characterised by a lifting arrangement

Industry

CPC
H01L21/68742

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68742characterised by a lifting arrangement

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate support assembly and substrate processing apparatus
- Patent number 12,243,767
- Issue date Mar 4, 2025
- Eugene Technology Co., Ltd.
- Sang Don Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus including electrostatic chuck, subst...
- Patent number 12,243,727
- Issue date Mar 4, 2025
- Semes Co., Ltd.
- Dong Chan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for improving fusion bonding
- Patent number 12,243,848
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hong-Ta Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lift pin interface in a substrate support
- Patent number 12,237,200
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Alexander Sulyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,230,515
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- Nobuhiko Mouri
- B08 - CLEANING
Information Patent Grant
Moveable edge ring designs
- Patent number 12,230,482
- Issue date Feb 18, 2025
- Lam Research Corporation
- Hiran Rajitha Rathnasinghe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Level monitoring and active adjustment of a substrate support assembly
- Patent number 12,227,847
- Issue date Feb 18, 2025
- Applied Materials, Inc.
- James V. Santiago
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cooling sheet attachment apparatus to focusing ring for semiconduct...
- Patent number 12,224,188
- Issue date Feb 11, 2025
- CM TECH Co., Ltd.
- Man Soo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lift pin mechanism
- Patent number 12,211,734
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Alexander Sulyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,204,256
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Kouichi Mizunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cleaning apparatus, substrate cleaning method, and non-tr...
- Patent number 12,202,016
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Yuki Ito
- B08 - CLEANING
Information Patent Grant
Batch curing chamber with gas distribution and individual pumping
- Patent number 12,203,171
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Adib Khan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus
- Patent number 12,198,971
- Issue date Jan 14, 2025
- Semes Co., Ltd.
- Jeongcheol Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support with multiple embedded electrodes
- Patent number 12,198,966
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Philip Allan Kraus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High pressure wafer processing systems and related methods
- Patent number 12,198,951
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing chamber, substrate processing system including...
- Patent number 12,191,190
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Yongmyung Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reticle carrier and associated methods
- Patent number 12,189,311
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods to transfer substrates into and out of a spat...
- Patent number 12,183,618
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Sanjeev Baluja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of delivering substrate, and substrate delivery system
- Patent number 12,183,619
- Issue date Dec 31, 2024
- Tokyo Electron Limited
- Takehiro Shindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rotatable thermal processing chamber
- Patent number 12,176,242
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Wolfgang R. Aderhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support structure for thermal processing systems
- Patent number 12,176,241
- Issue date Dec 24, 2024
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Manuel Sohn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 12,165,902
- Issue date Dec 10, 2024
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum processing apparatus and method of controlling vacuum proces...
- Patent number 12,165,908
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Kiyoshi Mori
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Multi zone spot heating in EPI
- Patent number 12,163,229
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Shu-Kwan Lau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing system and transfer method
- Patent number 12,165,893
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Norihiko Amikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for monitoring, determining the position of, and positioning...
- Patent number 12,154,802
- Issue date Nov 26, 2024
- VAT Holding AG
- Alejandro Marzinotto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for etching the periphery edge of a substrate comprising sub...
- Patent number 12,148,634
- Issue date Nov 19, 2024
- DEVICEENG CO., LTD
- Taek Youb Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Calibration jig and calibration method
- Patent number 12,148,645
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Andrew Myles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck design and method for wafer
- Patent number 12,148,651
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holding device
- Patent number 12,142,504
- Issue date Nov 12, 2024
- Nissin Electric Co., Ltd.
- Kazuhiko Irisawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WAFER CHUCK INCLUDING SELF-SEALING VACUUM SEAL ASSEMBLIES AND METHO...
- Publication number 20250079228
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SWITCH FOR WAFER TEMPERATURE MODULATION
- Publication number 20250079234
- Publication date Mar 6, 2025
- ASM IP HOLDING B.V.
- Hang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INSPECTION APPARATUS
- Publication number 20250076360
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Daesung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250079220
- Publication date Mar 6, 2025
- SCREEN Holdings Co., Ltd.
- Satoshi KAKINOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DEGAS STATION
- Publication number 20250069915
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Thomas BREZOCZKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI ZONE SPOT HEATING IN EPI
- Publication number 20250066918
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Shu-Kwan LAU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE DEGAS STATION
- Publication number 20250069914
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Thomas BREZOCZKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT DEVICE WITH DIAGNOSTIC CAPABILITIES
- Publication number 20250062143
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Deepak Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESS DEVICE AND WAFER TRANSFER SYSTEM THEREOF
- Publication number 20250062155
- Publication date Feb 20, 2025
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Donghua ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND METHOD
- Publication number 20250054798
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT ASSEMBLY FOR SUBSTRATE TREATMENT APPARATUS
- Publication number 20250054802
- Publication date Feb 13, 2025
- DEVICEENG CO., LTD.
- Taek Youb Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND TRANSFER METHOD
- Publication number 20250054793
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Norihiko AMIKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS TO TRANSFER SUBSTRATES INTO AND OUT OF A SPAT...
- Publication number 20250054804
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Sanjeev Baluja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING CHAMBER, SUBSTRATE PROCESSING SYSTEM INCLUDING...
- Publication number 20250054805
- Publication date Feb 13, 2025
- SAMSUNG ELECTRONICS CoO., LTD.
- Yongmyung JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD FOR IMP...
- Publication number 20250054803
- Publication date Feb 13, 2025
- PSK Holdings Inc.
- Gunwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM PROCESSING APPARATUS AND METHOD OF CONTROLLING VACUUM PROCES...
- Publication number 20250046648
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Kiyoshi MORI
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
INTEGRATED EPITAXY AND PRECLEAN SYSTEM
- Publication number 20250046596
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Lara HAWRYLCHAK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PROCESS DEVICE AND WAFER SUPPORT STRUCTURE THEREOF
- Publication number 20250046647
- Publication date Feb 6, 2025
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Shoulin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIFT FRAMES FOR CENTRAL HEATING, AND RELATED PROCESSING CHAMBERS AN...
- Publication number 20250038040
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Ala MORADIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIFT PINS, LIFT PIN ARRANGEMENTS, SEMICONDUCTOR PROCESSING SYSTEMS,...
- Publication number 20250038039
- Publication date Jan 30, 2025
- ASM IP HOLDING B.V.
- Ion Hong Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIFT PIN PROTECTION ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250029868
- Publication date Jan 23, 2025
- EUGENE TECHNOLOGY CO., LTD.
- Doo Yeol RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SEPARATING WAFER SLICES
- Publication number 20250029846
- Publication date Jan 23, 2025
- Yield Engineering Systems, Inc.
- Al Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANIFOLD FOR SUPPLYING COOLANT TO COMPONENTS OF SUBSTRATE PROCESSIN...
- Publication number 20250006469
- Publication date Jan 2, 2025
- LAM RESEARCH CORPORATION
- Miguel Benjamin VASQUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20250006473
- Publication date Jan 2, 2025
- TOKYO ELECTRON LIMITED
- Yuki ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC FIELD MEASURING APPARATUS AND METHOD OF MEASURING ELECTRIC...
- Publication number 20250004028
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Jinyeong Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER EDGE RING LIFTING SOLUTION
- Publication number 20240429088
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Michael R. RICE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL PROCESSING APPARATUS, THERMAL PROCESSING METHOD, AND SUBSTR...
- Publication number 20240412989
- Publication date Dec 12, 2024
- SEMES CO., LTD.
- Young Eun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR CLAMPING A SUBSTRATE ON A MONO-POLAR ELECTROSTATIC CH...
- Publication number 20240404861
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- SUSHIM KOSHTI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Chuck Design and Method for Wafer
- Publication number 20240395595
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

characterised by a lifting arrangement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate support assembly and substrate processing apparatus

Substrate processing apparatus including electrostatic chuck, subst...

Methods and systems for improving fusion bonding

Lift pin interface in a substrate support

Substrate processing apparatus and substrate processing method

Moveable edge ring designs

Level monitoring and active adjustment of a substrate support assembly

Cooling sheet attachment apparatus to focusing ring for semiconduct...

Lift pin mechanism

Substrate processing apparatus

Substrate cleaning apparatus, substrate cleaning method, and non-tr...

Batch curing chamber with gas distribution and individual pumping

Substrate processing apparatus

Substrate support with multiple embedded electrodes

High pressure wafer processing systems and related methods

Substrate processing chamber, substrate processing system including...

Reticle carrier and associated methods

Apparatus and methods to transfer substrates into and out of a spat...

Method of delivering substrate, and substrate delivery system

Rotatable thermal processing chamber

Support structure for thermal processing systems

Substrate bonding apparatus and substrate bonding method

Vacuum processing apparatus and method of controlling vacuum proces...

Multi zone spot heating in EPI

Substrate processing system and transfer method

Method for monitoring, determining the position of, and positioning...

Device for etching the periphery edge of a substrate comprising sub...

Calibration jig and calibration method

Chuck design and method for wafer

Substrate holding device

Patents Applicationslast 30 patents

WAFER CHUCK INCLUDING SELF-SEALING VACUUM SEAL ASSEMBLIES AND METHO...

THERMAL SWITCH FOR WAFER TEMPERATURE MODULATION

SUBSTRATE INSPECTION APPARATUS

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE DEGAS STATION

MULTI ZONE SPOT HEATING IN EPI

SUBSTRATE DEGAS STATION

SUBSTRATE SUPPORT DEVICE WITH DIAGNOSTIC CAPABILITIES

SEMICONDUCTOR PROCESS DEVICE AND WAFER TRANSFER SYSTEM THEREOF

BONDING SYSTEM AND METHOD

SUBSTRATE SUPPORT ASSEMBLY FOR SUBSTRATE TREATMENT APPARATUS

SUBSTRATE PROCESSING SYSTEM AND TRANSFER METHOD

APPARATUS AND METHODS TO TRANSFER SUBSTRATES INTO AND OUT OF A SPAT...

SUBSTRATE PROCESSING CHAMBER, SUBSTRATE PROCESSING SYSTEM INCLUDING...

SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD FOR IMP...

VACUUM PROCESSING APPARATUS AND METHOD OF CONTROLLING VACUUM PROCES...

INTEGRATED EPITAXY AND PRECLEAN SYSTEM

SEMICONDUCTOR PROCESS DEVICE AND WAFER SUPPORT STRUCTURE THEREOF

LIFT FRAMES FOR CENTRAL HEATING, AND RELATED PROCESSING CHAMBERS AN...

LIFT PINS, LIFT PIN ARRANGEMENTS, SEMICONDUCTOR PROCESSING SYSTEMS,...

LIFT PIN PROTECTION ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS

APPARATUS AND METHOD FOR SEPARATING WAFER SLICES

MANIFOLD FOR SUPPLYING COOLANT TO COMPONENTS OF SUBSTRATE PROCESSIN...

PLASMA PROCESSING APPARATUS

ELECTRIC FIELD MEASURING APPARATUS AND METHOD OF MEASURING ELECTRIC...

WAFER EDGE RING LIFTING SOLUTION

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

THERMAL PROCESSING APPARATUS, THERMAL PROCESSING METHOD, AND SUBSTR...

APPARATUS FOR CLAMPING A SUBSTRATE ON A MONO-POLAR ELECTROSTATIC CH...

Chuck Design and Method for Wafer