characterised by edge profile or support profile

Industry

CPC
H01L21/68735

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68735characterised by edge profile or support profile

Industries

Patents Grantslast 30 patents

Information Patent Grant
Cover plate for covering the susceptor side facing the process cham...
- Patent number 12,180,590
- Issue date Dec 31, 2024
- Aixtron SE
- Benjamin David Wright
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bottom and middle edge rings
- Patent number 12,183,554
- Issue date Dec 31, 2024
- Lam Research Corporation
- Hiran Rajitha Rathnasinghe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat pocket susceptor design with improved heat transfer
- Patent number 12,170,213
- Issue date Dec 17, 2024
- Applied Materials, Inc.
- Zhepeng Cong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 12,165,902
- Issue date Dec 10, 2024
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Calibration jig and calibration method
- Patent number 12,148,645
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Andrew Myles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck design and method for wafer
- Patent number 12,148,651
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamp ring and method of using clamp ring
- Patent number 12,142,514
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Wei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck with seal surface
- Patent number 12,142,509
- Issue date Nov 12, 2024
- Lam Research Corporation
- Patrick G. Breiling
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate cleaning apparatus and substrate cleaning method
- Patent number 12,131,919
- Issue date Oct 29, 2024
- Tokyo Electron Limited
- Tsunenaga Nakashima
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Multi-zone pedestal heater without vias
- Patent number 12,127,310
- Issue date Oct 22, 2024
- Watlow Electric Manufacturing Company
- Kevin Ptasienski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for wafer chucking on a susceptor for ALD
- Patent number 12,112,969
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Joseph Yudovsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Susceptor arrangement of a CVD reactor
- Patent number 12,110,591
- Issue date Oct 8, 2024
- Aixtron SE
- Francisco Ruda Y Witt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-zone semiconductor substrate supports
- Patent number 12,112,971
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Ian Bensco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 12,100,667
- Issue date Sep 24, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Asymmetrical sealing and gas flow control device
- Patent number 12,094,730
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- June Hee Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer edge ring lifting solution
- Patent number 12,094,752
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Michael R. Rice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom electrode assembly, plasma processing apparatus, and method...
- Patent number 12,094,693
- Issue date Sep 17, 2024
- ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA
- Jiangtao Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, bonding device, and holding member
- Patent number 12,080,554
- Issue date Sep 3, 2024
- Nikon Corporation
- Hajime Mitsuishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Permanent secondary erosion containment for electrostatic chuck bonds
- Patent number 12,074,049
- Issue date Aug 27, 2024
- Lam Research Corporation
- Eric A. Pape
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and system for monitoring substrate processing apparatus
- Patent number 12,068,140
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Sejin Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus and processing method
- Patent number 12,062,569
- Issue date Aug 13, 2024
- Tokyo Electron Limited
- Kazuya Ikeue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etch using material modification and RF pulsing
- Patent number 12,057,329
- Issue date Aug 6, 2024
- Applied Materials, Inc.
- Bhargav Citla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding substrates utilizing a substrate holder with hold...
- Patent number 12,051,601
- Issue date Jul 30, 2024
- Samsung Electronics Co., Ltd.
- Jun-Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck, focus ring, support base, plasma processing ap...
- Patent number 12,046,457
- Issue date Jul 23, 2024
- Tokyo Electron Limited
- Yasuharu Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge ring arrangement with moveable edge rings
- Patent number 12,027,410
- Issue date Jul 2, 2024
- Lam Research Corporation
- Haoquan Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing wafer
- Patent number 12,020,975
- Issue date Jun 25, 2024
- PIOTECH INC.
- Junichi Arami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method for removing substrate fr...
- Patent number 12,020,976
- Issue date Jun 25, 2024
- Ebara Corporation
- Haiyang Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor heat treatment member and manufacturing method thereof
- Patent number 12,014,948
- Issue date Jun 18, 2024
- COORSTEK GK
- Sayaka Togashi
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Semiconductor processing apparatus having improved temperature control
- Patent number 12,009,185
- Issue date Jun 11, 2024
- Applied Materials, Inc.
- Jun Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of bonding substrates utilizing a substrate holder with hold...
- Patent number 12,009,231
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Jun-Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER EDGE RING LIFTING SOLUTION
- Publication number 20240429088
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Michael R. RICE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE CORRECTION DEVICE, SUBSTRATE LAMINATION DEVICE, SUBSTRATE...
- Publication number 20240404859
- Publication date Dec 5, 2024
- Nikon Corporation
- Mikio USHIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDING WAFER HOLDER
- Publication number 20240404868
- Publication date Dec 5, 2024
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Zhengting ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chuck Design and Method for Wafer
- Publication number 20240395595
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLAMP RING AND METHOD OF USING CLAMP RING
- Publication number 20240387233
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CARRIER BORE HOLE PLUG
- Publication number 20240387236
- Publication date Nov 21, 2024
- SCHUNK XYCARB TECHNOLOGY B.V.
- Moritz WIPPERLING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
- Publication number 20240387177
- Publication date Nov 21, 2024
- Nikon Corporation
- Hajime MITSUISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR SUBSTRATE HANDLING
- Publication number 20240379404
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR MONITORING SUBSTRATE PROCESSING APPARATUS
- Publication number 20240371611
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- SEJIN OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS FLOW SUBSTRATE SUPPORTS, PROCESSING CHAMBERS, AND RELATED METHO...
- Publication number 20240363390
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Xinning LUAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING APPARATUS AND PROCESSING METHOD
- Publication number 20240363391
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Kazuya IKEUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE RING ARRANGEMENT WITH MOVEABLE EDGE RINGS
- Publication number 20240355667
- Publication date Oct 24, 2024
- LAM RESEARCH CORPORATION
- Haoquan Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK, FOCUS RING, SUPPORT BASE, PLASMA PROCESSING AP...
- Publication number 20240347322
- Publication date Oct 17, 2024
- TOKYO ELECTRON LIMITED
- Yasuharu SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK, DEPOSITION APPARATUS INCLUDING THE SAME, AND D...
- Publication number 20240347365
- Publication date Oct 17, 2024
- SAMSUNG DISPLAY CO., LTD.
- Suk Beom YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SHOWERHEAD WITH THERMAL CONTROL FOR DELIVERING RADICAL A...
- Publication number 20240318312
- Publication date Sep 26, 2024
- LAM RESEARCH CORPORATION
- Rachel E. BATZER
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, CLEANING METHOD, SUBSTRATE PROCESSI...
- Publication number 20240321597
- Publication date Sep 26, 2024
- Kokusai Electric Corporation
- Kaoru YAMAMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD FOR PROCESSING WAFER
- Publication number 20240312828
- Publication date Sep 19, 2024
- PIOTECH INC.
- Junichi Arami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PECVD DEPOSITION SYSTEM FOR DEPOSITION ON SELECTIVE SIDE OF THE SUB...
- Publication number 20240309507
- Publication date Sep 19, 2024
- LAM RESEARCH CORPORATION
- Fayaz Shaikh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
JIG, SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF OPERATING...
- Publication number 20240282618
- Publication date Aug 22, 2024
- KIOXIA Corporation
- Kentaku ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT WITH IMPROVED PROCESS UNIFORMITY
- Publication number 20240282551
- Publication date Aug 22, 2024
- LAM RESEARCH CORPORATION
- Fangli Hao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAPPING SUBSTRATE SUPPORTS AND PRE-HEAT RINGS, AND RELATED PROC...
- Publication number 20240274463
- Publication date Aug 15, 2024
- Applied Materials, Inc.
- Zhepeng CONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR SEMICONDUCTOR PROCESSING
- Publication number 20240258153
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Joseph Yudovsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD, ASSEMBLY AND SYSTEM FOR FILM DEPOSITION AND CONTROL
- Publication number 20240258154
- Publication date Aug 1, 2024
- ASM IP HOLDING B.V.
- Jereld Lee Winkler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VENTED SUSCEPTOR
- Publication number 20240249970
- Publication date Jul 25, 2024
- ASM IP HOLDING B.V.
- Uday Kiran Rokkam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT CARRIER HAVING MULTIPLE CERAMIC DISCS
- Publication number 20240249965
- Publication date Jul 25, 2024
- Applied Materials, Inc.
- Arvinder Manmohan Singh CHADHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CARRIER
- Publication number 20240249969
- Publication date Jul 25, 2024
- GLOBALWAFERS CO., LTD.
- CHIH-YUAN CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES FOR THERMAL MANAGEMENT OF A PEDESTAL AND CHAMBER
- Publication number 20240234200
- Publication date Jul 11, 2024
- LAM RESEARCH CORPORATION
- Aaron Blake Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
- Publication number 20240213075
- Publication date Jun 27, 2024
- SCREEN Holdings Co., Ltd.
- Yoshifumi OKADA
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
- Publication number 20240213076
- Publication date Jun 27, 2024
- SCREEN Holdings Co., Ltd.
- Yoshifumi OKADA
- B08 - CLEANING

characterised by edge profile or support profile

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cover plate for covering the susceptor side facing the process cham...

Bottom and middle edge rings

Flat pocket susceptor design with improved heat transfer

Substrate bonding apparatus and substrate bonding method

Calibration jig and calibration method

Chuck design and method for wafer

Clamp ring and method of using clamp ring

Electrostatic chuck with seal surface

Substrate cleaning apparatus and substrate cleaning method

Multi-zone pedestal heater without vias

Apparatus and methods for wafer chucking on a susceptor for ALD

Susceptor arrangement of a CVD reactor

Multi-zone semiconductor substrate supports

Apparatus for stacking substrates and method for the same

Asymmetrical sealing and gas flow control device

Wafer edge ring lifting solution

Bottom electrode assembly, plasma processing apparatus, and method...

Bonding method, bonding device, and holding member

Permanent secondary erosion containment for electrostatic chuck bonds

Method and system for monitoring substrate processing apparatus

Processing apparatus and processing method

Selective etch using material modification and RF pulsing

Method of bonding substrates utilizing a substrate holder with hold...

Electrostatic chuck, focus ring, support base, plasma processing ap...

Edge ring arrangement with moveable edge rings

Apparatus and method for processing wafer

Substrate processing apparatus and method for removing substrate fr...

Semiconductor heat treatment member and manufacturing method thereof

Semiconductor processing apparatus having improved temperature control

Method of bonding substrates utilizing a substrate holder with hold...

Patents Applicationslast 30 patents

WAFER EDGE RING LIFTING SOLUTION

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

SUBSTRATE CORRECTION DEVICE, SUBSTRATE LAMINATION DEVICE, SUBSTRATE...

STANDING WAFER HOLDER

Chuck Design and Method for Wafer

CLAMP RING AND METHOD OF USING CLAMP RING

SUBSTRATE CARRIER BORE HOLE PLUG

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

APPARATUS AND METHOD FOR SUBSTRATE HANDLING

METHOD AND SYSTEM FOR MONITORING SUBSTRATE PROCESSING APPARATUS

GAS FLOW SUBSTRATE SUPPORTS, PROCESSING CHAMBERS, AND RELATED METHO...

PROCESSING APPARATUS AND PROCESSING METHOD

EDGE RING ARRANGEMENT WITH MOVEABLE EDGE RINGS

ELECTROSTATIC CHUCK, FOCUS RING, SUPPORT BASE, PLASMA PROCESSING AP...

ELECTROSTATIC CHUCK, DEPOSITION APPARATUS INCLUDING THE SAME, AND D...

INTEGRATED SHOWERHEAD WITH THERMAL CONTROL FOR DELIVERING RADICAL A...

SUBSTRATE PROCESSING APPARATUS, CLEANING METHOD, SUBSTRATE PROCESSI...

APPARATUS AND METHOD FOR PROCESSING WAFER

PECVD DEPOSITION SYSTEM FOR DEPOSITION ON SELECTIVE SIDE OF THE SUB...

JIG, SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF OPERATING...

SUBSTRATE SUPPORT WITH IMPROVED PROCESS UNIFORMITY

OVERLAPPING SUBSTRATE SUPPORTS AND PRE-HEAT RINGS, AND RELATED PROC...

APPARATUS AND METHODS FOR SEMICONDUCTOR PROCESSING

METHOD, ASSEMBLY AND SYSTEM FOR FILM DEPOSITION AND CONTROL

VENTED SUSCEPTOR

SUBSTRATE SUPPORT CARRIER HAVING MULTIPLE CERAMIC DISCS

WAFER CARRIER

APPARATUSES FOR THERMAL MANAGEMENT OF A PEDESTAL AND CHAMBER

SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD