Ceramics

Industry

CPC
H01L2224/29387

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29387Ceramics

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 12,033,971
- Issue date Jul 9, 2024
- Laird Technologies, Inc.
- Vijayaraghavan Rajagopal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Anisotropic conductive film and connected structure
- Patent number 11,923,335
- Issue date Mar 5, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a can housing a semiconductor die w...
- Patent number 11,817,418
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Wei Lee Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill for chip packaging and chip packaging structure
- Patent number 11,804,463
- Issue date Oct 31, 2023
- Wuhan Choice Technology Co, Ltd
- De Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 11,776,928
- Issue date Oct 3, 2023
- Laird Technologies, Inc.
- Vijayaraghavan Rajagopal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Film-shaped firing material and film-shaped firing material with a...
- Patent number 11,420,255
- Issue date Aug 23, 2022
- Lintec Corporation
- Isao Ichikawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Adhesive film, semiconductor apparatus using the same, and semicond...
- Patent number 11,355,413
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 11,276,662
- Issue date Mar 15, 2022
- Vijayaraghavan Rajagopal
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Anisotropic conductive film and connected structure
- Patent number 11,139,265
- Issue date Oct 5, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method, method for connecting electronic component, metho...
- Patent number 11,049,842
- Issue date Jun 29, 2021
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,892,243
- Issue date Jan 12, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,867,878
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 10,849,236
- Issue date Nov 24, 2020
- Dexerials Corporation
- Reiji Tsukao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,847,487
- Issue date Nov 24, 2020
- Dexerials Corporation
- Seiichiro Shinohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and mounting structure of the same
- Patent number 10,790,258
- Issue date Sep 29, 2020
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor devices including a redistr...
- Patent number 10,777,523
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,734,353
- Issue date Aug 4, 2020
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bond materials with enhanced plasma resistant characteristics and a...
- Patent number 10,727,195
- Issue date Jul 28, 2020
- Technetics Group LLC
- Jason Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,651,161
- Issue date May 12, 2020
- Kabushiki Kaisha Toshiba
- Masahiro Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste and die bonding method
- Patent number 10,615,144
- Issue date Apr 7, 2020
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,550,299
- Issue date Feb 4, 2020
- FRAIVILLIG TECHNOGIES COMPANY
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY CONDUCTIVE COMPOSITION
- Publication number 20240376294
- Publication date Nov 14, 2024
- SUMITOMO CHEMICAL CO., LTD.
- Thomas Fletcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOATING HEAT SPREADER WITH GUIDED MECHANISM
- Publication number 20240258190
- Publication date Aug 1, 2024
- ADVANCED MICRO DEVICES, INC.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240128225
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Hajung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...
- Publication number 20240105663
- Publication date Mar 28, 2024
- Laird Technologies, Inc.
- Vijayaraghavan RAJAGOPAL
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
BARRIERS TO MODULATE UNDERFILL FLOW
- Publication number 20230317668
- Publication date Oct 5, 2023
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...
- Publication number 20230307407
- Publication date Sep 28, 2023
- Tohru YASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL FOR CHIP PACKAGING AND CHIP PACKAGING STRUCTURE
- Publication number 20230260948
- Publication date Aug 17, 2023
- Wuhan Choice Technology Co,Ltd
- De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESTER COMPOUND AND RESIN COMPOSITION
- Publication number 20230242705
- Publication date Aug 3, 2023
- AJINOMOTO CO., INC.
- Ichiro OGURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...
- Publication number 20230230950
- Publication date Jul 20, 2023
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Yuechen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joining and Insulating Power Electronic Semiconductor Components
- Publication number 20230215838
- Publication date Jul 6, 2023
- SIEMENS AKTIENGESELLSCHAFT
- Bernd Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS
- Publication number 20230197565
- Publication date Jun 22, 2023
- Jerrod P. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...
- Publication number 20220246572
- Publication date Aug 4, 2022
- Laird Technologies, Inc.
- Vijayaraghavan RAJAGOPAL
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME
- Publication number 20220077100
- Publication date Mar 10, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising a Can Housing a Semiconductor Die w...
- Publication number 20210159204
- Publication date May 27, 2021
- INFINEON TECHNOLOGIES AG
- Wei Lee Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20200365552
- Publication date Nov 19, 2020
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-SHAPED FIRING MATERIAL AND FILM-SHAPED FIRING MATERIAL WITH A...
- Publication number 20200276645
- Publication date Sep 3, 2020
- LINTEC CORPORATION
- Isao ICHIKAWA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20200161268
- Publication date May 21, 2020
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND CONNECTED STRUCTURE
- Publication number 20200020664
- Publication date Jan 16, 2020
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ALUMINA-BASED THERMALLY CONDUCTIVE OXIDE AND METHOD FOR PRODUCING SAME
- Publication number 20190359875
- Publication date Nov 28, 2019
- Dainichiseika Color & Chemicals Mfg. Co., Ltd.
- Akira NISHIO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20190348347
- Publication date Nov 14, 2019
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20190341364
- Publication date Nov 7, 2019
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...
- Publication number 20190252338
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUND...
- Publication number 20190214323
- Publication date Jul 11, 2019
- Advanced Semiconductor Engineering, Inc.
- Ya-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE
- Publication number 20190206825
- Publication date Jul 4, 2019
- NITTO DENKO CORPORATION
- Yuki Sugo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE PASTE AND DIE BONDING METHOD
- Publication number 20190139930
- Publication date May 9, 2019
- KAKEN TECH CO., LTD.
- Shigeo Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...
- Publication number 20190088613
- Publication date Mar 21, 2019
- TECHNETICS GROUP LLC
- Jason Wright
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermally Conductive Sheet, Production Method for Thermally Conduct...
- Publication number 20190055443
- Publication date Feb 21, 2019
- Dexerials Corporation
- Hiroki Kanaya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...
- Publication number 20190048238
- Publication date Feb 14, 2019
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low pressure sintering powder

Compressible foamed thermal interface materials and methods of maki...

Anisotropic conductive film and connected structure

Multilayer substrate

Semiconductor device comprising a can housing a semiconductor die w...

Underfill for chip packaging and chip packaging structure

Hybrid bonding structures and semiconductor devices including the same

Compressible foamed thermal interface materials and methods of maki...

Adhesive bonding composition and method of use

Film-shaped firing material and film-shaped firing material with a...

Sintering materials and attachment methods using same

Adhesive film, semiconductor apparatus using the same, and semicond...

Compressible foamed thermal interface materials and methods of maki...

Anisotropic conductive film and connected structure

Alignment method, method for connecting electronic component, metho...

Low pressure sintering powder

Anisotropic electrically conductive film and connection structure

Dam for three-dimensional integrated circuit

Semiconductor packaging structure and process

Anisotropic conductive film and production method of the same

Anisotropic electrically conductive film and connection structure

Electronic device and mounting structure of the same

Semiconductor devices and semiconductor devices including a redistr...

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Adhesive bonding composition and method of use

Bond materials with enhanced plasma resistant characteristics and a...

Engineered polymer-based electronic materials

Semiconductor device

Conductive paste and die bonding method

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

Patents Applicationslast 30 patents

THERMALLY CONDUCTIVE COMPOSITION

FLOATING HEAT SPREADER WITH GUIDED MECHANISM

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...

BARRIERS TO MODULATE UNDERFILL FLOW

MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...

UNDERFILL FOR CHIP PACKAGING AND CHIP PACKAGING STRUCTURE

ESTER COMPOUND AND RESIN COMPOSITION

SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...

Joining and Insulating Power Electronic Semiconductor Components

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS

COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...

HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME

Semiconductor Device Comprising a Can Housing a Semiconductor Die w...

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

FILM-SHAPED FIRING MATERIAL AND FILM-SHAPED FIRING MATERIAL WITH A...

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE

ANISOTROPIC CONDUCTIVE FILM AND CONNECTED STRUCTURE

ALUMINA-BASED THERMALLY CONDUCTIVE OXIDE AND METHOD FOR PRODUCING SAME

Die Attach Methods and Semiconductor Devices Manufactured based on...

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...

FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUND...

THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE

CONDUCTIVE PASTE AND DIE BONDING METHOD

BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...

Thermally Conductive Sheet, Production Method for Thermally Conduct...

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...