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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/31characterised by the arrangement or shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame rolling
- Patent number 12,368,054
- Issue date Jul 22, 2025
- Texas Instruments Incorporated
- Amirul Afiq Bin Hud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of semiconductor device assemblies with thermal dissipa...
- Patent number 12,368,085
- Issue date Jul 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including stacked pillar portions and method for...
- Patent number 12,368,123
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method of manufacturing the semiconduct...
- Patent number 12,368,136
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Hyunsu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanosheet transistor
- Patent number 12,369,379
- Issue date Jul 22, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- B82 - NANO-TECHNOLOGY
Information Patent Grant
MEMS resonator integrated cicruit fabrication
- Patent number 12,365,582
- Issue date Jul 22, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package structure with ring structure
- Patent number 12,368,080
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling systems for advanced device packaging and methods...
- Patent number 12,368,087
- Issue date Jul 22, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,368,116
- Issue date Jul 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device bonding apparatus and method of manufacturing a package usin...
- Patent number 12,368,128
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,369,381
- Issue date Jul 22, 2025
- Rohm Co., Ltd.
- Takaaki Yamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 12,368,056
- Issue date Jul 22, 2025
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package comprising conductive layer connected electrode...
- Patent number 12,368,081
- Issue date Jul 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatuses with radio-frequency line elements, and a...
- Patent number 12,368,111
- Issue date Jul 22, 2025
- Infineon Technologies AG
- Walter Hartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,368,120
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including dam patterns and methods for manuf...
- Patent number 12,368,134
- Issue date Jul 22, 2025
- SK hynix Inc.
- Shin Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IPD modules with flexible connection scheme in packaging
- Patent number 12,368,141
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 12,368,148
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages
- Patent number 12,368,149
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,368,084
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High thermal dissipation, packaged electronic device and manufactur...
- Patent number 12,368,126
- Issue date Jul 22, 2025
- STMicroelectronics S.r.l.
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having underfill material surrounding a...
- Patent number 12,368,127
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multi-die semiconductor devices and corresp...
- Patent number 12,368,055
- Issue date Jul 22, 2025
- STMicroelectronics S.r.l.
- Paolo Crema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including passivation...
- Patent number 12,368,090
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting InFO packages to reduce warpage
- Patent number 12,368,115
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode package structure and manufacturing method thereof
- Patent number 12,369,443
- Issue date Jul 22, 2025
- Lextar Electronics Corporation
- Yu-Jing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solvent annealing of an organic planarization layer
- Patent number 12,362,168
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Jing Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with ring structure
- Patent number 12,362,197
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package with integrated peripheral devices and methods
- Patent number 12,362,251
- Issue date Jul 15, 2025
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,362,253
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT
- Publication number 20250239462
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- NAZILA DADVAND
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ULTRA-THIN PACKAGED COMPONENT
- Publication number 20250239499
- Publication date Jul 24, 2025
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING
- Publication number 20250239500
- Publication date Jul 24, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS
- Publication number 20250239505
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Ludovic FALLOURD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES
- Publication number 20250236955
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IMPROVED HEMT DEVICE, IN PARTICULAR DEPLETION MODE DEVICE, AND MANU...
- Publication number 20250240997
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Cristina MICCOLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH REINFORCEMENT STRUCTURES
- Publication number 20250239514
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cong-Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250239516
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Kana ISERI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250239537
- Publication date Jul 24, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...
- Publication number 20250239548
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yung Lin Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250239568
- Publication date Jul 24, 2025
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250239463
- Publication date Jul 24, 2025
- UNITED MICROELECTRONICS CORP.
- Chien-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EDGE STRUCTURE FOR MOLDING COMPOUND FILLING AND THE METHODS OF...
- Publication number 20250239490
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL WIRING OF A SEMICONDUCTOR COMPONENT
- Publication number 20250239489
- Publication date Jul 24, 2025
- Siemens Healthineers AG
- Michael HOSEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY TAPE FOR PACKAGE PROTECTION
- Publication number 20250239497
- Publication date Jul 24, 2025
- Western Digital Technologies, Inc.
- Ankit Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...
- Publication number 20250239528
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250239529
- Publication date Jul 24, 2025
- TDK Corporation
- Reo HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250239536
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250239569
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239571
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Jaejun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE INCLUDING OPTICAL INTEGRATED CIRCUIT CHIP, AND SEMIC...
- Publication number 20250239577
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Juhyeon Oh
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR BODY HAVING A TYPE III-NI...
- Publication number 20250240993
- Publication date Jul 24, 2025
- INFINEON TECHNOLOGIES AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND A METHOD FOR FORMING THE SAME
- Publication number 20250239531
- Publication date Jul 24, 2025
- STATS ChipPAC Pte Ltd.
- TaeWoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING COMPON...
- Publication number 20250239535
- Publication date Jul 24, 2025
- IBIDEN CO., LTD.
- Yuichi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239554
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Wonil Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE
- Publication number 20250239556
- Publication date Jul 24, 2025
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239575
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Seulgi YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239501
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SUBSTRATE WITH INTEGRATED STEP DIE CAVITY, AND RELATED I...
- Publication number 20250239508
- Publication date Jul 24, 2025
- QUALCOMM Incorporated
- Seongryul Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL CONTROLLER PACKAGE AND OPTOELECTRONIC MEMORY MODULE INCLUDI...
- Publication number 20250239576
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- G02 - OPTICS

characterised by the arrangement or shape

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lead frame rolling

Integration of semiconductor device assemblies with thermal dissipa...

Package structure including stacked pillar portions and method for...

Semiconductor package and a method of manufacturing the semiconduct...

Nanosheet transistor

MEMS resonator integrated cicruit fabrication

Chip package structure with ring structure

Embedded cooling systems for advanced device packaging and methods...

Electronic package and manufacturing method thereof

Device bonding apparatus and method of manufacturing a package usin...

Semiconductor device

RF devices with enhanced performance and methods of forming the same

Electronic package comprising conductive layer connected electrode...

Semiconductor apparatuses with radio-frequency line elements, and a...

Semiconductor device and method

Semiconductor packages including dam patterns and methods for manuf...

IPD modules with flexible connection scheme in packaging

Info packages including thermal dissipation blocks

Methods of forming semiconductor packages

Package structure and manufacturing method thereof

High thermal dissipation, packaged electronic device and manufactur...

Semiconductor chip package having underfill material surrounding a...

Method of manufacturing multi-die semiconductor devices and corresp...

Method of manufacturing semiconductor device including passivation...

Supporting InFO packages to reduce warpage

Diode package structure and manufacturing method thereof

Solvent annealing of an organic planarization layer

Semiconductor die package with ring structure

Fan out package with integrated peripheral devices and methods

Semiconductor package and method of fabricating the same

Patents Applicationslast 30 patents

IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT

ULTRA-THIN PACKAGED COMPONENT

LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING

METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS

CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES

IMPROVED HEMT DEVICE, IN PARTICULAR DEPLETION MODE DEVICE, AND MANU...

SEMICONDUCTOR PACKAGES WITH REINFORCEMENT STRUCTURES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

DIE EDGE STRUCTURE FOR MOLDING COMPOUND FILLING AND THE METHODS OF...

VERTICAL WIRING OF A SEMICONDUCTOR COMPONENT

CAVITY TAPE FOR PACKAGE PROTECTION

SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

CHIP STRUCTURE INCLUDING OPTICAL INTEGRATED CIRCUIT CHIP, AND SEMIC...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR BODY HAVING A TYPE III-NI...

ELECTRONIC DEVICE AND A METHOD FOR FORMING THE SAME

COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING COMPON...

SEMICONDUCTOR PACKAGE

PACKAGE DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

INTERPOSER SUBSTRATE WITH INTEGRATED STEP DIE CAVITY, AND RELATED I...

OPTICAL CONTROLLER PACKAGE AND OPTOELECTRONIC MEMORY MODULE INCLUDI...