characterised by edge profile or support profile

Industry

CPC
H01L21/68735

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68735characterised by edge profile or support profile

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate supporting plate, thin film deposition apparatus includin...
- Patent number 11,965,262
- Issue date Apr 23, 2024
- ASM IP Holding B.V.
- Yong Min Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vented susceptor
- Patent number 11,961,756
- Issue date Apr 16, 2024
- ASM IP Holding B.V.
- Uday Kiran Rokkam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holding apparatus and substrate processing apparatus
- Patent number 11,961,757
- Issue date Apr 16, 2024
- SCREEN Holdings Co., Ltd.
- Ryo Muramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin-less substrate transfer apparatus and method for a processing c...
- Patent number 11,948,828
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Sultan Malik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece placement apparatus and processing apparatus
- Patent number 11,942,357
- Issue date Mar 26, 2024
- Tokyo Electron Limited
- Yohei Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Calibration jig and calibration method
- Patent number 11,935,773
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Andrew Myles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatically clamped edge ring
- Patent number 11,935,776
- Issue date Mar 19, 2024
- Lam Research Corporation
- Christopher Kimball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support, substrate processing apparatus, and substrate pr...
- Patent number 11,929,240
- Issue date Mar 12, 2024
- Tokyo Electron Limited
- Takehiro Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and semiconductor device manufacturing...
- Patent number 11,929,239
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Sejin Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-function wafer backside pressure control and edge purge
- Patent number 11,923,233
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- Joseph AuBuchon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-zone semiconductor substrate supports
- Patent number 11,915,950
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Mehmet Tugrul Samir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for backside deposition of a substrate
- Patent number 11,908,728
- Issue date Feb 20, 2024
- Tokyo Electron Limited
- Ronald Nasman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate holding mechanism, substrate mounting method, and substra...
- Patent number 11,894,256
- Issue date Feb 6, 2024
- Tokyo Electron Limited
- Toshiaki Takahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-zone pedestal heater having a routing layer
- Patent number 11,895,741
- Issue date Feb 6, 2024
- Watlow Electric Manufacturing Company
- Kevin Ptasienski
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Lithographic apparatus, substrate table, and non-uniform coating me...
- Patent number 11,887,881
- Issue date Jan 30, 2024
- ASML Holding N.V.
- Bruce Tirri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and apparatus for manufacturing inte...
- Patent number 11,887,868
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Young-hoo Kim
- B08 - CLEANING
Information Patent Grant
Susceptor with ring to limit backside deposition
- Patent number 11,885,019
- Issue date Jan 30, 2024
- ASM IP Holding B.V.
- Mark Hawkins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing apparatus and manufacturing method using the same
- Patent number 11,887,998
- Issue date Jan 30, 2024
- Samsung Display Co., Ltd.
- Soo Young Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Object table, a stage apparatus and a lithographic apparatus
- Patent number 11,880,144
- Issue date Jan 23, 2024
- ASML Netherlands B.V.
- Sander Jeroen Hermanussen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate supporting unit and a substrate processing device includi...
- Patent number 11,866,823
- Issue date Jan 9, 2024
- ASM IP Holding B.V.
- SeungHwan Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Device and method for bonding of two substrates
- Patent number 11,862,487
- Issue date Jan 2, 2024
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge ring and plasma processing apparatus
- Patent number 11,862,437
- Issue date Jan 2, 2024
- Kioxia Corporation
- Yasuhisa Ishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate heat treatment apparatus
- Patent number 11,854,842
- Issue date Dec 26, 2023
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for performing spin dry etching
- Patent number 11,854,861
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PECVD deposition system for deposition on selective side of the sub...
- Patent number 11,851,760
- Issue date Dec 26, 2023
- Lam Research Corporation
- Fayaz Shaikh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Injector and substrate processing apparatus using the same, and sub...
- Patent number 11,846,023
- Issue date Dec 19, 2023
- Tokyo Electron Limited
- Tomoyuki Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermal processing susceptor
- Patent number 11,848,226
- Issue date Dec 19, 2023
- Applied Materials, Inc.
- Anhthu Ngo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Process kit ring adaptor
- Patent number 11,842,917
- Issue date Dec 12, 2023
- Applied Materials, Inc.
- Leon Volfovski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier ring designs for controlling deposition on wafer bevel/edge
- Patent number 11,837,495
- Issue date Dec 5, 2023
- Lam Research Corporation
- Michael J. Janicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method of processing a substrate
- Patent number 11,837,496
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Jong Woo Sun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OBJECT TABLE, A STAGE APPARATUS AND A LITHOGRAPHIC APPARATUS
- Publication number 20240142885
- Publication date May 2, 2024
- ASML NETHERLANDS B.V.
- Sander Jeroen HERMANUSSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE WAFER SPIN CLEANING APPARATUS WITH SOAKING, CLEANING, AND ET...
- Publication number 20240145292
- Publication date May 2, 2024
- GRAND PROCESS TECHNOLOGY CORP.
- Li-tso HUANG
- B08 - CLEANING
Information Patent Application
THERMAL PROCESSING SUSCEPTOR
- Publication number 20240112945
- Publication date Apr 4, 2024
- Applied Materials, Inc.
- Anhthu NGO
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SUBSTRATE SUPPORTING APPARATUS
- Publication number 20240105496
- Publication date Mar 28, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATING APPARATUS
- Publication number 20240105484
- Publication date Mar 28, 2024
- SCREEN Holdings Co., Ltd.
- Ichiro MITSUYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOCUS RING, APPARATUS AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER
- Publication number 20240096686
- Publication date Mar 21, 2024
- Hon Young Semiconductor Corporation
- Chia-Jen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER DEVICE AND SEMICONDUCTOR PROCESSING EQUIPMENT
- Publication number 20240084453
- Publication date Mar 14, 2024
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Xu ZHU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD, ASSEMBLY AND SYSTEM FOR GAS INJECTION AND CONTROL
- Publication number 20240071804
- Publication date Feb 29, 2024
- ASM IP HOLDING B.V.
- Peipei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, ASSEMBLY AND SYSTEM FOR GAS INJECTION
- Publication number 20240071805
- Publication date Feb 29, 2024
- ASM IP HOLDING B.V.
- Han Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER RING DESIGNS FOR CONTROLLING DEPOSITION ON WAFER BEVEL/EDGE
- Publication number 20240055293
- Publication date Feb 15, 2024
- LAM RESEARCH CORPORATION
- Michael John Janicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEABLE AND/OR COLLAPSIBLE EDGE RING ASSEMBLIES FOR PLASMA SHEA...
- Publication number 20240038504
- Publication date Feb 1, 2024
- LAM RESEARCH CORPORATION
- Alejandro SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSCEPTOR FOR EPITAXIAL PROCESSING AND EPITAXIAL REACTOR INCLUDING...
- Publication number 20240006225
- Publication date Jan 4, 2024
- GLOBALWAFERS CO., LTD.
- Manabu Hamano
- C30 - CRYSTAL GROWTH
Information Patent Application
SUBSTRATE CARRIER AND SUBSTRATE ASSEMBLY COMPRISING THE SAME
- Publication number 20240006224
- Publication date Jan 4, 2024
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT
- Publication number 20230420279
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Masato ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTl-STATION TOOL WITH ROTATABLE TOP PLATE ASSEMBLY
- Publication number 20230420289
- Publication date Dec 28, 2023
- LAM RESEARCH CORPORATION
- Karl Frederick Leeser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLAMP ASSEMBLY
- Publication number 20230420287
- Publication date Dec 28, 2023
- Chipbond Technology Corporation
- Ching-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING SUBSTRATE
- Publication number 20230411203
- Publication date Dec 21, 2023
- EUGENE TECHNOLOGY CO., LTD.
- Ryong HWANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MOUNTING PAD, MOUNTING MECHANISM, AND SUBSTRATE TRANSFER MECHANISM
- Publication number 20230395421
- Publication date Dec 7, 2023
- TOKYO ELECTRON LIMITED
- Masato OBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD EDGE LOW TEMPERATURE ELECTROSTATIC CHUCK
- Publication number 20230395359
- Publication date Dec 7, 2023
- LAM RESEARCH CORPORATION
- Ambarish Chhatre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORTING PLATE, APPARATUS INCLUDING THE SUBSTRATE SUPPO...
- Publication number 20230392278
- Publication date Dec 7, 2023
- ASM IP HOLDING B.V.
- SungBae Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILIT...
- Publication number 20230386802
- Publication date Nov 30, 2023
- Applied Materials, Inc.
- Zhepeng CONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUSCEPTOR FOR SEMICONDUCTOR SUBSTRATE PROCESSING
- Publication number 20230386889
- Publication date Nov 30, 2023
- ASM IP HOLDING, B.V.
- Saket Rathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE
- Publication number 20230383399
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yi SHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE
- Publication number 20230386883
- Publication date Nov 30, 2023
- Applied Materials, Inc.
- Liangfa HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOVEABLE EDGE RINGS FOR PLASMA PROCESSING SYSTEMS
- Publication number 20230369026
- Publication date Nov 16, 2023
- LAM RESEARCH CORPORATION
- Christopher KIMBALL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING A WAFER
- Publication number 20230360952
- Publication date Nov 9, 2023
- LAM RESEARCH AG
- Michael BRUGGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
- Publication number 20230343647
- Publication date Oct 26, 2023
- Plasma-Therm LLC
- Russell Westerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Robot Having Arm with Unequal Link Lengths
- Publication number 20230335429
- Publication date Oct 19, 2023
- PERSIMMON TECHNOLOGIES CORPORATION
- Martin HOSEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20230326725
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Shuichi TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE RING OR PROCESS KIT FOR SEMICONDUCTOR PROCESS MODULE
- Publication number 20230296512
- Publication date Sep 21, 2023
- Applied Materials, Inc.
- Allen L. D'AMBRA
- H01 - BASIC ELECTRIC ELEMENTS

characterised by edge profile or support profile

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate supporting plate, thin film deposition apparatus includin...

Vented susceptor

Substrate holding apparatus and substrate processing apparatus

Pin-less substrate transfer apparatus and method for a processing c...

Workpiece placement apparatus and processing apparatus

Calibration jig and calibration method

Electrostatically clamped edge ring

Substrate support, substrate processing apparatus, and substrate pr...

Plasma processing apparatus and semiconductor device manufacturing...

Dual-function wafer backside pressure control and edge purge

Multi-zone semiconductor substrate supports

System for backside deposition of a substrate

Substrate holding mechanism, substrate mounting method, and substra...

Multi-zone pedestal heater having a routing layer

Lithographic apparatus, substrate table, and non-uniform coating me...

Substrate processing apparatus and apparatus for manufacturing inte...

Susceptor with ring to limit backside deposition

Manufacturing apparatus and manufacturing method using the same

Object table, a stage apparatus and a lithographic apparatus

Substrate supporting unit and a substrate processing device includi...

Device and method for bonding of two substrates

Edge ring and plasma processing apparatus

Substrate heat treatment apparatus

System and method for performing spin dry etching

PECVD deposition system for deposition on selective side of the sub...

Injector and substrate processing apparatus using the same, and sub...

Thermal processing susceptor

Process kit ring adaptor

Carrier ring designs for controlling deposition on wafer bevel/edge

Substrate processing apparatus and method of processing a substrate

Patents Applicationslast 30 patents

OBJECT TABLE, A STAGE APPARATUS AND A LITHOGRAPHIC APPARATUS

SINGLE WAFER SPIN CLEANING APPARATUS WITH SOAKING, CLEANING, AND ET...

THERMAL PROCESSING SUSCEPTOR

SUBSTRATE SUPPORTING APPARATUS

SUBSTRATE TREATING APPARATUS

FOCUS RING, APPARATUS AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER

CARRIER DEVICE AND SEMICONDUCTOR PROCESSING EQUIPMENT

METHOD, ASSEMBLY AND SYSTEM FOR GAS INJECTION AND CONTROL

METHOD, ASSEMBLY AND SYSTEM FOR GAS INJECTION

CARRIER RING DESIGNS FOR CONTROLLING DEPOSITION ON WAFER BEVEL/EDGE

REPLACEABLE AND/OR COLLAPSIBLE EDGE RING ASSEMBLIES FOR PLASMA SHEA...

SUSCEPTOR FOR EPITAXIAL PROCESSING AND EPITAXIAL REACTOR INCLUDING...

SUBSTRATE CARRIER AND SUBSTRATE ASSEMBLY COMPRISING THE SAME

SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT

MULTl-STATION TOOL WITH ROTATABLE TOP PLATE ASSEMBLY

CLAMP ASSEMBLY

APPARATUS FOR PROCESSING SUBSTRATE

MOUNTING PAD, MOUNTING MECHANISM, AND SUBSTRATE TRANSFER MECHANISM

COLD EDGE LOW TEMPERATURE ELECTROSTATIC CHUCK

SUBSTRATE SUPPORTING PLATE, APPARATUS INCLUDING THE SUBSTRATE SUPPO...

PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILIT...

SUSCEPTOR FOR SEMICONDUCTOR SUBSTRATE PROCESSING

STRUCTURES AND METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE

METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE

MOVEABLE EDGE RINGS FOR PLASMA PROCESSING SYSTEMS

APPARATUS FOR PROCESSING A WAFER

METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

Robot Having Arm with Unequal Link Lengths

PLASMA PROCESSING APPARATUS

EDGE RING OR PROCESS KIT FOR SEMICONDUCTOR PROCESS MODULE