Ceramics

Industry

CPC
H01L2224/29287

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29287Ceramics

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hybrid backside thermal structures for enhanced IC packages
- Patent number 11,948,906
- Issue date Apr 2, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and manufacturing method thereof
- Patent number 11,652,196
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Myunghee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 11,594,513
- Issue date Feb 28, 2023
- Nitto Denko Corporation
- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-dielectric adhesive film
- Patent number 11,485,879
- Issue date Nov 1, 2022
- ICH Co., Ltd.
- Young Hun Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-dissipating structure and semiconductor module using same
- Patent number 10,177,069
- Issue date Jan 8, 2019
- Hitachi Ltd.
- Takashi Naito
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for bonding substrates
- Patent number 9,673,167
- Issue date Jun 6, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of fabricating bonding structure
- Patent number 8,211,788
- Issue date Jul 3, 2012
- Taiwan TFT LCD Association
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure
- Patent number 7,576,430
- Issue date Aug 18, 2009
- Taiwan TFT LCD Association
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Use of preceramic polymers as electronic adhesives
- Patent number 5,904,791
- Issue date May 18, 1999
- Dow Corning Corporation
- Clayton R. Bearinger
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES
- Publication number 20240203926
- Publication date Jun 20, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES
- Publication number 20210249375
- Publication date Aug 12, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20210242165
- Publication date Aug 5, 2021
- NITTO DENKO CORPORATION
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20210111325
- Publication date Apr 15, 2021
- Samsung Electronics Co., Ltd.
- Myunghee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DIELECTRIC ADHESIVE FILM
- Publication number 20200071570
- Publication date Mar 5, 2020
- ICH CO., LTD.
- Young Hun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING STRUCTURE AND SEMICONDUCTOR MODULE USING SAME
- Publication number 20170236768
- Publication date Aug 17, 2017
- Hitachi, Ltd
- Takashi NAITO
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
METHOD OF FABRICATING BONDING STRUCTURE
- Publication number 20090253233
- Publication date Oct 8, 2009
- TAIWAN TFT LCD ASSOCIATION
- Shyh-Ming Chang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BONDING STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20080099916
- Publication date May 1, 2008
- TAIWAN TFT LCD ASSOCIATION
- Shyh-Ming Chang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hybrid backside thermal structures for enhanced IC packages

Display module and manufacturing method thereof

Manufacturing method for semiconductor device

High-dielectric adhesive film

Contact structures with porous networks for solder connections, and...

Heat-dissipating structure and semiconductor module using same

Method for bonding substrates

Method of fabricating bonding structure

Bonding structure

Use of preceramic polymers as electronic adhesives

Patents Applicationslast 30 patents

HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES

HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

HIGH-DIELECTRIC ADHESIVE FILM

HEAT-DISSIPATING STRUCTURE AND SEMICONDUCTOR MODULE USING SAME

METHOD OF FABRICATING BONDING STRUCTURE

BONDING STRUCTURE AND METHOD OF FABRICATING THE SAME