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Ceramics

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  • CPC
  • H01L2224/45687
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45687Ceramics
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • Publication number 20180082977
    • Publication date Mar 22, 2018
    • RENESAS ELECTRONICS CORPORATION
    • Yuki YAGYU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LED PACKAGE
    • Publication number 20170200876
    • Publication date Jul 13, 2017
    • Citizen Electronics Co., Ltd.
    • Takashi Iino
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STRUCTURES AND METHODS FOR REDUCING CORROSION IN WIRE BONDS
    • Publication number 20150311173
    • Publication date Oct 29, 2015
    • BURTON J. CARPENTER
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CORE-JACKET BONDING WIRE
    • Publication number 20130213689
    • Publication date Aug 22, 2013
    • HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
    • Eugen Milke
    • B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
  • Information Patent Application

    COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20110011618
    • Publication date Jan 20, 2011
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME
    • Publication number 20100108359
    • Publication date May 6, 2010
    • Rainer Dohle
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20080061440
    • Publication date Mar 13, 2008
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR