characterised by a lifting arrangement

Industry

CPC
H01L21/68742

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68742characterised by a lifting arrangement

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus
- Patent number 12,198,971
- Issue date Jan 14, 2025
- Semes Co., Ltd.
- Jeongcheol Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support with multiple embedded electrodes
- Patent number 12,198,966
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Philip Allan Kraus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High pressure wafer processing systems and related methods
- Patent number 12,198,951
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing chamber, substrate processing system including...
- Patent number 12,191,190
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Yongmyung Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reticle carrier and associated methods
- Patent number 12,189,311
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods to transfer substrates into and out of a spat...
- Patent number 12,183,618
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Sanjeev Baluja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of delivering substrate, and substrate delivery system
- Patent number 12,183,619
- Issue date Dec 31, 2024
- Tokyo Electron Limited
- Takehiro Shindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rotatable thermal processing chamber
- Patent number 12,176,242
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Wolfgang R. Aderhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support structure for thermal processing systems
- Patent number 12,176,241
- Issue date Dec 24, 2024
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Manuel Sohn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 12,165,902
- Issue date Dec 10, 2024
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum processing apparatus and method of controlling vacuum proces...
- Patent number 12,165,908
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Kiyoshi Mori
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Multi zone spot heating in EPI
- Patent number 12,163,229
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Shu-Kwan Lau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing system and transfer method
- Patent number 12,165,893
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Norihiko Amikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for monitoring, determining the position of, and positioning...
- Patent number 12,154,802
- Issue date Nov 26, 2024
- VAT Holding AG
- Alejandro Marzinotto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for etching the periphery edge of a substrate comprising sub...
- Patent number 12,148,634
- Issue date Nov 19, 2024
- DEVICEENG CO., LTD
- Taek Youb Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Calibration jig and calibration method
- Patent number 12,148,645
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Andrew Myles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck design and method for wafer
- Patent number 12,148,651
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holding device
- Patent number 12,142,504
- Issue date Nov 12, 2024
- Nissin Electric Co., Ltd.
- Kazuhiko Irisawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated epitaxy and preclean system
- Patent number 12,125,698
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Lara Hawrylchak
- B08 - CLEANING
Information Patent Grant
Storage module, substrate processing system, and method of transfer...
- Patent number 12,125,738
- Issue date Oct 22, 2024
- Tokyo Electron Limited
- Norihiko Amikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating pin, wafer carrying device and depositing apparatus
- Patent number 12,119,257
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chaoqun Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for monitoring, determining the position of, and positioning...
- Patent number 12,119,247
- Issue date Oct 15, 2024
- VAT Holding AG
- Alejandro Marzinotto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer inspection system
- Patent number 12,117,485
- Issue date Oct 15, 2024
- Tokyo Electron Limited
- Junichi Hagihara
- G01 - MEASURING TESTING
Information Patent Grant
Coater with automatic cleaning function and coater automatic cleani...
- Patent number 12,111,575
- Issue date Oct 8, 2024
- ACM Research (Shanghai) Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate handling device and processing chamber
- Patent number 12,109,681
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- You-Hua Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing method, non-tr...
- Patent number 12,106,998
- Issue date Oct 1, 2024
- Kokusai Electric Corporation
- Naofumi Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer loading bracket, wafer loading system, and wafer mounting met...
- Patent number 12,103,134
- Issue date Oct 1, 2024
- HANGZHOU ZHONGGUI ELECTRONIC TECHNOLOGY CO., LTD
- Hui Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Electric field measuring apparatus and method of measuring electric...
- Patent number 12,105,132
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Jinyeong Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 12,100,667
- Issue date Sep 24, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for controlling lift pin movement
- Patent number 12,100,614
- Issue date Sep 24, 2024
- Applied Materials, Inc.
- Anubhav Srivastava
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRIC FIELD MEASURING APPARATUS AND METHOD OF MEASURING ELECTRIC...
- Publication number 20250004028
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Jinyeong Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANIFOLD FOR SUPPLYING COOLANT TO COMPONENTS OF SUBSTRATE PROCESSIN...
- Publication number 20250006469
- Publication date Jan 2, 2025
- LAM RESEARCH CORPORATION
- Miguel Benjamin VASQUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20250006473
- Publication date Jan 2, 2025
- TOKYO ELECTRON LIMITED
- Yuki ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER EDGE RING LIFTING SOLUTION
- Publication number 20240429088
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Michael R. RICE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL PROCESSING APPARATUS, THERMAL PROCESSING METHOD, AND SUBSTR...
- Publication number 20240412989
- Publication date Dec 12, 2024
- SEMES CO., LTD.
- Young Eun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR CLAMPING A SUBSTRATE ON A MONO-POLAR ELECTROSTATIC CH...
- Publication number 20240404861
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- SUSHIM KOSHTI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Chuck Design and Method for Wafer
- Publication number 20240395595
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING TOOL AND METHOD
- Publication number 20240395537
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-hsiang Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20240387235
- Publication date Nov 21, 2024
- TOKYO ELECTRON LIMITED
- Ryosuke Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support Plate for Localized Heating in Thermal Processing Systems
- Publication number 20240387205
- Publication date Nov 21, 2024
- Mattson Technology, Inc.
- Rolf Bremensdorfer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESS CHAMBER, SEMICONDUCTOR PROCESS INSTRUMENT, AN...
- Publication number 20240371672
- Publication date Nov 7, 2024
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Yongfei WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS FOR CONTROLLING LIFT PIN MOVEMENT
- Publication number 20240371678
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Anubhav SRIVASTAVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS FLOW SUBSTRATE SUPPORTS, PROCESSING CHAMBERS, AND RELATED METHO...
- Publication number 20240363390
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Xinning LUAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DRY DEVELOPMENT APPARATUS AND METHODS FOR VOLATILIZATION OF DRY DEV...
- Publication number 20240355650
- Publication date Oct 24, 2024
- LAM RESEARCH CORPORATION
- Sivananda Krishnan Kanakasabapathy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE RING ARRANGEMENT WITH MOVEABLE EDGE RINGS
- Publication number 20240355667
- Publication date Oct 24, 2024
- LAM RESEARCH CORPORATION
- Haoquan Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIPPING APPARATUS
- Publication number 20240347361
- Publication date Oct 17, 2024
- ACM RESEARCH (SHANGHAI), INC.
- He Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER DECHUCKING SYSTEM AND CARRIER DECHUCKING METHOD USING CARRI...
- Publication number 20240347370
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS SHUTTER ARRANGEMENT
- Publication number 20240347326
- Publication date Oct 17, 2024
- Evatec AG
- JÖRG KERSCHBAUMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSCEPTOR FOR PROCESS CHAMBER
- Publication number 20240339352
- Publication date Oct 10, 2024
- Applied Materials, Inc.
- Zhepeng CONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CLEANING EQUIPMENT, WAFER CHUCK, AND WAFER CLEANING METHOD
- Publication number 20240339353
- Publication date Oct 10, 2024
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Hongyu ZHAO
- B08 - CLEANING
Information Patent Application
ROTATIONAL INDEXER WITH WAFER EDGE GRIP
- Publication number 20240332054
- Publication date Oct 3, 2024
- LAM RESEARCH CORPORATION
- Eric Bramwell Britcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT ASSEMBLY
- Publication number 20240332058
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Sathiyamurthi GOVINDASAMY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SHOWERHEAD WITH THERMAL CONTROL FOR DELIVERING RADICAL A...
- Publication number 20240318312
- Publication date Sep 26, 2024
- LAM RESEARCH CORPORATION
- Rachel E. BATZER
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
APPARATUS AND METHOD FOR PROCESSING WAFER
- Publication number 20240312828
- Publication date Sep 19, 2024
- PIOTECH INC.
- Junichi Arami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION SEPARATION SYSTEM
- Publication number 20240312807
- Publication date Sep 19, 2024
- Applied Materials, Inc.
- Wolfgang R. ADERHOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED TOOL LIFT
- Publication number 20240304490
- Publication date Sep 12, 2024
- LAM RESEARCH CORPORATION
- Paul Albert Avanzino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND CONTROL POSITION SETTING METHOD
- Publication number 20240297061
- Publication date Sep 5, 2024
- TOKYO ELECTRON LIMITED
- Ryoya TOMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OR ETCH CHAMBER WITH COMPLETE SYMMETRY AND HIGH TEMPERAT...
- Publication number 20240290638
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Dmitry Lubomirsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG, SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF OPERATING...
- Publication number 20240282618
- Publication date Aug 22, 2024
- KIOXIA Corporation
- Kentaku ARAI
- H01 - BASIC ELECTRIC ELEMENTS

characterised by a lifting arrangement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate processing apparatus

Substrate support with multiple embedded electrodes

High pressure wafer processing systems and related methods

Substrate processing chamber, substrate processing system including...

Reticle carrier and associated methods

Apparatus and methods to transfer substrates into and out of a spat...

Method of delivering substrate, and substrate delivery system

Rotatable thermal processing chamber

Support structure for thermal processing systems

Substrate bonding apparatus and substrate bonding method

Vacuum processing apparatus and method of controlling vacuum proces...

Multi zone spot heating in EPI

Substrate processing system and transfer method

Method for monitoring, determining the position of, and positioning...

Device for etching the periphery edge of a substrate comprising sub...

Calibration jig and calibration method

Chuck design and method for wafer

Substrate holding device

Integrated epitaxy and preclean system

Storage module, substrate processing system, and method of transfer...

Floating pin, wafer carrying device and depositing apparatus

Method for monitoring, determining the position of, and positioning...

Wafer inspection system

Coater with automatic cleaning function and coater automatic cleani...

Substrate handling device and processing chamber

Substrate processing apparatus, substrate processing method, non-tr...

Wafer loading bracket, wafer loading system, and wafer mounting met...

Electric field measuring apparatus and method of measuring electric...

Apparatus for stacking substrates and method for the same

Apparatus for controlling lift pin movement

Patents Applicationslast 30 patents

ELECTRIC FIELD MEASURING APPARATUS AND METHOD OF MEASURING ELECTRIC...

MANIFOLD FOR SUPPLYING COOLANT TO COMPONENTS OF SUBSTRATE PROCESSIN...

PLASMA PROCESSING APPARATUS

WAFER EDGE RING LIFTING SOLUTION

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

THERMAL PROCESSING APPARATUS, THERMAL PROCESSING METHOD, AND SUBSTR...

APPARATUS FOR CLAMPING A SUBSTRATE ON A MONO-POLAR ELECTROSTATIC CH...

Chuck Design and Method for Wafer

PROCESSING TOOL AND METHOD

SUBSTRATE PROCESSING APPARATUS

Support Plate for Localized Heating in Thermal Processing Systems

SEMICONDUCTOR PROCESS CHAMBER, SEMICONDUCTOR PROCESS INSTRUMENT, AN...

APPARATUS FOR CONTROLLING LIFT PIN MOVEMENT

GAS FLOW SUBSTRATE SUPPORTS, PROCESSING CHAMBERS, AND RELATED METHO...

DRY DEVELOPMENT APPARATUS AND METHODS FOR VOLATILIZATION OF DRY DEV...

EDGE RING ARRANGEMENT WITH MOVEABLE EDGE RINGS

FLIPPING APPARATUS

CARRIER DECHUCKING SYSTEM AND CARRIER DECHUCKING METHOD USING CARRI...

PROCESS SHUTTER ARRANGEMENT

SUSCEPTOR FOR PROCESS CHAMBER

WAFER CLEANING EQUIPMENT, WAFER CHUCK, AND WAFER CLEANING METHOD

ROTATIONAL INDEXER WITH WAFER EDGE GRIP

SUBSTRATE SUPPORT ASSEMBLY

INTEGRATED SHOWERHEAD WITH THERMAL CONTROL FOR DELIVERING RADICAL A...

APPARATUS AND METHOD FOR PROCESSING WAFER

RADIATION SEPARATION SYSTEM

INTEGRATED TOOL LIFT

SUBSTRATE PROCESSING APPARATUS AND CONTROL POSITION SETTING METHOD

DEPOSITION OR ETCH CHAMBER WITH COMPLETE SYMMETRY AND HIGH TEMPERAT...

JIG, SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF OPERATING...