Changing the shape of the semiconductor body

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H01L21/0475

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/0475Changing the shape of the semiconductor body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of reducing the electrical and thermal resistance of SiC su...
- Patent number 12,148,825
- Issue date Nov 19, 2024
- Purdue Research Foundation
- James Albert Cooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 12,142,495
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Toshiki Kanaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall dopant shielding methods and approaches for trenched semic...
- Patent number 12,094,926
- Issue date Sep 17, 2024
- Wolfspeed, Inc.
- Daniel J. Lichtenwalner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated-gate semiconductor device and method of manufacturing the...
- Patent number 12,074,200
- Issue date Aug 27, 2024
- Fuji Electric Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming polycrystalline channel on dielectric films wit...
- Patent number 12,057,321
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Hsien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large diameter silicon carbide wafers
- Patent number 12,054,850
- Issue date Aug 6, 2024
- Wolfspeed, Inc.
- Yuri Khlebnikov
- C30 - CRYSTAL GROWTH
Information Patent Grant
Directional modification of patterning structure to enhance pattern...
- Patent number 11,984,318
- Issue date May 14, 2024
- Applied Materials, Inc.
- Shurong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation method of wafer
- Patent number 11,901,231
- Issue date Feb 13, 2024
- Disco Corporation
- Asahi Nomoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
And manufacture of self-aligned power devices
- Patent number 11,901,432
- Issue date Feb 13, 2024
- GeneSiC Semiconductor Inc.
- Siddarth Sundaresan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 11,888,024
- Issue date Jan 30, 2024
- Infineon Technologies AG
- Reinhard Ploss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate processing methods
- Patent number 11,823,953
- Issue date Nov 21, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated-gate semiconductor device and method of manufacturing the...
- Patent number 11,798,993
- Issue date Oct 24, 2023
- Fuji Electric Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing substrate, method for manufacturing semico...
- Patent number 11,764,059
- Issue date Sep 19, 2023
- Kabushiki Kaisha Toshiba
- Johji Nishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming polycrystalline channel on dielectric films wit...
- Patent number 11,742,213
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Hsien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of re-using a silicon carbide substrate
- Patent number 11,735,642
- Issue date Aug 22, 2023
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power devices having multiple gate trenches and metho...
- Patent number 11,664,434
- Issue date May 30, 2023
- Wolfspeed, Inc.
- Woongsun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device with a contact region having e...
- Patent number 11,615,953
- Issue date Mar 28, 2023
- Microchip Technology Inc.
- Amaury Gendron-Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated-gate semiconductor device
- Patent number 11,610,969
- Issue date Mar 21, 2023
- Fuji Electric Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical elements
- Patent number 11,590,531
- Issue date Feb 28, 2023
- VisEra Technologies Company Limited
- Sheng-Chuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing silicon carbide semiconductor device, metho...
- Patent number 11,515,387
- Issue date Nov 29, 2022
- Fuji Electric Co., Ltd.
- Yasuyuki Kawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating a silicon carbide and nitride structures on a carrier s...
- Patent number 11,361,964
- Issue date Jun 14, 2022
- The Boeing Company
- Samuel J. Whiteley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer including silicon carbide wafer and method for...
- Patent number 11,348,844
- Issue date May 31, 2022
- Denso Corporation
- Shinya Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, inverter circuit, driving device, vehicle, an...
- Patent number 11,276,751
- Issue date Mar 15, 2022
- Kabushiki Kaisha Toshiba
- Shinya Kyogoku
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Top via on subtractively etched conductive line
- Patent number 11,276,611
- Issue date Mar 15, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide trench semiconductor device
- Patent number 11,245,016
- Issue date Feb 8, 2022
- Alpha and Omega Semiconductor (Cayman) LTD
- David Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,239,356
- Issue date Feb 1, 2022
- Fuji Electric Co., Ltd.
- Akimasa Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned implants for silicon carbide (SiC) technologies and fa...
- Patent number 11,222,782
- Issue date Jan 11, 2022
- Microchip Technology Inc.
- Amaury Gendron-Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, inverter circuit, drive device, vehicle, and...
- Patent number 11,201,210
- Issue date Dec 14, 2021
- Kabushiki Kaisha Toshiba
- Shinya Kyogoku
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,189,709
- Issue date Nov 30, 2021
- Rohm Co., Ltd.
- Yuki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated-gate semiconductor device and method of manufacturing the...
- Patent number 11,177,350
- Issue date Nov 16, 2021
- Fuji Electric Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LARGE DIAMETER SILICON CARBIDE WAFERS
- Publication number 20240352622
- Publication date Oct 24, 2024
- Wolfspeed, Inc.
- Yuri Khlebnikov
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20240339323
- Publication date Oct 10, 2024
- Fuji Electric Co., Ltd.
- Atsushi YOSHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240290881
- Publication date Aug 29, 2024
- RENESAS ELECTRONICS CORPORATION
- Yasuhiro OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH ADDITIONAL MESA STRUCTURES FOR REDUCED S...
- Publication number 20240145537
- Publication date May 2, 2024
- Wolfspeed, Inc.
- Rahul R. Potera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CHIPS
- Publication number 20240145307
- Publication date May 2, 2024
- Disco Corporation
- Takumi KOHEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN AND MANUFACTURE OF SELF-ALIGNED POWER MOSFETs
- Publication number 20240128348
- Publication date Apr 18, 2024
- GeneSiC Semiconductor Inc.
- Siddarth Sundaresan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20240105858
- Publication date Mar 28, 2024
- Fuji Electric Co., Ltd.
- Yuichi HASHIZUME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC MOSFET Including Trench with Rounded Corners
- Publication number 20240079236
- Publication date Mar 7, 2024
- Applied Materials, Inc.
- Qintao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TREATMENT ENVIRONMENT EVALUATION METHOD AND SILICON CARBIDE SU...
- Publication number 20240020814
- Publication date Jan 18, 2024
- KWANSEI GAKUIN EDUCATIONAL FOUNDATION
- Tadaaki KANEKO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL DISCHARGE MACHINING OF SEMICONDUCTORS
- Publication number 20230395381
- Publication date Dec 7, 2023
- Nielson Scientific, LLC
- Gregory NIELSON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR FORMING POLYCRYSTALLINE CHANNEL ON DIELECTRIC FILMS WIT...
- Publication number 20230386856
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Hsien WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Devices in a Layer of Epitaxial Si...
- Publication number 20230361196
- Publication date Nov 9, 2023
- Infineon Techmologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING AN ELECTRONIC DEVICE, SUCH AS A JBS OR MPS DIODE, BASED ON...
- Publication number 20230299173
- Publication date Sep 21, 2023
- STMicroelectronics S.r.l.
- Simone RASCUNA'
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE DEVICE WITH METALLIC INTERFACE LAYERS AND METHOD OF...
- Publication number 20230253454
- Publication date Aug 10, 2023
- INFINEON TECHNOLOGIES AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC SEMICONDUCTOR DEVICE
- Publication number 20230197786
- Publication date Jun 22, 2023
- Rohm Co., Ltd.
- Seigo MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230197519
- Publication date Jun 22, 2023
- DENSO CORPORATION
- YUJI NAGUMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230170399
- Publication date Jun 1, 2023
- DENSO CORPORATION
- YOSUKE MAEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230147932
- Publication date May 11, 2023
- Mitsubishi Electric Corporation
- Yoichiro TARUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE SIDED CHANNEL MESA POWER JUNCTION FIELD EFFECT TRANSISTOR
- Publication number 20230098516
- Publication date Mar 30, 2023
- Monolithic Power Systems, Inc.
- Vipindas PALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230077367
- Publication date Mar 16, 2023
- RENESAS ELECTRONICS CORPORATION
- Yasuhiro OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SPLITTING A SEMICONDUCTOR WORK PIECE
- Publication number 20220339740
- Publication date Oct 27, 2022
- Benjamin Bernard
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220336598
- Publication date Oct 20, 2022
- Rohm Co., Ltd.
- Takaaki YAMANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND ETCHING APPARATUS
- Publication number 20220262655
- Publication date Aug 18, 2022
- TOKYO ELECTRON LIMITED
- Toshiki KANAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA ON SUBTRACTIVELY ETCHED CONDUCTIVE LINE
- Publication number 20220223473
- Publication date Jul 14, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATION METHOD OF WAFER
- Publication number 20220102213
- Publication date Mar 31, 2022
- Disco Corporation
- Asahi NOMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon Carbide Semiconductor Device with a Contact region having E...
- Publication number 20220093397
- Publication date Mar 24, 2022
- Microchip Technology Inc.
- Amaury Gendron-Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL DOPANT SHIELDING METHODS AND APPROACHES FOR TRENCHED SEMIC...
- Publication number 20220052152
- Publication date Feb 17, 2022
- Cree, Inc.
- Daniel J. Lichtenwalner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220052177
- Publication date Feb 17, 2022
- ROHM CO., LTD.
- Yuki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ETCHING TARGET OBJECT
- Publication number 20220005700
- Publication date Jan 6, 2022
- TOKYO ELECTRON LIMITED
- Sho Kumakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE BANDGAP WAFER BACKSIDE CAPPED BY A DETECTION FACILITATING LAYER
- Publication number 20210407799
- Publication date Dec 30, 2021
- Semiconductor Components Industries, LLC
- Tetsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS

Changing the shape of the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of reducing the electrical and thermal resistance of SiC su...

Etching method and etching apparatus

Sidewall dopant shielding methods and approaches for trenched semic...

Insulated-gate semiconductor device and method of manufacturing the...

Methods for forming polycrystalline channel on dielectric films wit...

Large diameter silicon carbide wafers

Directional modification of patterning structure to enhance pattern...

Separation method of wafer

And manufacture of self-aligned power devices

Method of forming a semiconductor device

Semiconductor substrate processing methods

Insulated-gate semiconductor device and method of manufacturing the...

Method for manufacturing substrate, method for manufacturing semico...

Methods for forming polycrystalline channel on dielectric films wit...

Methods of re-using a silicon carbide substrate

Semiconductor power devices having multiple gate trenches and metho...

Silicon carbide semiconductor device with a contact region having e...

Insulated-gate semiconductor device

Optical elements

Method of manufacturing silicon carbide semiconductor device, metho...

Fabricating a silicon carbide and nitride structures on a carrier s...

Semiconductor wafer including silicon carbide wafer and method for...

Semiconductor device, inverter circuit, driving device, vehicle, an...

Top via on subtractively etched conductive line

Silicon carbide trench semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Self-aligned implants for silicon carbide (SiC) technologies and fa...

Semiconductor device, inverter circuit, drive device, vehicle, and...

Semiconductor device and method for manufacturing semiconductor device

Insulated-gate semiconductor device and method of manufacturing the...

Patents Applicationslast 30 patents

LARGE DIAMETER SILICON CARBIDE WAFERS

METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES WITH ADDITIONAL MESA STRUCTURES FOR REDUCED S...

METHOD OF MANUFACTURING CHIPS

DESIGN AND MANUFACTURE OF SELF-ALIGNED POWER MOSFETs

SILICON CARBIDE SEMICONDUCTOR DEVICE

SiC MOSFET Including Trench with Rounded Corners

HEAT TREATMENT ENVIRONMENT EVALUATION METHOD AND SILICON CARBIDE SU...

ELECTRICAL DISCHARGE MACHINING OF SEMICONDUCTORS

METHODS FOR FORMING POLYCRYSTALLINE CHANNEL ON DIELECTRIC FILMS WIT...

Methods of Forming Semiconductor Devices in a Layer of Epitaxial Si...

FORMING AN ELECTRONIC DEVICE, SUCH AS A JBS OR MPS DIODE, BASED ON...

SILICON CARBIDE DEVICE WITH METALLIC INTERFACE LAYERS AND METHOD OF...

SiC SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SINGLE SIDED CHANNEL MESA POWER JUNCTION FIELD EFFECT TRANSISTOR

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHODS OF SPLITTING A SEMICONDUCTOR WORK PIECE

SEMICONDUCTOR DEVICE

ETCHING METHOD AND ETCHING APPARATUS

TOP VIA ON SUBTRACTIVELY ETCHED CONDUCTIVE LINE

SEPARATION METHOD OF WAFER

Silicon Carbide Semiconductor Device with a Contact region having E...

SIDEWALL DOPANT SHIELDING METHODS AND APPROACHES FOR TRENCHED SEMIC...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR ETCHING TARGET OBJECT

WIDE BANDGAP WAFER BACKSIDE CAPPED BY A DETECTION FACILITATING LAYER