICAL DEVICE

POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...

SILICON NITRIDE SUBSTRATE AND SILICON NITRIDE CIRCUIT BOARD USING T...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Component Carrier With a Bypass Capacitance Comprising Dielectric F...

MULTI-FUNCTIONALIZED CARBON NANOTUBES

METHOD OF MANUFACTURING A FLEXIBLE SUBSTRATE WITH CARBON NANOTUBE V...

CERAMIC CIRCUIT BOARD

INTEGRATION OF BACKSIDE HEAT SPREADER FOR THERMAL MANAGEMENT