characterised by a plurality of separate clamping members

Industry

CPC
H01L21/68728

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68728characterised by a plurality of separate clamping members

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus, substrate processing method, and st...
- Patent number 11,967,509
- Issue date Apr 23, 2024
- Tokyo Electron Limited
- Osamu Miyahara
- B08 - CLEANING
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,955,365
- Issue date Apr 9, 2024
- Tokyo Electron Limited
- Yoshinori Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support mechanism, substrate cleaning device and substrat...
- Patent number 11,948,827
- Issue date Apr 2, 2024
- Ebara Corporation
- Mitsuru Miyazaki
- B08 - CLEANING
Information Patent Grant
Clipping mechanism for fastening a substrate for a surface treatmen...
- Patent number 11,942,356
- Issue date Mar 26, 2024
- SEMSYSCO GMBH
- Andreas Gleissner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing apparatus and wafer processing method
- Patent number 11,901,212
- Issue date Feb 13, 2024
- ZEUS CO., LTD.
- Woon Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,887,869
- Issue date Jan 30, 2024
- Tokyo Electron Limited
- Nobuhiko Mouri
- B08 - CLEANING
Information Patent Grant
Substrate flipping in vacuum for dual sided PVD sputtering
- Patent number 11,881,427
- Issue date Jan 23, 2024
- Applied Materials, Inc.
- Harish Penmethsa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Polishing apparatus
- Patent number 11,865,665
- Issue date Jan 9, 2024
- Ebara Corporation
- Kenichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Alignment mechanism and alignment method of bonding machine
- Patent number 11,869,792
- Issue date Jan 9, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer cleaning apparatus
- Patent number 11,854,793
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chen
- B08 - CLEANING
Information Patent Grant
Alignment holder and testing apparatus
- Patent number 11,823,936
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning semiconductor wafer
- Patent number 11,823,945
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wang-Hua Lin
- B08 - CLEANING
Information Patent Grant
Wafer-level package assembly handling
- Patent number 11,809,441
- Issue date Nov 7, 2023
- Onto Innovation Inc.
- Kevin Barr
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate processing device and substrate processing method
- Patent number 11,804,387
- Issue date Oct 31, 2023
- SCREEN Holdings Co., Ltd.
- Daichi Yoshitomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
UHV in-situ cryo-cool chamber
- Patent number 11,802,340
- Issue date Oct 31, 2023
- Applied Materials, Inc.
- Bharath Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processing apparatus
- Patent number 11,791,196
- Issue date Oct 17, 2023
- Disco Corporation
- Yoshitaka Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing device
- Patent number 11,764,055
- Issue date Sep 19, 2023
- SCREEN Holdings Co., Ltd.
- Nobuyuki Shibayama
- B08 - CLEANING
Information Patent Grant
Wafer cleaning apparatus and method
- Patent number 11,764,081
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jieh-Chau Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mechanism and alignment method of bonding machine
- Patent number 11,735,456
- Issue date Aug 22, 2023
- SKY TECH INC.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,710,629
- Issue date Jul 25, 2023
- SCREEN Holdings Co., Ltd.
- Tomonori Fujiwara
- B08 - CLEANING
Information Patent Grant
Spin head, apparatus and method for treating a substrate including...
- Patent number 11,682,577
- Issue date Jun 20, 2023
- Semes Co., Ltd.
- Jihwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cleaning device, substrate processing apparatus, substrat...
- Patent number 11,676,811
- Issue date Jun 13, 2023
- SCREEN Holdings Co., Ltd.
- Koji Nishiyama
- B08 - CLEANING
Information Patent Grant
Substrate carrier
- Patent number 11,676,849
- Issue date Jun 13, 2023
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holding mechanism and substrate processing apparatus
- Patent number 11,664,201
- Issue date May 30, 2023
- Tokyo Electron Limited
- Hitoshi Kato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thin material handling carrier
- Patent number 11,658,059
- Issue date May 23, 2023
- II-VI DELAWARE, INC.
- John W. Stayt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing apparatus including laser module
- Patent number 11,631,599
- Issue date Apr 18, 2023
- Samsung Electronics Co., Ltd.
- Ji Hoon Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer holding pins and methods of using the same
- Patent number 11,626,300
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Lun Chen
- B08 - CLEANING
Information Patent Grant
Simultaneous bonding approach for high quality wafer stacking appli...
- Patent number 11,621,186
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System apparatus and method for enhancing electrical clamping of su...
- Patent number 11,538,714
- Issue date Dec 27, 2022
- Applied Materials, Inc.
- Qin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer carrier and method
- Patent number 11,535,952
- Issue date Dec 27, 2022
- Infineon Technologies Americas Corp.
- Mihir Tungare
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POLISHING APPARATUS
- Publication number 20240091899
- Publication date Mar 21, 2024
- EBARA CORPORATION
- Kenichi KOBAYASHI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE FLIPPING IN VACUUM FOR DUAL SIDED PVD SPUTTERING
- Publication number 20240096687
- Publication date Mar 21, 2024
- Applied Materials, Inc.
- Harish V PENMETHSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER CLEANING APPARATUS
- Publication number 20240087878
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun CHEN
- B08 - CLEANING
Information Patent Application
HEATING TREATMENT DEVICE FOR PHOTOVOLTAIC MODULE RECYCLING
- Publication number 20240079514
- Publication date Mar 7, 2024
- CHANGZHOU INSTITUTE OF TECHNOLOGY
- Pin ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
- Publication number 20240038573
- Publication date Feb 1, 2024
- ZEUS CO., LTD.
- Woon Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CLEANING APPARATUS AND METHOD
- Publication number 20240021446
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jieh-Chau HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20230420288
- Publication date Dec 28, 2023
- SHIBAURA MECHATRONICS CORPORATION
- Takahiro HAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR PROCESSING A WAFER-SHAPED ARTICLE
- Publication number 20230298928
- Publication date Sep 21, 2023
- LAM RESEARCH AG
- Michael BRUGGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CLEANING METHOD AND SUBSTRATE PROCESSING METHOD
- Publication number 20230268174
- Publication date Aug 24, 2023
- SCREEN Holdings Co., Ltd.
- Koji NISHIYAMA
- B08 - CLEANING
Information Patent Application
CLIPPING MECHANISM FOR FASTENING A SUBSTRATE FOR A SURFACE TREATMEN...
- Publication number 20230260823
- Publication date Aug 17, 2023
- Semsysco GmbH
- Andreas Gleissner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230253218
- Publication date Aug 10, 2023
- Samsung Electronics Co., Ltd.
- Ji Hoon CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Material Handling Carrier
- Publication number 20230253235
- Publication date Aug 10, 2023
- II-VI Delaware, Inc.
- John W. Stayt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...
- Publication number 20230238268
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LOCKING MECHANISM, WAFER POSITIONING DEVICE AND WAFER CONVEYI...
- Publication number 20230223293
- Publication date Jul 13, 2023
- Zhongke Jingyuan Electron Limited, Beijing (CN)
- Lei JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDER AND METHOD FOR FIXING AND BONDING A SUBSTRATE
- Publication number 20230187259
- Publication date Jun 15, 2023
- EV GROUP E. THALLNER GMBH
- Thomas PLACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT MECHANISM AND ALIGNMENT METHOD OF BONDING MACHINE
- Publication number 20230138307
- Publication date May 4, 2023
- SKY TECH INC.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FLIPPING IN VACUUM FOR DUAL SIDED PVD SPUTTERING
- Publication number 20230103481
- Publication date Apr 6, 2023
- Applied Materials, Inc.
- Harish Penmethsa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Carrier and Method
- Publication number 20230093855
- Publication date Mar 30, 2023
- Infineon Technologies Americas Corp.
- Mihir Tungare
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20230060135
- Publication date Mar 2, 2023
- EBARA CORPORATION
- Nobuyuki TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ALIGNMENT DEVICE, SUBSTRATE PROCESSING APPARATUS, SUBSTRA...
- Publication number 20230010624
- Publication date Jan 12, 2023
- SCREEN Holdings Co., Ltd.
- Nobuaki OKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CONVEYANCE UNIT AND WAFER CONVEYANCE METHOD
- Publication number 20220406644
- Publication date Dec 22, 2022
- Hamamatsu Photonics K.K.
- Akira SHIMASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Holding Pins and Methods of Using the Same
- Publication number 20220336236
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Lun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT HOLDER AND TESTING APPARATUS
- Publication number 20220238364
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20220230857
- Publication date Jul 21, 2022
- TOKYO ELECTRON LIMITED
- Eiichi SUGAWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20220189782
- Publication date Jun 16, 2022
- SCREEN Holdings Co, Ltd.
- Tomonori FUJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCULAR WAFER LATERAL POSITIONING DEVICE
- Publication number 20220181191
- Publication date Jun 9, 2022
- Core Flow Ltd.
- Alon SEGAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATING APPARATUS
- Publication number 20220172979
- Publication date Jun 2, 2022
- SCREEN Holdings Co., Ltd.
- Hirofumi TONAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20220130712
- Publication date Apr 28, 2022
- TOKYO ELECTRON LIMITED
- Junnosuke TAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT MECHANISM AND ALIGNMENT METHOD OF BONDING MACHINE
- Publication number 20220122868
- Publication date Apr 21, 2022
- SKY TECH INC.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20210398827
- Publication date Dec 23, 2021
- TOKYO ELECTRON LIMITED
- Nobuhiko Mouri
- H01 - BASIC ELECTRIC ELEMENTS

characterised by a plurality of separate clamping members

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate processing apparatus, substrate processing method, and st...

Substrate processing method and substrate processing apparatus

Substrate support mechanism, substrate cleaning device and substrat...

Clipping mechanism for fastening a substrate for a surface treatmen...

Wafer processing apparatus and wafer processing method

Substrate processing apparatus and substrate processing method

Substrate flipping in vacuum for dual sided PVD sputtering

Polishing apparatus

Alignment mechanism and alignment method of bonding machine

Semiconductor wafer cleaning apparatus

Alignment holder and testing apparatus

Method for cleaning semiconductor wafer

Wafer-level package assembly handling

Substrate processing device and substrate processing method

UHV in-situ cryo-cool chamber

Processing apparatus

Substrate processing method and substrate processing device

Wafer cleaning apparatus and method

Alignment mechanism and alignment method of bonding machine

Substrate processing apparatus and substrate processing method

Spin head, apparatus and method for treating a substrate including...

Substrate cleaning device, substrate processing apparatus, substrat...

Substrate carrier

Substrate holding mechanism and substrate processing apparatus

Thin material handling carrier

Semiconductor device manufacturing apparatus including laser module

Wafer holding pins and methods of using the same

Simultaneous bonding approach for high quality wafer stacking appli...

System apparatus and method for enhancing electrical clamping of su...

Wafer carrier and method

Patents Applicationslast 30 patents

POLISHING APPARATUS

SUBSTRATE FLIPPING IN VACUUM FOR DUAL SIDED PVD SPUTTERING

SEMICONDUCTOR WAFER CLEANING APPARATUS

HEATING TREATMENT DEVICE FOR PHOTOVOLTAIC MODULE RECYCLING

WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

WAFER CLEANING APPARATUS AND METHOD

SUBSTRATE PROCESSING APPARATUS

APPARATUS FOR PROCESSING A WAFER-SHAPED ARTICLE

SUBSTRATE CLEANING METHOD AND SUBSTRATE PROCESSING METHOD

CLIPPING MECHANISM FOR FASTENING A SUBSTRATE FOR A SURFACE TREATMEN...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Thin Material Handling Carrier

SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...

WAFER LOCKING MECHANISM, WAFER POSITIONING DEVICE AND WAFER CONVEYI...

SUBSTRATE HOLDER AND METHOD FOR FIXING AND BONDING A SUBSTRATE

ALIGNMENT MECHANISM AND ALIGNMENT METHOD OF BONDING MACHINE

SUBSTRATE FLIPPING IN VACUUM FOR DUAL SIDED PVD SPUTTERING

Wafer Carrier and Method

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE ALIGNMENT DEVICE, SUBSTRATE PROCESSING APPARATUS, SUBSTRA...

WAFER CONVEYANCE UNIT AND WAFER CONVEYANCE METHOD

Wafer Holding Pins and Methods of Using the Same

ALIGNMENT HOLDER AND TESTING APPARATUS

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

CIRCULAR WAFER LATERAL POSITIONING DEVICE

SUBSTRATE TREATING APPARATUS

SUBSTRATE PROCESSING APPARATUS

ALIGNMENT MECHANISM AND ALIGNMENT METHOD OF BONDING MACHINE

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD