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SUBSTRATE PROCESSING APPARATUS
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Publication number 20240094645
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Publication date Mar 21, 2024
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TOKYO ELECTRON LIMITED
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Kouichi Mizunaga
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H01 - BASIC ELECTRIC ELEMENTS
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WAFER PLACEMENT TABLE
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Publication number 20240079218
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Publication date Mar 7, 2024
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NGK Insulators, Ltd.
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Tatsuya KUNO
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H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE FIXING DEVICE
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Publication number 20240071800
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Publication date Feb 29, 2024
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Shinko Electric Industries Co., Ltd.
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Yasuhiko Kusama
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H01 - BASIC ELECTRIC ELEMENTS
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METHODS AND SYSTEMS FOR DRY ETCHING
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Publication number 20240071803
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Publication date Feb 29, 2024
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TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
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Fu-Yi Liu
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H01 - BASIC ELECTRIC ELEMENTS
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APPARATUS FOR HEATING WAFER
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Publication number 20240071806
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Publication date Feb 29, 2024
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Samsung Electronics Co., Ltd.
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Jeongdu Kim
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H01 - BASIC ELECTRIC ELEMENTS
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MULTI ZONE SPOT HEATING IN EPI
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Publication number 20240044004
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Publication date Feb 8, 2024
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Applied Materials, Inc.
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Shu-Kwan LAU
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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WAFER CLEANING APPARATUS AND METHOD
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Publication number 20240021446
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Publication date Jan 18, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Jieh-Chau HUANG
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H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE FIXING DEVICE
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Publication number 20230411199
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Publication date Dec 21, 2023
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Shinko Electric Industries Co., Ltd.
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Masahiro Sunohara
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H01 - BASIC ELECTRIC ELEMENTS
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