Ceramics

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CPC
H01L2224/13287

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13287Ceramics

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of bonding solder pads of flip-chip package
- Patent number 7,387,910
- Issue date Jun 17, 2008
- Korea Advanced Institute of Science and Technology
- Woong-Sun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of bonding solder pads of flip-chip package
- Publication number 20060258049
- Publication date Nov 16, 2006
- Korea Advanced Institute of Science and Technology
- Woong-Sun Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...