Catalytic ink or adhesive for electroless plating

Industry

CPC
H05K2203/0709

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0709Catalytic ink or adhesive for electroless plating

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Plasma treatments for flexures of hard disk drives
- Patent number 12,129,567
- Issue date Oct 29, 2024
- Hutchinson Technology Incorporated
- Kurt F. Fischer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 11,503,718
- Issue date Nov 15, 2022
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalytic ink comprising metallic material made from diamminesilver...
- Patent number 11,089,692
- Issue date Aug 10, 2021
- Taiwan Green Point Enterprises Co., Ltd.
- Pen-Yi Liao
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 10,905,014
- Issue date Jan 26, 2021
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless copper plating polydopamine nanoparticles
- Patent number 10,760,162
- Issue date Sep 1, 2020
- The Research Foundation for the State University of New York
- Siyuan Ma
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Fabrication method of substrate structure
- Patent number 10,764,995
- Issue date Sep 1, 2020
- Siliconware Precision Industries Co., Ltd.
- Jin-Wei You
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 10,667,407
- Issue date May 26, 2020
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of fast fabrication of single and multilayer circuit with h...
- Patent number 10,660,217
- Issue date May 19, 2020
- Jun Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for reducing the optical reflectivity of a copper and copper...
- Patent number 10,448,515
- Issue date Oct 15, 2019
- Atotech Deutschland GmbH
- Kuldip Johal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 10,433,428
- Issue date Oct 1, 2019
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pixel definition layer and manufacturing method thereof, display su...
- Patent number 10,333,066
- Issue date Jun 25, 2019
- BOE Technology Group Co., Ltd.
- Wenjun Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate structure of metal coating
- Patent number 10,306,774
- Issue date May 28, 2019
- Electroplating Engineers of Japan Limited
- Masahiro Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating polydopamine nanoparticles
- Patent number 10,294,567
- Issue date May 21, 2019
- The Research Foundation for the State University of New York
- Siyuan Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Polymer product and method for selectively metallizing polymer subs...
- Patent number 10,161,044
- Issue date Dec 25, 2018
- BYD Company Limited
- Wei Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for fine line manufacturing
- Patent number 10,151,980
- Issue date Dec 11, 2018
- Atotech Deutschland GmbH
- David Thomas Baron
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Catalyst for a catalytic ink and uses thereof
- Patent number 10,154,596
- Issue date Dec 11, 2018
- Taiwan Green Point Enterprises Co., Ltd.
- Pen-Yi Liao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metal compound, method for preparing the same, selective metallizat...
- Patent number 10,059,852
- Issue date Aug 28, 2018
- Shenzhen BYD Auto R&D Company Limited
- Qing Gong
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Antenna structure and method for manufacturing antenna
- Patent number 9,972,898
- Issue date May 15, 2018
- Wistron NeWeb Corp.
- Tzu-Min Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and fabrication method thereof
- Patent number 9,907,161
- Issue date Feb 27, 2018
- Siliconware Precision Industries Co., Ltd.
- Jin-Wei You
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit-and-heat-dissipation assembly and method of making the same
- Patent number 9,713,263
- Issue date Jul 18, 2017
- Taiwan Green Point Enterprises Co., Ltd.
- Pen-Yi Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via in a printed circuit board
- Patent number 9,706,667
- Issue date Jul 11, 2017
- Sierra Circuits, Inc.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via in a printed circuit board
- Patent number 9,674,967
- Issue date Jun 6, 2017
- Sierra Circuits, Inc.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Absorbing-layer-forming composition and absorbing substrate, printe...
- Patent number 9,650,522
- Issue date May 16, 2017
- DIC Corporation
- Wataru Fujikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming high-definition metal pattern, high-definition m...
- Patent number 9,629,253
- Issue date Apr 18, 2017
- DIC Corporation
- Sunao Yoshihara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Antenna and communication apparatus as well as manufacturing method...
- Patent number 9,520,644
- Issue date Dec 13, 2016
- Shuhou Co., Ltd.
- Kouji Muraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ink formulations for flexographic printing of high-resolution condu...
- Patent number 9,511,582
- Issue date Dec 6, 2016
- Eastman Kodak Company
- Danliang Jin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ink composition and circuit board and method for producing the same
- Patent number 9,502,151
- Issue date Nov 22, 2016
- BYD Company Limited
- Haibin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stabilized silver catalysts and methods
- Patent number 9,451,707
- Issue date Sep 20, 2016
- Dow Global Technologies LLC
- Kurt F. Hirsekorn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming patterned conductive film
- Patent number 9,435,032
- Issue date Sep 6, 2016
- Japan Science and Technology Agency
- Tatsuya Shimoda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Via in a printed circuit board
- Patent number 9,398,703
- Issue date Jul 19, 2016
- Sierra Circuits, Inc.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A STRUCTURE HAVING CONDUCTIVE LINES
- Publication number 20210329790
- Publication date Oct 21, 2021
- Industrial Technology Research Institute
- Yu-Ming WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...
- Publication number 20200022265
- Publication date Jan 16, 2020
- Molex, LLC
- Marko SPIEGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE STRUCTURE OF METAL COATING
- Publication number 20190090357
- Publication date Mar 21, 2019
- ELECTROPLATING ENGINEERS OF JAPAN LIMITED
- Masahiro ITO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CATALYST FOR A CATALYTIC INK AND USES THEREOF
- Publication number 20190075659
- Publication date Mar 7, 2019
- TAIWAN GREEN POINT ENTERPRISES CO. LTD.
- Pen-Yi LIAO
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
STRUCTURE OF CONDUCTIVE LINES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190053381
- Publication date Feb 14, 2019
- Industrial Technology Research Institute
- Yu-Ming WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATION METHOD OF SUBSTRATE STRUCTURE
- Publication number 20180139840
- Publication date May 17, 2018
- Siliconware Precision Industries Co., Ltd.
- Jin-Wei You
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR REDUCING THE OPTICAL REFLECTIVITY OF A COPPER AND COPPER...
- Publication number 20170245372
- Publication date Aug 24, 2017
- Atotech Deutschland GmbH
- Kuldip JOHAL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
VIA IN A PRINTED CIRCUIT BOARD
- Publication number 20160295708
- Publication date Oct 6, 2016
- SIERRA CIRCUITS, INC.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CATALYST FOR A CATALYTIC INK AND USES THEREOF
- Publication number 20160289469
- Publication date Oct 6, 2016
- TAIWAN GREEN POINT ENTERPRISES CO., LTD.
- Pen-Yi LIAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANTENNA AND COMMUNICATION APPARATUS AS WELL AS MANUFACTURING METHOD...
- Publication number 20140333484
- Publication date Nov 13, 2014
- SHUHOU CO., LTD.
- Kouji Muraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL COMPOUND, METHOD FOR PREPARING THE SAME, SELECTIVE METALLIZAT...
- Publication number 20140290530
- Publication date Oct 2, 2014
- BYD COMPANY LIMITED
- Qing GONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FABRICATING COPPER-NICKEL MICRO MESH CONDUCTORS
- Publication number 20140246226
- Publication date Sep 4, 2014
- Uni-Pixel Displays, Inc.
- Danliang Jin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF ROLL TO ROLL PRINTING OF FINE LINES AND FEATURES WITH AN...
- Publication number 20140248423
- Publication date Sep 4, 2014
- Uni-Pixel Displays, Inc.
- Ed S. Ramakrishnan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FABRICATING A CONDUCTIVE PATTERN WITH HIGH OPTICAL TRANSM...
- Publication number 20140248422
- Publication date Sep 4, 2014
- Uni-Pixel Displays, Inc.
- Danliang Jin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR FORMING PATTERNED CONDUCTIVE FILM
- Publication number 20140227436
- Publication date Aug 14, 2014
- Japan Science and Technology Agency
- Tatsuya Shimoda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STABILIZED SILVER CATALYSTS AND METHODS
- Publication number 20140171296
- Publication date Jun 19, 2014
- DOW GLOBAL TECHNOLOGIES LLC
- Kurt F. HIRSEKORN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING A METAL CLAD CIRCUIT BOARD
- Publication number 20140141548
- Publication date May 22, 2014
- Tyco Electronics Corporation
- Matthew Edward Mostoller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible Circuit Chemistry
- Publication number 20130230667
- Publication date Sep 5, 2013
- SRI International
- Sunity Sharma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FILM MATERIAL AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130186672
- Publication date Jul 25, 2013
- FUJIFILM CORPORATION
- Toshihiro KARIYA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
FORMATION OF ELECTRICALLY CONDUCTIVE PATTERN BY SURFACE ENERGY MODI...
- Publication number 20130146332
- Publication date Jun 13, 2013
- UNIPIXEL DISPLAYS ,INC.
- Ed S. Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING MICRO STRUCTURED SURFACES WITH ELECTRICALLY C...
- Publication number 20130075946
- Publication date Mar 28, 2013
- UniPixel Displays, Inc.
- Robert J. Petcavich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL CLAD CIRCUIT BOARD
- Publication number 20130051018
- Publication date Feb 28, 2013
- Tyco Electronics Corporation
- MATTHEW E. MOSTOLLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of Solid Layers on Substrates
- Publication number 20130040154
- Publication date Feb 14, 2013
- CONDUCTIVE INKJET TECHNOLOGY LIMITED
- Philip Gareth Bentley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING PATTERNED CONDUCTIVE FILM
- Publication number 20120298402
- Publication date Nov 29, 2012
- JSR Corporation
- Tatsuya Shimoda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MAKING A BIOCHEMICAL TEST STRIP
- Publication number 20120241070
- Publication date Sep 27, 2012
- Jian-Hua CHEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Selective Seed Layer Treatment for Feature Plating
- Publication number 20120139112
- Publication date Jun 7, 2012
- QUALCOMM Incorporated
- Omar J. Bchir
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER CONDUCTOR FILM AND MANUFACTURING METHOD THEREOF, CONDUCTIVE...
- Publication number 20120125659
- Publication date May 24, 2012
- Hideo Nakako
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING METAL THIN FILM
- Publication number 20120103222
- Publication date May 3, 2012
- SONY CORPORATION
- Masanobu Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT CHEMISTRY
- Publication number 20120100286
- Publication date Apr 26, 2012
- SRI International
- Sunity Sharma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing Method for Forming Circuit Structure on Non-Conductiv...
- Publication number 20120074094
- Publication date Mar 29, 2012
- KUANG HONG PRECISION CO., LTD.
- Cheng-Feng Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Catalytic ink or adhesive for electroless plating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plasma treatments for flexures of hard disk drives

Application specific electronics packaging systems, methods and dev...

Catalytic ink comprising metallic material made from diamminesilver...

Application specific electronics packaging systems, methods and dev...

Electroless copper plating polydopamine nanoparticles

Fabrication method of substrate structure

Application specific electronics packaging systems, methods and dev...

Methods of fast fabrication of single and multilayer circuit with h...

Method for reducing the optical reflectivity of a copper and copper...

Application specific electronics packaging systems, methods and dev...

Pixel definition layer and manufacturing method thereof, display su...

Laminate structure of metal coating

Electroless copper plating polydopamine nanoparticles

Polymer product and method for selectively metallizing polymer subs...

Method for fine line manufacturing

Catalyst for a catalytic ink and uses thereof

Metal compound, method for preparing the same, selective metallizat...

Antenna structure and method for manufacturing antenna

Substrate structure and fabrication method thereof

Circuit-and-heat-dissipation assembly and method of making the same

Via in a printed circuit board

Via in a printed circuit board

Absorbing-layer-forming composition and absorbing substrate, printe...

Method for forming high-definition metal pattern, high-definition m...

Antenna and communication apparatus as well as manufacturing method...

Ink formulations for flexographic printing of high-resolution condu...

Ink composition and circuit board and method for producing the same

Stabilized silver catalysts and methods

Method for forming patterned conductive film

Via in a printed circuit board

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A STRUCTURE HAVING CONDUCTIVE LINES

APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...

LAMINATE STRUCTURE OF METAL COATING

CATALYST FOR A CATALYTIC INK AND USES THEREOF

STRUCTURE OF CONDUCTIVE LINES AND METHOD OF MANUFACTURING THE SAME

FABRICATION METHOD OF SUBSTRATE STRUCTURE

METHOD FOR REDUCING THE OPTICAL REFLECTIVITY OF A COPPER AND COPPER...

VIA IN A PRINTED CIRCUIT BOARD

CATALYST FOR A CATALYTIC INK AND USES THEREOF

ANTENNA AND COMMUNICATION APPARATUS AS WELL AS MANUFACTURING METHOD...

METAL COMPOUND, METHOD FOR PREPARING THE SAME, SELECTIVE METALLIZAT...

METHOD OF FABRICATING COPPER-NICKEL MICRO MESH CONDUCTORS

METHOD OF ROLL TO ROLL PRINTING OF FINE LINES AND FEATURES WITH AN...

METHOD OF FABRICATING A CONDUCTIVE PATTERN WITH HIGH OPTICAL TRANSM...

METHOD FOR FORMING PATTERNED CONDUCTIVE FILM

STABILIZED SILVER CATALYSTS AND METHODS

METHOD OF MANUFACTURING A METAL CLAD CIRCUIT BOARD

Flexible Circuit Chemistry

METAL FILM MATERIAL AND METHOD FOR MANUFACTURING THE SAME

FORMATION OF ELECTRICALLY CONDUCTIVE PATTERN BY SURFACE ENERGY MODI...

METHOD OF FABRICATING MICRO STRUCTURED SURFACES WITH ELECTRICALLY C...

METAL CLAD CIRCUIT BOARD

Formation of Solid Layers on Substrates

METHOD FOR FORMING PATTERNED CONDUCTIVE FILM

METHOD OF MAKING A BIOCHEMICAL TEST STRIP

Selective Seed Layer Treatment for Feature Plating

COPPER CONDUCTOR FILM AND MANUFACTURING METHOD THEREOF, CONDUCTIVE...

METHOD FOR PRODUCING METAL THIN FILM

FLEXIBLE CIRCUIT CHEMISTRY

Manufacturing Method for Forming Circuit Structure on Non-Conductiv...