Ceramics

Industry

CPC
H01L2224/05187

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05187Ceramics

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 12,040,293
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, circuit board, and semiconductor device
- Patent number 11,948,900
- Issue date Apr 2, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,848,346
- Issue date Dec 19, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 11,824,026
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 11,728,296
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,652,072
- Issue date May 16, 2023
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 11,502,050
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,469,202
- Issue date Oct 11, 2022
- Samsung Electronics Co., Ltd.
- Seong-Min Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method of processing a semiconductor chip
- Patent number 11,164,830
- Issue date Nov 2, 2021
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-eutectic bonding
- Patent number 11,141,810
- Issue date Oct 12, 2021
- TECHNI HOLDING AS
- Andreas Larsson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bottom up electroplating with release layer
- Patent number 10,957,628
- Issue date Mar 23, 2021
- Corning Incorporated
- Robert Alan Bellman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,930,695
- Issue date Feb 23, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 10,916,517
- Issue date Feb 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment marks in substrate having through-substrate via (TSV)
- Patent number 10,910,267
- Issue date Feb 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 10,861,811
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,833,032
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Seong-Min Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 10,811,374
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 10,790,253
- Issue date Sep 29, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor devices including a redistr...
- Patent number 10,777,523
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment marks in substrate having through-substrate via (TSV)
- Patent number 10,692,764
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making fully molded peripheral package on package device
- Patent number 10,672,624
- Issue date Jun 2, 2020
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly
- Patent number 10,665,565
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, method for manufacturing semiconductor chip, in...
- Patent number 10,658,321
- Issue date May 19, 2020
- Kabushiki Kaisha Toshiba
- Hidekazu Inoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 10,658,315
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-component bump metallization
- Patent number 10,629,797
- Issue date Apr 21, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 10,615,139
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-component bump metallization
- Patent number 10,608,158
- Issue date Mar 31, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 10,600,751
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20240339419
- Publication date Oct 10, 2024
- Sumitomo Electric Industries, Ltd.
- Shota SAMBONSUGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304576
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Yuya KIYOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240105644
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Hao YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240055401
- Publication date Feb 15, 2024
- United Microelectronics Corp.
- Kun-Ju LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH THIN FILM RESISTER STRUCTURE
- Publication number 20240047510
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20240047389
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Hyeonmin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240030187
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASIC MOLECULE-ASSISTED DIRECT BONDING METHOD
- Publication number 20230387070
- Publication date Nov 30, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank FOURNEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ATOMIC DIFFUSION HYBRID BONDING AND APPARATUS MADE FROM SAME
- Publication number 20230299040
- Publication date Sep 21, 2023
- Intel Corporation
- Jay Prakash Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230209926
- Publication date Jun 29, 2023
- SAMSUNG DISPLAY CO., LTD.
- Shinhyuk Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230163087
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230141447
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Wonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIERS AND METHOD OF FORMING SAME
- Publication number 20230132632
- Publication date May 4, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230113465
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR CHIP
- Publication number 20230114550
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Yongbum KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20230070532
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20230072507
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...
- Publication number 20220336394
- Publication date Oct 20, 2022
- SANDISK TECHNOLOGIES LLC
- Kensuke ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
- Publication number 20210398928
- Publication date Dec 23, 2021
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210225921
- Publication date Jul 22, 2021
- Sony Semiconductor Solutions Corporation
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20210159196
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Structure and Method of Forming Same
- Publication number 20210118833
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20210050316
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210005565
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- Seong-Min SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20200144208
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM UP ELECTROPLATING WITH RELEASE LAYER
- Publication number 20200111726
- Publication date Apr 9, 2020
- Corning Incorporated
- Robert Alan Bellman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT
- Publication number 20200083188
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190348332
- Publication date Nov 14, 2019
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- G01 - MEASURING TESTING
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20190304939
- Publication date Oct 3, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Redistribution layer metallic structure and method

Advanced device assembly structures and methods

Bonded body, circuit board, and semiconductor device

Semiconductor device and method of manufacturing the same

Connector structure and method of forming same

Interconnect structure and method of forming same

Semiconductor device and method of manufacturing the same

Redistribution layer metallic structure and method

Semiconductor device

Method of making a pillar structure having a non-metal sidewall pro...

Semiconductor chip and method of processing a semiconductor chip

Non-eutectic bonding

Bottom up electroplating with release layer

Semiconductor device and method of manufacturing the same

Redistribution layer metallic structure and method

Alignment marks in substrate having through-substrate via (TSV)

Connector structure and method of forming same

Semiconductor device

Interconnect structure and method of forming same

Conductive pillar shaped for solder confinement

Semiconductor devices and semiconductor devices including a redistr...

Alignment marks in substrate having through-substrate via (TSV)

Method of making fully molded peripheral package on package device

Package assembly

Semiconductor chip, method for manufacturing semiconductor chip, in...

Redistribution layer metallic structure and method

Two-component bump metallization

Semiconductor device including built-in crack-arresting film structure

Two-component bump metallization

Conductive pillar shaped for solder confinement

Patents Applicationslast 30 patents

SILICON CARBIDE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

SEMICONDUCTOR ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED CIRCUIT WITH THIN FILM RESISTER STRUCTURE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

BASIC MOLECULE-ASSISTED DIRECT BONDING METHOD

METHOD OF ATOMIC DIFFUSION HYBRID BONDING AND APPARATUS MADE FROM SAME

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME

DIFFUSION BARRIERS AND METHOD OF FORMING SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

Redistribution Layer Metallic Structure and Method

BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...

Advanced Device Assembly Structures And Methods

BONDED BODY, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Redistribution Layer Metallic Structure and Method

Connector Structure and Method of Forming Same

Interconnect Structure and Method of Forming Same

SEMICONDUCTOR DEVICE

Redistribution Layer Metallic Structure and Method

BOTTOM UP ELECTROPLATING WITH RELEASE LAYER

CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Redistribution Layer Metallic Structure and Method