Cavity coating shape

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CPC
H01L2924/1619

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1619Cavity coating shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with ball grid array connection having improv...
- Patent number 12,362,307
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,261,089
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded liquid cooling
- Patent number 12,199,011
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with protective lid
- Patent number 12,119,276
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component modules (MCMs) including configurable electromagnet...
- Patent number 12,100,669
- Issue date Sep 24, 2024
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module, and photosensitive component thereof and manufacturi...
- Patent number 12,021,097
- Issue date Jun 25, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Cover lid with selective and edge metallization and methods of making
- Patent number 12,020,999
- Issue date Jun 25, 2024
- Materion Corporation
- Ramesh Kothandapani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,021,042
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image-capturing unit and image-capturing apparatus
- Patent number 11,974,056
- Issue date Apr 30, 2024
- Nikon Corporation
- Hirofumi Arima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating component, semiconductor package, and semiconductor appa...
- Patent number 11,901,247
- Issue date Feb 13, 2024
- Kyocera Corporation
- Masami Juta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging unit and imaging apparatus
- Patent number 11,887,839
- Issue date Jan 30, 2024
- Nikon Corporation
- Hirofumi Arima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,862,525
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and equipment
- Patent number 11,798,855
- Issue date Oct 24, 2023
- Canon Kabushiki Kaisha
- Yu Katase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light-emitting device
- Patent number 11,799,266
- Issue date Oct 24, 2023
- Rohm Co., Ltd.
- Yuki Tanuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,784,156
- Issue date Oct 10, 2023
- Mitsubishi Electric Corporation
- Takuya Kitabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with protective lid
- Patent number 11,764,118
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component modules (MCMs) including configurable electro-magne...
- Patent number 11,721,639
- Issue date Aug 8, 2023
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heatsink
- Patent number 11,694,972
- Issue date Jul 4, 2023
- Mediatek Inc.
- Kuang-Han Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package with reduced radio frequency losses
- Patent number 11,574,879
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Pedro Augusto Borrego Lambin Torres Amaral
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structures and methods of manufacturing the same
- Patent number 11,515,220
- Issue date Nov 29, 2022
- Advanced Semiconductor Engineering, Inc.
- Chia Yun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor semiconductor packages and related methods
- Patent number 11,508,776
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Larry Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 11,488,922
- Issue date Nov 1, 2022
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package structures and methods of manufacturing the same
- Patent number 11,482,460
- Issue date Oct 25, 2022
- Advanced Semiconductor Engineering, Inc.
- Chia Yun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component housing package, electronic apparatus, and ele...
- Patent number 11,394,362
- Issue date Jul 19, 2022
- Kyocera Corporation
- Takuo Kisaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, imaging unit and imaging device
- Patent number 11,343,907
- Issue date May 24, 2022
- Nikon Corporation
- Ryoichi Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating component, semiconductor package, and semiconductor appa...
- Patent number 11,335,613
- Issue date May 17, 2022
- Kyocera Corporation
- Masami Juta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating method, coating apparatus and method for manufacturing comp...
- Patent number 11,305,311
- Issue date Apr 19, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mitsumi Itou
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Integrated interposer solutions for 2D and 3D IC packaging
- Patent number 11,302,616
- Issue date Apr 12, 2022
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,276,616
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS CONDITION MEASUREMENT DEVICE INCLUDING THERMALLY ISOLATED E...
- Publication number 20250239473
- Publication date Jul 24, 2025
- KLA Corporation
- Farhat A. Quli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250226271
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250192122
- Publication date Jun 12, 2025
- TXC Corporation
- Shih-Yung Pao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED LIQUID COOLING
- Publication number 20250183120
- Publication date Jun 5, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH A REINFORCING LAYER
- Publication number 20240395731
- Publication date Nov 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20240395655
- Publication date Nov 28, 2024
- Intel Corporation
- Avi Tsarfati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240379475
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240312930
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONI...
- Publication number 20240250054
- Publication date Jul 25, 2024
- NVIDIA Corporation
- Malcolm GUTENBURG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED LIQUID COOLING
- Publication number 20240222222
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240186213
- Publication date Jun 6, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Jin REE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240178206
- Publication date May 30, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240145319
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATING AND THERMALLY CONDUCTIVE LAYER...
- Publication number 20240105544
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Shih Kien LONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...
- Publication number 20240071974
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Pac...
- Publication number 20240072025
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rajen M. Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Improved Heat Dissipation Efficiency and Method for Fo...
- Publication number 20240063079
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240047301
- Publication date Feb 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyoun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNET...
- Publication number 20240021538
- Publication date Jan 18, 2024
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...
- Publication number 20230395450
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jing-Ye Juang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20230369149
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230230935
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230187290
- Publication date Jun 15, 2023
- Fuji Electric Co., Ltd.
- Naohiko JOZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20230187305
- Publication date Jun 15, 2023
- Hitachi Astemo, Ltd.
- Hiromi SHIMAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230178451
- Publication date Jun 8, 2023
- Siliconware Precision Industries Co., Ltd.
- Hsin-Jou Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Manufacturing The Same
- Publication number 20230154822
- Publication date May 18, 2023
- Nippon Telegraph and Telephone Corporation
- Yusuke Araki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSO...
- Publication number 20230103894
- Publication date Apr 6, 2023
- NEC Corporation
- Yuki YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE, AND PHOTOSENSITIVE COMPONENT THEREOF AND MANUFACTURI...
- Publication number 20230019091
- Publication date Jan 19, 2023
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H01 - BASIC ELECTRIC ELEMENTS

Cavity coating shape

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package with ball grid array connection having improv...

Semiconductor device package and a method of manufacturing the same

Embedded liquid cooling

Package structure with protective lid

Multi-component modules (MCMs) including configurable electromagnet...

Camera module, and photosensitive component thereof and manufacturi...

Cover lid with selective and edge metallization and methods of making

Semiconductor package and method of manufacturing the same

Image-capturing unit and image-capturing apparatus

Insulating component, semiconductor package, and semiconductor appa...

Imaging unit and imaging apparatus

Thermal transfer structures for semiconductor die assemblies

Semiconductor device package and a method of manufacturing the same

Electronic module and equipment

Semiconductor light-emitting device

Semiconductor device

Structure and formation method of chip package with protective lid

Multi-component modules (MCMs) including configurable electro-magne...

Semiconductor package with heatsink

Device package with reduced radio frequency losses

Semiconductor package structures and methods of manufacturing the same

Image sensor semiconductor packages and related methods

Back side metallization

Semiconductor package structures and methods of manufacturing the same

Electronic component housing package, electronic apparatus, and ele...

Substrate, imaging unit and imaging device

Insulating component, semiconductor package, and semiconductor appa...

Coating method, coating apparatus and method for manufacturing comp...

Integrated interposer solutions for 2D and 3D IC packaging

Semiconductor device package and a method of manufacturing the same

Patents Applicationslast 30 patents

PROCESS CONDITION MEASUREMENT DEVICE INCLUDING THERMALLY ISOLATED E...

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE

EMBEDDED LIQUID COOLING

ELECTRONIC DEVICE WITH A REINFORCING LAYER

HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

PACKAGE STRUCTURE WITH PROTECTIVE LID

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONI...

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

EMBEDDED LIQUID COOLING

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

PACKAGE WITH ELECTRICALLY INSULATING AND THERMALLY CONDUCTIVE LAYER...

SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...

Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Pac...

Package with Improved Heat Dissipation Efficiency and Method for Fo...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNET...

REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...

PACKAGE STRUCTURE WITH PROTECTIVE LID

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

POWER MODULE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method for Manufacturing The Same

HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSO...

CAMERA MODULE, AND PHOTOSENSITIVE COMPONENT THEREOF AND MANUFACTURI...