Ceramics

Industry

CPC
H01L2224/29187

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29187Ceramics

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct gang bonding methods including directly bonding first elemen...
- Patent number 12,080,672
- Issue date Sep 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,057,439
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 12,033,971
- Issue date Jul 9, 2024
- Laird Technologies, Inc.
- Vijayaraghavan Rajagopal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Protective elements for bonded structures
- Patent number 11,848,284
- Issue date Dec 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 11,776,928
- Issue date Oct 3, 2023
- Laird Technologies, Inc.
- Vijayaraghavan Rajagopal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated circuit package and method
- Patent number 11,502,062
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 11,495,579
- Issue date Nov 8, 2022
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective elements for bonded structures
- Patent number 11,373,963
- Issue date Jun 28, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 11,276,662
- Issue date Mar 15, 2022
- Vijayaraghavan Rajagopal
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Die stack structure with hybrid bonding structure and method of fab...
- Patent number 11,251,157
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component
- Patent number 11,230,499
- Issue date Jan 25, 2022
- Murata Manufacturing Co., Ltd.
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed hybrid bonding structures and methods of forming the same
- Patent number 11,183,477
- Issue date Nov 23, 2021
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnection structure, wafer interconnection structure and...
- Patent number 11,164,840
- Issue date Nov 2, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Hongsheng Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure with capacitive chip interconnection, method for ma...
- Patent number 11,114,414
- Issue date Sep 7, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,024,605
- Issue date Jun 1, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor structure and method for forming the same
- Patent number 11,011,486
- Issue date May 18, 2021
- United Microelectronics Corp.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays with bonded and shared logic circuitry
- Patent number 10,923,450
- Issue date Feb 16, 2021
- Intel Corporation
- Richard Fastow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,886,252
- Issue date Jan 5, 2021
- Imec VZW
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,867,878
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 10,811,388
- Issue date Oct 20, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a silver sintering agent having silver oxide s...
- Patent number 10,785,877
- Issue date Sep 22, 2020
- Heraeus Deutschland GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Phosphorus-containing copper powder and method for producing the same
- Patent number 10,773,311
- Issue date Sep 15, 2020
- Dowa Electronics Materials Co., Ltd.
- Kenichi Inoue
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solid-state wafer bonding of functional materials on substrates and...
- Patent number 10,679,964
- Issue date Jun 9, 2020
- The Regents of the University of California
- Shadi A. Dayeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin layer for forming a capacitive interface between joined i...
- Patent number 10,600,760
- Issue date Mar 24, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods of manufacturing
- Patent number 10,461,048
- Issue date Oct 29, 2019
- LEONARDO MW LTD
- Angus David McLachlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,013
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,012
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 10,211,178
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240355782
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT HYBRID BONDING IN TOPOGRAPHIC PACKAGES
- Publication number 20240332248
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332261
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240145375
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...
- Publication number 20240105663
- Publication date Mar 28, 2024
- Laird Technologies, Inc.
- Vijayaraghavan RAJAGOPAL
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
- Publication number 20240096823
- Publication date Mar 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Improved Heat Dissipation Efficiency and Method for Fo...
- Publication number 20240063079
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE
- Publication number 20240038719
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ting LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240038725
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Keumhee MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Stacking Architecture Through TSV and Methods Forming Same
- Publication number 20230395517
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CONFINED GROWTH S/D CONTACT WITH SELECTIVE DEPOSI...
- Publication number 20230377998
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- Jeffrey SMITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING DIFFERENT SIZE OPPOSING BONDING PADS AND...
- Publication number 20230253353
- Publication date Aug 10, 2023
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON CONDUCTIVE FILM, METHOD FOR FORMING NON CONDUCTIVE FILM, CHIP P...
- Publication number 20230215832
- Publication date Jul 6, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIH-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD
- Publication number 20230207303
- Publication date Jun 29, 2023
- Semiconductor Manufacturing International (Beijing) Corporation
- Qingzhao LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
- Publication number 20230048311
- Publication date Feb 16, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20230040454
- Publication date Feb 9, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-SIDE REVEAL FOR POWER DELIVERY TO BACKEND MEMORY
- Publication number 20220415904
- Publication date Dec 29, 2022
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
- Publication number 20220302048
- Publication date Sep 22, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...
- Publication number 20220246572
- Publication date Aug 4, 2022
- Laird Technologies, Inc.
- Vijayaraghavan RAJAGOPAL
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING DIE STACK STRUCTURE
- Publication number 20220165711
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20220020716
- Publication date Jan 20, 2022
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20210134747
- Publication date May 6, 2021
- UNITED MICROELECTRONICS CORP.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT GANG BONDING METHODS AND STRUCTURES
- Publication number 20210098412
- Publication date Apr 1, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20210098411
- Publication date Apr 1, 2021
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20210035954
- Publication date Feb 4, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Structure, Method For Manufacturing The Same, And Chip Structure
- Publication number 20210028151
- Publication date Jan 28, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Structure, Wafer Structure And Method For Manufacturing The Same
- Publication number 20210020596
- Publication date Jan 21, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Hongsheng YI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAYS WITH BONDED AND SHARED LOGIC CIRCUITRY
- Publication number 20200395328
- Publication date Dec 17, 2020
- Intel Corporation
- Richard Fastow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
- Publication number 20200328164
- Publication date Oct 15, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compressible Foamed Thermal Interface Materials and Methods of Maki...
- Publication number 20190348388
- Publication date Nov 14, 2019
- Laird Technologies, Inc.
- Vijayaraghavan RAJAGOPAL
- F28 - HEAT EXCHANGE IN GENERAL

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded assembly containing different size opposing bonding pads and...

Direct gang bonding methods including directly bonding first elemen...

Integrated circuit packages

Compressible foamed thermal interface materials and methods of maki...

Protective elements for bonded structures

Compressible foamed thermal interface materials and methods of maki...

Integrated circuit package and method

Capacitive coupling in a direct-bonded interface for microelectroni...

Protective elements for bonded structures

Compressible foamed thermal interface materials and methods of maki...

Die stack structure with hybrid bonding structure and method of fab...

Ceramic electronic component

Mixed hybrid bonding structures and methods of forming the same

Chip interconnection structure, wafer interconnection structure and...

Wafer structure with capacitive chip interconnection, method for ma...

Integrated circuit package and method

Bonded semiconductor structure and method for forming the same

Memory arrays with bonded and shared logic circuitry

Method of bonding semiconductor substrates

Dam for three-dimensional integrated circuit

Contact structures with porous networks for solder connections, and...

Capacitive coupling in a direct-bonded interface for microelectroni...

Method for producing a silver sintering agent having silver oxide s...

Phosphorus-containing copper powder and method for producing the same

Solid-state wafer bonding of functional materials on substrates and...

Ultrathin layer for forming a capacitive interface between joined i...

Integrated circuits and methods of manufacturing

Advanced through substrate via metallization in three dimensional s...

Advanced through substrate via metallization in three dimensional s...

Semiconductor device including built-in crack-arresting film structure

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES

DIRECT HYBRID BONDING IN TOPOGRAPHIC PACKAGES

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...

PROTECTIVE ELEMENTS FOR BONDED STRUCTURES

Package with Improved Heat Dissipation Efficiency and Method for Fo...

NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE

SEMICONDUCTOR PACKAGE

3D Stacking Architecture Through TSV and Methods Forming Same

METHOD OF FORMING CONFINED GROWTH S/D CONTACT WITH SELECTIVE DEPOSI...

BONDED ASSEMBLY CONTAINING DIFFERENT SIZE OPPOSING BONDING PADS AND...

NON CONDUCTIVE FILM, METHOD FOR FORMING NON CONDUCTIVE FILM, CHIP P...

SEMICONDUCTOR PACKAGING METHOD

BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...

BACK-SIDE REVEAL FOR POWER DELIVERY TO BACKEND MEMORY

PROTECTIVE ELEMENTS FOR BONDED STRUCTURES

COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...

METHOD OF MANUFACTURING DIE STACK STRUCTURE

MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME

BONDED SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

DIRECT GANG BONDING METHODS AND STRUCTURES

MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...

Wafer Structure, Method For Manufacturing The Same, And Chip Structure

Chip Structure, Wafer Structure And Method For Manufacturing The Same

MEMORY ARRAYS WITH BONDED AND SHARED LOGIC CIRCUITRY

PROTECTIVE ELEMENTS FOR BONDED STRUCTURES

Compressible Foamed Thermal Interface Materials and Methods of Maki...