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H01L2224/75652
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/75652
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last 30 patents
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Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
Publication number
20240363579
Publication date
Oct 31, 2024
Samsung Electronics Co., Ltd.
Seungyeop Oh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR