Ceramic parts

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CPC
H01L21/4807

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4807Ceramic parts

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal performance improvement and stress reduction in semiconduct...
- Patent number 12,191,264
- Issue date Jan 7, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate and manufacturing method therefor
- Patent number 12,183,689
- Issue date Dec 31, 2024
- AMOSENSE CO., LTD.
- Ji-Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a ceramic structure with metal traces
- Patent number 12,183,592
- Issue date Dec 31, 2024
- HRL Laboratories, LLC
- Tobias Schaedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and method for forming the same
- Patent number 12,165,947
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded substrate, and method for manufacturing bonded substrate
- Patent number 12,165,948
- Issue date Dec 10, 2024
- NGK Insulators, Ltd.
- Takashi Ebigase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate and electrostatic chuck
- Patent number 12,157,702
- Issue date Dec 3, 2024
- Shinko Electric Industries Co., Ltd.
- Tomotake Minemura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Copper/ceramic joined body and insulating circuit substrate
- Patent number 12,125,765
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor module, vehicle, and manufactur...
- Patent number 12,107,030
- Issue date Oct 1, 2024
- Fuji Electric Co., Ltd.
- Sho Takano
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device having an insulating sheet and a conductive fi...
- Patent number 12,080,612
- Issue date Sep 3, 2024
- Fuji Electric Co., Ltd.
- Katsumi Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,080,692
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Keisuke Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,080,621
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Yoshiaki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,057,367
- Issue date Aug 6, 2024
- Fuji Electric Co., Ltd.
- Yushi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated metal substrate and method for manufacturing same
- Patent number 12,023,893
- Issue date Jul 2, 2024
- TCLAD TECHNOLOGY CORPORATION
- Feng-Chun Yu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Transferring large-area group III-nitride semiconductor material an...
- Patent number 12,020,985
- Issue date Jun 25, 2024
- The Government of the United States of America, as represented by the Secreta...
- Travis J. Anderson
- C30 - CRYSTAL GROWTH
Information Patent Grant
Device with dummy metallic traces
- Patent number 11,990,399
- Issue date May 21, 2024
- Texas Instruments Incorporated
- Frank Armstrong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,978,695
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Sang-uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,923,270
- Issue date Mar 5, 2024
- Kabushiki Kaisha Toshiba
- Tatsuya Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 11,923,447
- Issue date Mar 5, 2024
- Fujitsu Limited
- Junya Yaita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic semiconductor device package with copper tungsten conductiv...
- Patent number 11,915,986
- Issue date Feb 27, 2024
- Texas Instruments Incorporated
- Ramlah Binte Abdul Razak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High dielectric constant carrier based packaging with enhanced WG m...
- Patent number 11,862,584
- Issue date Jan 2, 2024
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-strength zirconia-alumina composite ceramic substrate applied...
- Patent number 11,858,850
- Issue date Jan 2, 2024
- LEATEC FINE CERAMICS CO., LTD.
- Chih-Hung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level stacked structures having integrated passive features
- Patent number 11,854,958
- Issue date Dec 26, 2023
- General Electric Company
- Marco Francesco Aimi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a metal-ceramic substrate with electrically co...
- Patent number 11,804,383
- Issue date Oct 31, 2023
- Infineon Technologies AG
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Device on ceramic substrate
- Patent number 11,791,226
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit, power converter, and method for producing an el...
- Patent number 11,756,857
- Issue date Sep 12, 2023
- Siemens Aktiengesellschaft
- Thomas Bigl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed ceramic structure with metal traces
- Patent number 11,756,799
- Issue date Sep 12, 2023
- HRL Laboratories, LLC
- Tobias Schaedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a power semiconductor component arrangement...
- Patent number 11,749,533
- Issue date Sep 5, 2023
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Steffen Ziesche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices with an engineered substrate
- Patent number 11,735,460
- Issue date Aug 22, 2023
- QROMIS, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 11,728,285
- Issue date Aug 15, 2023
- NXP USA, INC.
- Vivek Gupta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...
- Publication number 20250096159
- Publication date Mar 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096068
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Naoki TAKIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER FEATURES AND RELATED METHODS OF FORMING
- Publication number 20250029844
- Publication date Jan 23, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER ELECTRONIC SUBSTRATE AND METHOD FOR FAB...
- Publication number 20240413046
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Frank Sauerland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...
- Publication number 20240413025
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20240404912
- Publication date Dec 5, 2024
- Fuji Electric Co., Ltd.
- Taichi ITOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK-INTEGRATED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING...
- Publication number 20240347416
- Publication date Oct 17, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCRIBED CERAMIC CIRCUIT SUBSTRATE, CERAMIC CIRCUIT SUBSTRATE, METHO...
- Publication number 20240332123
- Publication date Oct 3, 2024
- Kabushiki Kaisha Toshiba
- Yukihisa MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE...
- Publication number 20240234240
- Publication date Jul 11, 2024
- DOWA METALTECH CO., LTD.
- Koji KOBAYASHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ALUMINUM-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE...
- Publication number 20240136249
- Publication date Apr 25, 2024
- DOWA METALTECH CO., LTD.
- Koji KOBAYASHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
- Publication number 20240105532
- Publication date Mar 28, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Zhigang PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED OBJECT PRODUCTION METHOD AND PRODUCTION METHOD FOR CERAMIC C...
- Publication number 20240079238
- Publication date Mar 7, 2024
- Kabushiki Kaisha Toshiba
- Hiromasa KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT SUBSTRATE-SIDE COOLING IN POWER DEVICE MODULE
- Publication number 20240038632
- Publication date Feb 1, 2024
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHOD FOR FORMING THE SAME
- Publication number 20240021494
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Sheh HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC ARTICLE, SEMICONDUCTOR APPARATUS FOR MANUFACTURING A SEMICO...
- Publication number 20240010566
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- REN-GUAN DUAN
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CERAMIC SCRIBE SUBSTRATE, CERAMIC SUBSTRATE, METHOD FOR MANUFACTURI...
- Publication number 20230326818
- Publication date Oct 12, 2023
- Kabushiki Kaisha Toshiba
- Yukihisa MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...
- Publication number 20230326876
- Publication date Oct 12, 2023
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20230299038
- Publication date Sep 21, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON NITRIDE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230275002
- Publication date Aug 31, 2023
- Proterial, Ltd.
- Rei FUKUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20230274989
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ramlah Binte Abdul Razak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERTER, AND MOVING VEHICLE
- Publication number 20230268239
- Publication date Aug 24, 2023
- Mitsubishi Electric Corporation
- Yoichi HIRONAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE COOLING USING THERMORESPONSIVE MATERIALS
- Publication number 20230253287
- Publication date Aug 10, 2023
- Intel Corporation
- Tsung-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Dielectric Constant Carrier Based Packaging with Enhanced WG M...
- Publication number 20230207498
- Publication date Jun 29, 2023
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED HEAT DISSIPATION POWER SEMICONDUCTOR MODULE AND METHOD...
- Publication number 20230187309
- Publication date Jun 15, 2023
- LX Semicon Co., Ltd.
- Deog Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERTER, MOVING VEHICLE, AND SEMICOND...
- Publication number 20230170323
- Publication date Jun 1, 2023
- Mitsubishi Electric Corporation
- Ryutaro DATE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230154811
- Publication date May 18, 2023
- Mitsubishi Electric Corporation
- Seiya KURANAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20230154808
- Publication date May 18, 2023
- Mitsubishi Electric Corporation
- Masaki KURACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230119240
- Publication date Apr 20, 2023
- Fuji Electric Co., Ltd.
- Katsumi TANIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR SURFACES ON SUBSTRATES
- Publication number 20230102345
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Frank ARMSTRONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230096381
- Publication date Mar 30, 2023
- Fuji Electric Co., Ltd.
- Hiroaki ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS

Ceramic parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board with bridge chiplets

Thermal performance improvement and stress reduction in semiconduct...

Ceramic substrate and manufacturing method therefor

Method of manufacturing a ceramic structure with metal traces

Semiconductor devices and method for forming the same

Bonded substrate, and method for manufacturing bonded substrate

Ceramic substrate and electrostatic chuck

Copper/ceramic joined body and insulating circuit substrate

Semiconductor device, semiconductor module, vehicle, and manufactur...

Semiconductor device having an insulating sheet and a conductive fi...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Insulated metal substrate and method for manufacturing same

Transferring large-area group III-nitride semiconductor material an...

Device with dummy metallic traces

Semiconductor package and method of fabricating the same

Semiconductor device

Semiconductor device, method of manufacturing semiconductor device,...

Ceramic semiconductor device package with copper tungsten conductiv...

High dielectric constant carrier based packaging with enhanced WG m...

High-strength zirconia-alumina composite ceramic substrate applied...

Wafer level stacked structures having integrated passive features

Method for producing a metal-ceramic substrate with electrically co...

Device on ceramic substrate

Electronic circuit, power converter, and method for producing an el...

3D printed ceramic structure with metal traces

Method of manufacturing a power semiconductor component arrangement...

Integrated circuit devices with an engineered substrate

Semiconductor device packaging warpage control

Patents Applicationslast 30 patents

THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...

SEMICONDUCTOR DEVICE

COPPER FEATURES AND RELATED METHODS OF FORMING

SEMICONDUCTOR MODULE, POWER ELECTRONIC SUBSTRATE AND METHOD FOR FAB...

METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

HEATSINK-INTEGRATED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING...

SCRIBED CERAMIC CIRCUIT SUBSTRATE, CERAMIC CIRCUIT SUBSTRATE, METHO...

ALUMINUM-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE...

ALUMINUM-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE...

CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE

BONDED OBJECT PRODUCTION METHOD AND PRODUCTION METHOD FOR CERAMIC C...

DIRECT SUBSTRATE-SIDE COOLING IN POWER DEVICE MODULE

SEMICONDUCTOR DEVICES AND METHOD FOR FORMING THE SAME

CERAMIC ARTICLE, SEMICONDUCTOR APPARATUS FOR MANUFACTURING A SEMICO...

CERAMIC SCRIBE SUBSTRATE, CERAMIC SUBSTRATE, METHOD FOR MANUFACTURI...

THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SILICON NITRIDE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

CERAMIC SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE, POWER CONVERTER, AND MOVING VEHICLE

INTEGRATED CIRCUIT DEVICE COOLING USING THERMORESPONSIVE MATERIALS

High Dielectric Constant Carrier Based Packaging with Enhanced WG M...

DOUBLE-SIDED HEAT DISSIPATION POWER SEMICONDUCTOR MODULE AND METHOD...

SEMICONDUCTOR DEVICE, POWER CONVERTER, MOVING VEHICLE, AND SEMICOND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PLANAR SURFACES ON SUBSTRATES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE