Central processing unit [CPU]

Industry

CPC
H01L2924/1432

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1432Central processing unit [CPU]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing optically accessible co-packaged optics
- Patent number 12,197,023
- Issue date Jan 14, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive with brain-like elasticity and integrality based on sta...
- Patent number 12,176,902
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphics processing unit and high bandwidth memory integration usin...
- Patent number 12,170,275
- Issue date Dec 17, 2024
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
- Patent number 12,142,553
- Issue date Nov 12, 2024
- Intel Corporation
- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 12,107,051
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 12,094,831
- Issue date Sep 17, 2024
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial through via with novel high isolation cross coupling method...
- Patent number 12,074,125
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 12,057,432
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,057,425
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Eunyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing semiconductor pa...
- Patent number 12,021,055
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,015,023
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,009,289
- Issue date Jun 11, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating system in package (SiP) with input/output (IO) board fo...
- Patent number 12,002,793
- Issue date Jun 4, 2024
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die and heat spreaders with solderable thermal interface structu...
- Patent number 11,984,377
- Issue date May 14, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,978,730
- Issue date May 7, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,961,742
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package and methods of manufacturing the same
- Patent number 11,929,262
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed semiconductor die and package architecture
- Patent number 11,894,359
- Issue date Feb 6, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 11,894,345
- Issue date Feb 6, 2024
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device encapsulated by molding material attached to r...
- Patent number 11,887,952
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,881,467
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Jungho Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 11,837,550
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory card
- Patent number 11,837,576
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Youngwoo Park
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK
- Publication number 20250006617
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Xu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-BANDWIDTH THREE-DIMENSIONAL (3D) DIE STACK
- Publication number 20250006694
- Publication date Jan 2, 2025
- Xilinx, Inc.
- Martin L. VOOGEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429222
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20240421098
- Publication date Dec 19, 2024
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Package Structures Including Redistribution Layers
- Publication number 20240404992
- Publication date Dec 5, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...
- Publication number 20240363560
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Feng Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240339420
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- JU BIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM ON CHIP INCLUDING INPUT AND OUTPUT CIRCUIT AND SEMICONDUCTOR...
- Publication number 20240332253
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- KWANYEOB CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332159
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY SILICON STIFFENING MECHANISM FOR MODULE WARPAGE MITIGATION
- Publication number 20240332251
- Publication date Oct 3, 2024
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSOR PACKAGE SUBSTRATE WITH HIGH-SPEED TOP-SURFACE CONNECTION...
- Publication number 20240321802
- Publication date Sep 26, 2024
- International Business Machines Corporation
- JUNYAN TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321823
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...
- Publication number 20240321804
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240312920
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Keunho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312868
- Publication date Sep 19, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR AND PASSIVE COMPONENTS
- Publication number 20240312957
- Publication date Sep 19, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SOLUTION FOR HIGH CORE COUNT COMPUTE PLATFORMS
- Publication number 20240312919
- Publication date Sep 19, 2024
- Intel Corporation
- Pezhman MONADGEMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240297166
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240290750
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240290704
- Publication date Aug 29, 2024
- LG Innotek Co., Ltd.
- Jae Man BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DEFINED COUPLED INDUCTORS WITH EMBEDDED SOLID FERRITE CORE
- Publication number 20240274549
- Publication date Aug 15, 2024
- ADVANCED MICRO DEVICES, INC.
- Alexander Helmut Pfeiffenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266189
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20240258278
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Hyungchul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONI...
- Publication number 20240250054
- Publication date Jul 25, 2024
- NVIDIA Corporation
- Malcolm GUTENBURG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS
- Publication number 20240250067
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional Application-Specific Integrated Circuit Architecture
- Publication number 20240243112
- Publication date Jul 18, 2024
- META PLATFORMS, INC.
- Ravi Shankar Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20240243114
- Publication date Jul 18, 2024
- ACER INCORPORATED
- Yu-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20240243012
- Publication date Jul 18, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS

Central processing unit [CPU]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-die package structures including redistribution layers

Manufacturing optically accessible co-packaged optics

Logic drive with brain-like elasticity and integrality based on sta...

Graphics processing unit and high bandwidth memory integration usin...

Guard ring design enabling in-line testing of silicon bridges for s...

Integrated fan-out package and the methods of manufacturing

Method of forming semiconductor packages having through package vias

Offset interposers for large-bottom packages and large-die package-...

High density interconnect device and method

Through-hole electrode substrate

Coaxial through via with novel high isolation cross coupling method...

Multi-die fine grain integrated voltage regulation

Integrated fan-out package structures with recesses in molding comp...

Semiconductor package

Semiconductor package and method for manufacturing semiconductor pa...

Integrated circuit package and method of forming same

Semiconductor package and manufacturing method thereof

Integrating system in package (SiP) with input/output (IO) board fo...

IC die and heat spreaders with solderable thermal interface structu...

Offset interposers for large-bottom packages and large-die package-...

Structure and method for fabricating a computing system with an int...

3DIC packaging with hot spot thermal management features

Semiconductor device and manufacturing method thereof

Stack package and methods of manufacturing the same

Distributed semiconductor die and package architecture

Integrated voltage regulator and passive components

Semiconductor device encapsulated by molding material attached to r...

Semiconductor package

Method of forming semiconductor packages having through package vias

Memory card

Patents Applicationslast 30 patents

Multi-Die Fine Grain Integrated Voltage Regulation

EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK

HIGH-BANDWIDTH THREE-DIMENSIONAL (3D) DIE STACK

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

Multi-Die Package Structures Including Redistribution Layers

THROUGH-HOLE ELECTRODE SUBSTRATE

COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...

SEMICONDUCTOR PACKAGE

SYSTEM ON CHIP INCLUDING INPUT AND OUTPUT CIRCUIT AND SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

DUMMY SILICON STIFFENING MECHANISM FOR MODULE WARPAGE MITIGATION

PROCESSOR PACKAGE SUBSTRATE WITH HIGH-SPEED TOP-SURFACE CONNECTION...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

INTEGRATED VOLTAGE REGULATOR AND PASSIVE COMPONENTS

INTERPOSER SOLUTION FOR HIGH CORE COUNT COMPUTE PLATFORMS

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR PACKAGES

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

SUBSTRATE DEFINED COUPLED INDUCTORS WITH EMBEDDED SOLID FERRITE CORE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONI...

MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS

Three Dimensional Application-Specific Integrated Circuit Architecture

ELECTRONIC PACKAGE STRUCTURE

Structure and Method for Fabricating a Computing System with an Int...