Ceramics

Industry

CPC
H01L2224/13187

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13187Ceramics

Industries

Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor device, and set of onboard-components, body a...
- Patent number 11,462,668
- Issue date Oct 4, 2022
- TOHOKU-MICROTEC CO., LTD.
- Makoto Motoyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and semicond...
- Patent number 10,818,583
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive resin composition, film adhesive, adhesive sheet, ad...
- Patent number 10,428,253
- Issue date Oct 1, 2019
- Hitachi Chemical Company, Ltd.
- Tomonori Minegishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,103,121
- Issue date Oct 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and semicond...
- Patent number 9,773,724
- Issue date Sep 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip hybridisation of two microelectronic components using a U...
- Patent number 9,318,453
- Issue date Apr 19, 2016
- Commissariat a l'Energie Atomique et aux Energies Alternatives
- Abdelkader Aliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon nanotube structures for enhancement of thermal dissipation f...
- Patent number 8,933,559
- Issue date Jan 13, 2015
- International Business Machines Corporation
- Veeraraghavan S. Basker
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Carbon nanotube structures for enhancement of thermal dissipation f...
- Patent number 8,299,605
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Veeraraghavan S Basker
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method and apparatus for electrostatic discharge protection using a...
- Patent number 7,629,202
- Issue date Dec 8, 2009
- International Business Machines Corporation
- Jonas R Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 7,554,206
- Issue date Jun 30, 2009
- Tessera, Inc.
- Belgacem Haba
- G01 - MEASURING TESTING
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 7,176,043
- Issue date Feb 13, 2007
- Tessera, Inc.
- Belgacem Haba
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240038708
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- KUNSANG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE, AND SET OF ONBOARD-COMPONENTS, BODY A...
- Publication number 20210399184
- Publication date Dec 23, 2021
- TOHOKU-MICROTEC CO., LTD.
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20190013287
- Publication date Jan 10, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tall and Fine Pitch Interconnects
- Publication number 20180096960
- Publication date Apr 5, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...
- Publication number 20180012830
- Publication date Jan 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20160351586
- Publication date Dec 1, 2016
- SAMSUNG DISPLAY CO., LTD.
- Hae-Kwan Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...
- Publication number 20140210074
- Publication date Jul 31, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Bump Bonding In Semiconductor Package Using Solder Balls Hav...
- Publication number 20130043573
- Publication date Feb 21, 2013
- Advanced Analogic Technologies (Hong Kong) Limited
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...
- Publication number 20120168931
- Publication date Jul 5, 2012
- International Business Machines Corporation
- Veeraraghavan S. Basker
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD AND APPARATUS FOR ELECTROSTATIC DISCHARGE PROTECTION USING A...
- Publication number 20090275191
- Publication date Nov 5, 2009
- Jonas R Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...
- Publication number 20090121343
- Publication date May 14, 2009
- International Business Machines Corporation
- Veeraraghavan S. Basker
- B82 - NANO-TECHNOLOGY
Information Patent Application
Microelectronic packages and methods therefor
- Publication number 20070077677
- Publication date Apr 5, 2007
- Tessera, Inc.
- Belgacem Haba
- G01 - MEASURING TESTING
Information Patent Application
Microelectronic packages and methods therefor
- Publication number 20050181544
- Publication date Aug 18, 2005
- Tessera, Inc.
- Belgacem Haba
- G01 - MEASURING TESTING

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked semiconductor device, and set of onboard-components, body a...

Semiconductor devices, methods of manufacture thereof, and semicond...

Tall and fine pitch interconnects

Photosensitive resin composition, film adhesive, adhesive sheet, ad...

Tall and fine pitch interconnects

Semiconductor devices, methods of manufacture thereof, and semicond...

Flip-chip hybridisation of two microelectronic components using a U...

Carbon nanotube structures for enhancement of thermal dissipation f...

Carbon nanotube structures for enhancement of thermal dissipation f...

Method and apparatus for electrostatic discharge protection using a...

Microelectronic packages and methods therefor

Microelectronic packages and methods therefor

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

STACKED SEMICONDUCTOR DEVICE, AND SET OF ONBOARD-COMPONENTS, BODY A...

TALL AND FINE PITCH INTERCONNECTS

Tall and Fine Pitch Interconnects

Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...

DISPLAY DEVICE

Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...

Solder Bump Bonding In Semiconductor Package Using Solder Balls Hav...

CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...

METHOD AND APPARATUS FOR ELECTROSTATIC DISCHARGE PROTECTION USING A...

CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...

Microelectronic packages and methods therefor

Microelectronic packages and methods therefor