Ceramics

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CPC
H01L2924/15787

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/15787Ceramics

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,080,692
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Keisuke Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,021,043
- Issue date Jun 25, 2024
- Fuji Electric Co., Ltd.
- Hiroaki Hokazono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illumination apparatus
- Patent number 11,994,268
- Issue date May 28, 2024
- Optovate Limited
- Jonathan Harrold
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Semiconductor device
- Patent number 11,955,398
- Issue date Apr 9, 2024
- Fuji Electric Co., Ltd.
- Eri Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,908,835
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid felts of electrospun nanofibers
- Patent number RE49773
- Issue date Jan 2, 2024
- NANOPAREIL, LLC
- Todd J. Menkhaus
Information Patent Grant
Semiconductor die connection system and method
- Patent number 11,855,029
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
- Patent number 11,810,893
- Issue date Nov 7, 2023
- International Business Machines Corporation
- William Emmett Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of housing for semiconductor device
- Patent number 11,806,903
- Issue date Nov 7, 2023
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Laminate and electronic device
- Patent number 11,798,863
- Issue date Oct 24, 2023
- Sekisui Chemical Co., Ltd.
- Kouji Ashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing same
- Patent number 11,749,581
- Issue date Sep 5, 2023
- Fuji Electric Co., Ltd.
- Yuhei Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 11,749,535
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupled semiconductor package
- Patent number 11,721,615
- Issue date Aug 8, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of inspecting the same
- Patent number 11,715,701
- Issue date Aug 1, 2023
- Kioxia Corporation
- Yuusuke Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,705,438
- Issue date Jul 18, 2023
- Kabushiki Kaisha Toshiba
- Tatsuya Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power conversion device
- Patent number 11,699,666
- Issue date Jul 11, 2023
- Mitsubishi Electric Corporation
- Akira Kosugi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including antenna substrate and manufacturing...
- Patent number 11,664,580
- Issue date May 30, 2023
- Advanced Semiconductor Engineering, Inc.
- Han-Chee Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,631,626
- Issue date Apr 18, 2023
- Unimicron Technology Corp.
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor having double-sided substrate
- Patent number 11,631,627
- Issue date Apr 18, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Illumination apparatus
- Patent number 11,629,847
- Issue date Apr 18, 2023
- Optovate Limited
- Jonathan Harrold
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device
- Patent number 11,626,333
- Issue date Apr 11, 2023
- Fuji Electric Co., Ltd.
- Nobuhiro Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and manufacturing method of semiconductor a...
- Patent number 11,605,568
- Issue date Mar 14, 2023
- Mitsubishi Electric Corporation
- Takuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module comprising two substrates and method of manufacturing...
- Patent number 11,574,889
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Ottmar Geitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic laminated substrate, module, and method of manufacturing ce...
- Patent number 11,574,860
- Issue date Feb 7, 2023
- Murata Manufacturing Co., Ltd.
- Takuya Goitsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor device package including conformal m...
- Patent number 11,488,842
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING SUBSTRATE, ELECTRICAL WIRING SUBSTRATE, THERMAL PRINT HE...
- Publication number 20240268018
- Publication date Aug 8, 2024
- Rohm Co., Ltd.
- Goro Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240222236
- Publication date Jul 4, 2024
- Fuji Electric Co., Ltd.
- Shinji TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Illumination apparatus
- Publication number 20240019106
- Publication date Jan 18, 2024
- Optovate Limited
- Jonathan HARROLD
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...
- Publication number 20230326876
- Publication date Oct 12, 2023
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Connection System and Method
- Publication number 20230326895
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ANTENNA SUBSTRATE AND MANUFACTURING...
- Publication number 20230299462
- Publication date Sep 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Han-Chee Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-BANDWIDTH PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20230282626
- Publication date Sep 7, 2023
- MEDIATEK INC.
- Tai-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20230282530
- Publication date Sep 7, 2023
- Mitsubishi Electric Corporation
- Wakana NOBORU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC LAMINATED SUBSTRATE, MODULE, AND METHOD OF MANUFACTURING CE...
- Publication number 20230144181
- Publication date May 11, 2023
- MURATA MANUFACTURING CO., LTD.
- Takuya GOITSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Illumination apparatus
- Publication number 20230137296
- Publication date May 4, 2023
- Optovate Limited
- Jonathan HARROLD
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230130373
- Publication date Apr 27, 2023
- Mitsubishi Electric Corporation
- Masayuki NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230014848
- Publication date Jan 19, 2023
- Fuji Electric Co., Ltd.
- Rikihiro MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230008518
- Publication date Jan 12, 2023
- AMOSENSE CO.,LTD
- Ji-Hyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...
- Publication number 20220399300
- Publication date Dec 15, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A HYBRID BONDED INTERPOSER FOR D...
- Publication number 20220399294
- Publication date Dec 15, 2022
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220367414
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-YANG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220336429
- Publication date Oct 20, 2022
- Mitsubishi Electric Corporation
- Keisuke EGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Connection System and Method
- Publication number 20220302062
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IGBT MODULE WITH HEAT DISSIPATION STRUCTURE HAVING SPECIFIC LAYER T...
- Publication number 20220230932
- Publication date Jul 21, 2022
- Amulaire thermal technology, INC.
- SHIH-HSI TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Illumination apparatus
- Publication number 20220205615
- Publication date Jun 30, 2022
- Optovate Limited
- Jonathan HARROLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20220173022
- Publication date Jun 2, 2022
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR A...
- Publication number 20220157672
- Publication date May 19, 2022
- Mitsubishi Electric Corporation
- Takuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220108934
- Publication date Apr 7, 2022
- Unimicron Technology Corp.
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220093572
- Publication date Mar 24, 2022
- Kabushiki Kaisha Toshiba
- Tatsuya HIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLED SEMICONDUCTOR PACKAGE
- Publication number 20220051969
- Publication date Feb 17, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220051961
- Publication date Feb 17, 2022
- Fuji Electric Co., Ltd.
- Eri OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Illumination apparatus
- Publication number 20220026047
- Publication date Jan 27, 2022
- Optovate Limited
- Jonathan HARROLD
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220020703
- Publication date Jan 20, 2022
- Fuji Electric Co., Ltd.
- Hideyo NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210366796
- Publication date Nov 25, 2021
- Fuji Electric Co., Ltd.
- Nobuhiro HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor bonding structures and methods

Hermetic package for high CTE mismatch

Through-hole electrode substrate

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Illumination apparatus

Multiple plated via arrays of different wire heights on a same subs...

Semiconductor device

Semiconductor structure and manufacturing method thereof

Hybrid felts of electrospun nanofibers

Semiconductor die connection system and method

Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...

Manufacturing method of housing for semiconductor device

Laminate and electronic device

Semiconductor module and method for manufacturing same

Semiconductor bonding structures and methods

Coupled semiconductor package

Semiconductor device and method of inspecting the same

Semiconductor device

Semiconductor device and power conversion device

Semiconductor package including antenna substrate and manufacturing...

Package structure

Method of manufacturing semiconductor having double-sided substrate

Illumination apparatus

Semiconductor device

Semiconductor apparatus and manufacturing method of semiconductor a...

Power module comprising two substrates and method of manufacturing...

Ceramic laminated substrate, module, and method of manufacturing ce...

Chip assembly

Method of making semiconductor device package including conformal m...

Patents Applicationslast 30 patents

THROUGH-HOLE ELECTRODE SUBSTRATE

INSULATING SUBSTRATE, ELECTRICAL WIRING SUBSTRATE, THERMAL PRINT HE...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Illumination apparatus

THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...

Semiconductor Die Connection System and Method

SEMICONDUCTOR PACKAGE INCLUDING ANTENNA SUBSTRATE AND MANUFACTURING...

HIGH-BANDWIDTH PACKAGE-ON-PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

CERAMIC LAMINATED SUBSTRATE, MODULE, AND METHOD OF MANUFACTURING CE...

Illumination apparatus

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...

MICROELECTRONIC ASSEMBLIES HAVING A HYBRID BONDED INTERPOSER FOR D...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Die Connection System and Method

IGBT MODULE WITH HEAT DISSIPATION STRUCTURE HAVING SPECIFIC LAYER T...

Illumination apparatus

CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR A...

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

COUPLED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

Illumination apparatus

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE