characterised by selective plating

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CPC
H05K3/243

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/243characterised by selective plating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Planar lightwave circuit structure based on printed circuit board a...
- Patent number 12,137,519
- Issue date Nov 5, 2024
- Soochow University
- Mingdi Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Machining station and method for machining workpieces
- Patent number 11,963,305
- Issue date Apr 16, 2024
- Skybrain Vermögensverwaltungs GmbH
- Markus Winterschladen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating contact pads for electronic substrates
- Patent number 11,765,826
- Issue date Sep 19, 2023
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel molded electronic assemblies with integral terminals
- Patent number 11,304,297
- Issue date Apr 12, 2022
- Vicor Corporation
- Patrizio Vinciarelli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector and connector system having plated ground shields
- Patent number 11,183,787
- Issue date Nov 23, 2021
- TE CONNECTIVITY SERVICES GMBH
- John Joseph Consoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for a high temperature vacuum-safe solder resist...
- Patent number 11,135,669
- Issue date Oct 5, 2021
- Cree, Inc.
- Jennifer Stabach
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Producing method of wired circuit board
- Patent number 11,091,850
- Issue date Aug 17, 2021
- Nitto Denko Corporation
- Yuu Sugimoto
- G11 - INFORMATION STORAGE
Information Patent Grant
Microcircuit forming method and etching fluid composition
- Patent number 11,089,691
- Issue date Aug 10, 2021
- Inktec Co., Ltd.
- Su Han Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Contact pads for electronic substrates and related methods
- Patent number 10,905,007
- Issue date Jan 26, 2021
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 10,856,421
- Issue date Dec 1, 2020
- Unimicron Technology Corp.
- Ching-Hao Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for production thereof
- Patent number 10,834,810
- Issue date Nov 10, 2020
- Schweizer Electronic AG
- Hubert Trageser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board and production method thereof
- Patent number 10,808,329
- Issue date Oct 20, 2020
- Nitto Denko Corporation
- Yuu Sugimoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Panel molded electronic assemblies with integral terminals
- Patent number 10,785,871
- Issue date Sep 22, 2020
- VLT, Inc.
- Patrizio Vinciarelli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board structure and manufacturing method thereof
- Patent number 10,736,215
- Issue date Aug 4, 2020
- Unimicron Technology Corp.
- Shao-Chien Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having bonding regions exposed through protect...
- Patent number 10,699,994
- Issue date Jun 30, 2020
- Fuji Electric Co., Ltd.
- Kenshi Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting package having a guiding member guiding an optical m...
- Patent number 10,490,722
- Issue date Nov 26, 2019
- LG Innotek Co., Ltd
- Jun Seok Park
- F21 - LIGHTING
Information Patent Grant
Solder resist and printed wiring board
- Patent number 10,321,579
- Issue date Jun 11, 2019
- Ibiden Co., Ltd.
- Yuji Ikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having support plate and method for manufactur...
- Patent number 10,271,430
- Issue date Apr 23, 2019
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having embedded pads and method for manufactur...
- Patent number 10,249,561
- Issue date Apr 2, 2019
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Membrane circuit structure with function expandability
- Patent number 10,251,264
- Issue date Apr 2, 2019
- Primax Electronics Ltd.
- Bo-An Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Light emitting package having a guiding member guiding an optical m...
- Patent number 10,193,044
- Issue date Jan 29, 2019
- LG Innotek Co., Ltd
- Jun Seok Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and connection structure
- Patent number 10,194,531
- Issue date Jan 29, 2019
- Fuji Xerox Co., Ltd.
- Shigemi Ohtsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating substrate structure and substrate structure f...
- Patent number 10,087,527
- Issue date Oct 2, 2018
- Wistron NeWeb Corp.
- Babak Radi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and device for a high temperature vacuum-safe solder stop ut...
- Patent number 10,076,800
- Issue date Sep 18, 2018
- Cree Fayetteville, Inc.
- Jennifer Stabach
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector inserts and receptacle tongues formed using printed circu...
- Patent number 9,992,863
- Issue date Jun 5, 2018
- Apple Inc.
- Mahmoud R. Amini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,949,372
- Issue date Apr 17, 2018
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating touch screen panel
- Patent number 9,904,385
- Issue date Feb 27, 2018
- Samsung Display Co., Ltd.
- Akira Hirai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring board, and electronic device
- Patent number 9,883,589
- Issue date Jan 30, 2018
- Kyocera Corporation
- Kouichi Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards having profiled conductive layer and methods...
- Patent number 9,844,136
- Issue date Dec 12, 2017
- General Electric Company
- Robert Joseph Roessler
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Circuit board
- Publication number 20240298412
- Publication date Sep 5, 2024
- AAC MICROTECH (CHANGZHOU) CO., LTD.
- Guohui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...
- Publication number 20240213429
- Publication date Jun 27, 2024
- Nichia Corporation.
- Akiko NAGAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240206078
- Publication date Jun 20, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Youngkyun Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING BONDED SUBSTRATE, METHOD OF MANUFACTURING C...
- Publication number 20240107678
- Publication date Mar 28, 2024
- NGK Electronics Devices, Inc.
- Kota KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL POWER SUPPLY SYSTEM AND MANUFACTURING METHOD OF CONNECTION...
- Publication number 20230363084
- Publication date Nov 9, 2023
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Hui LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLANAR LIGHTWAVE CIRCUIT STRUCTURE BASED ON PRINTED CIRCUIT BOARD A...
- Publication number 20230240003
- Publication date Jul 27, 2023
- SOOCHOW UNIVERSITY
- MINGDI WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, FABRICATION METHOD OF THE SAME AND ELECTRONI...
- Publication number 20230121285
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Sangwon HA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDING METHOD FOR MICRO-LED
- Publication number 20230116166
- Publication date Apr 13, 2023
- LEDMAN OPTOELECTRONIC CO., LTD.
- Mantie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION BOARD TO CARRY ELECTROMAGNETIC WAVE WITHOUT LEAKAGE AN...
- Publication number 20230025696
- Publication date Jan 26, 2023
- BOARDTEK ELECTRONICS CORPORATION
- CHUNG-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Machining Station and Method for Machining Workpieces
- Publication number 20210360793
- Publication date Nov 18, 2021
- SKYBRAIN VERMOGENSVERWALTUNGS GMBH
- Markus Winterschladen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210289624
- Publication date Sep 16, 2021
- Murata Manufacturing Co., Ltd.
- Yosuke MINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS
- Publication number 20210144853
- Publication date May 13, 2021
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS
- Publication number 20210007224
- Publication date Jan 7, 2021
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES
- Publication number 20200286844
- Publication date Sep 10, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Keith Edward Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20200077521
- Publication date Mar 5, 2020
- Unimicron Technology Corp.
- Ching-Hao HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR PRODUCTION THEREOF
- Publication number 20190223286
- Publication date Jul 18, 2019
- Schweizer Electronic AG
- Hubert Trageser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBRANE CIRCUIT STRUCTURE WITH FUNCTION EXPANDABILITY
- Publication number 20180279470
- Publication date Sep 27, 2018
- Primax Electronics Ltd.
- BO-AN CHEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SOLDER RESIST AND PRINTED WIRING BOARD
- Publication number 20180027664
- Publication date Jan 25, 2018
- IBIDEN CO., LTD.
- Yuji IKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING PACKAGE HAVING A GUIDING MEMBER GUIDING AN OPTICAL M...
- Publication number 20170271569
- Publication date Sep 21, 2017
- LG Innotek Co., Ltd.
- Jun Seok PARK
- F21 - LIGHTING
Information Patent Application
PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...
- Publication number 20170033036
- Publication date Feb 2, 2017
- IBIDEN CO., LTD.
- Kazuki KAJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20160353582
- Publication date Dec 1, 2016
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- WEI-SHUO SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AMINO SULFONIC ACID BASED POLYMERS FOR COPPER ELECTROPLATING
- Publication number 20160186350
- Publication date Jun 30, 2016
- Rohm and Haas Electronic Materials L.L.C.
- Weijing LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED CIRCUIT BOARDS HAVING PROFILED CONDUCTIVE LAYER AND METHODS...
- Publication number 20160157347
- Publication date Jun 2, 2016
- GENERAL ELECTRIC COMPANY
- Robert Joseph Roessler
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF FORMING METALLIC PATTERN ON POLYMER SUBSTRATE
- Publication number 20150376809
- Publication date Dec 31, 2015
- WISTRON NEWEB CORP.
- Babak Radi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150282315
- Publication date Oct 1, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jong Gyu CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATING A CONDUCTIVE TRACE STRUCTURE AND SUBSTRATE HAVING THE S...
- Publication number 20140374141
- Publication date Dec 25, 2014
- Sheng-Hung Yi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140347822
- Publication date Nov 27, 2014
- Murata Manufacturing Co., Ltd.
- Masaaki MIZUSHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20140332259
- Publication date Nov 13, 2014
- Toppan Printing Co., Ltd.
- Tetsuyuki TSUCHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140262442
- Publication date Sep 18, 2014
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Finish Printed Circuit Board
- Publication number 20140231127
- Publication date Aug 21, 2014
- Lutron Electronics Co., Inc.
- David Manero
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

characterised by selective plating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Planar lightwave circuit structure based on printed circuit board a...

Electromagnetic wave transmission board comprising an inner board w...

Machining station and method for machining workpieces

Method of fabricating contact pads for electronic substrates

Panel molded electronic assemblies with integral terminals

Electrical connector and connector system having plated ground shields

Method and device for a high temperature vacuum-safe solder resist...

Producing method of wired circuit board

Microcircuit forming method and etching fluid composition

Contact pads for electronic substrates and related methods

Circuit board

Circuit board and method for production thereof

Wired circuit board and production method thereof

Panel molded electronic assemblies with integral terminals

Multilayer circuit board structure and manufacturing method thereof

Semiconductor device having bonding regions exposed through protect...

Light emitting package having a guiding member guiding an optical m...

Solder resist and printed wiring board

Printed wiring board having support plate and method for manufactur...

Printed wiring board having embedded pads and method for manufactur...

Membrane circuit structure with function expandability

Light emitting package having a guiding member guiding an optical m...

Wiring board and connection structure

Method of fabricating substrate structure and substrate structure f...

Method and device for a high temperature vacuum-safe solder stop ut...

Connector inserts and receptacle tongues formed using printed circu...

Printed wiring board and method for manufacturing the same

Method of fabricating touch screen panel

Wiring board, and electronic device

Printed circuit boards having profiled conductive layer and methods...

Patents Applicationslast 30 patents

Circuit board

CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING BONDED SUBSTRATE, METHOD OF MANUFACTURING C...

VERTICAL POWER SUPPLY SYSTEM AND MANUFACTURING METHOD OF CONNECTION...

PLANAR LIGHTWAVE CIRCUIT STRUCTURE BASED ON PRINTED CIRCUIT BOARD A...

PRINTED CIRCUIT BOARD, FABRICATION METHOD OF THE SAME AND ELECTRONI...

DIE BONDING METHOD FOR MICRO-LED

TRANSMISSION BOARD TO CARRY ELECTROMAGNETIC WAVE WITHOUT LEAKAGE AN...

Machining Station and Method for Machining Workpieces

MODULE AND METHOD OF MANUFACTURING THE SAME

CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS

CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS

SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES

CIRCUIT BOARD

CIRCUIT BOARD AND METHOD FOR PRODUCTION THEREOF

MEMBRANE CIRCUIT STRUCTURE WITH FUNCTION EXPANDABILITY

SOLDER RESIST AND PRINTED WIRING BOARD

LIGHT EMITTING PACKAGE HAVING A GUIDING MEMBER GUIDING AN OPTICAL M...

PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

AMINO SULFONIC ACID BASED POLYMERS FOR COPPER ELECTROPLATING

PRINTED CIRCUIT BOARDS HAVING PROFILED CONDUCTIVE LAYER AND METHODS...

METHOD OF FORMING METALLIC PATTERN ON POLYMER SUBSTRATE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

FABRICATING A CONDUCTIVE TRACE STRUCTURE AND SUBSTRATE HAVING THE S...

MODULE AND METHOD FOR MANUFACTURING THE SAME

WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE

MODULE AND METHOD OF MANUFACTURING THE SAME

Multi-Finish Printed Circuit Board