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H01L2224/78101

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78101Chamber

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wire bonding machine cleaning device and method
- Patent number 9,825,000
- Issue date Nov 21, 2017
- International Test Solutions, Inc.
- Alan E. Humphrey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Arrangements and Method for Providing a Bond Connection
- Publication number 20190312008
- Publication date Oct 10, 2019
- INFINEON TECHNOLOGIES AG
- Florian Eacock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD
- Publication number 20180308821
- Publication date Oct 25, 2018
- International Test Solutions, Inc.
- Alan E. Humphrey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR