characterised by the composition of the lapping agent

Industry

CPC
B24B37/044

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/044characterised by the composition of the lapping agent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of reducing semiconductor substrate surface unevenness
- Patent number 11,901,186
- Issue date Feb 13, 2024
- Massachusetts Institute of Technology
- Li Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for polishing silicon substrate and polishing composition set
- Patent number 11,897,081
- Issue date Feb 13, 2024
- FUJIMI INCORPORATED
- Shinichiro Takami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of polishing silicon wafer
- Patent number 11,890,719
- Issue date Feb 6, 2024
- Sumco Corporation
- Shuhei Matsuda
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for polishing dielectric layer in forming semiconductor device
- Patent number 11,862,472
- Issue date Jan 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xiaohong Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hard abrasive particle-free polishing of hard materials
- Patent number 11,820,918
- Issue date Nov 21, 2023
- Entegris, Inc.
- Rajiv K. Singh
- B24 - GRINDING POLISHING
Information Patent Grant
Ruthenium CMP chemistry based on halogenation
- Patent number 11,820,919
- Issue date Nov 21, 2023
- Tokyo Electron Limited
- Paul Abel
- B24 - GRINDING POLISHING
Information Patent Grant
Calcium carbonate slurry
- Patent number 11,806,836
- Issue date Nov 7, 2023
- Illumina, Inc.
- Robert Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing liquid composition for silicon oxide film
- Patent number 11,795,346
- Issue date Oct 24, 2023
- Kao Corporation
- Yohei Uchida
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing composition and polishing method
- Patent number 11,781,039
- Issue date Oct 10, 2023
- FUJIMI INCORPORATED
- Tomoaki Ishibashi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing liquid, polishing liquid set, and polishing method
- Patent number 11,767,448
- Issue date Sep 26, 2023
- Resonac Corporation
- Takaaki Matsumoto
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing compositions and methods of use thereof
- Patent number 11,732,157
- Issue date Aug 22, 2023
- Fujifilm Electronic Materials U.S.A., Inc.
- Yannan Liang
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical planarization composition for polishing oxide m...
- Patent number 11,718,767
- Issue date Aug 8, 2023
- VERSUM MATERIALS US, LLC
- Ming-Shih Tsai
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing agent, polishing method, and liquid additive for polishing
- Patent number 11,713,404
- Issue date Aug 1, 2023
- AGC Inc.
- Toshihiko Otsuki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad for chemical mechanical planarization
- Patent number 11,685,013
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Hung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing compositions and methods of using same
- Patent number 11,680,186
- Issue date Jun 20, 2023
- Fujifilm Electronic Materials U.S.A., Inc.
- Eric Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing polishing particles and method for polishi...
- Patent number 11,661,539
- Issue date May 30, 2023
- Shin-Etsu Chemical Co., Ltd.
- Mitsuhito Takahashi
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Polishing solution and polishing method
- Patent number 11,655,394
- Issue date May 23, 2023
- Resonac Corporation
- Yuya Otsuka
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing jig assembly for a new or refurbished electrostatic chuck
- Patent number 11,648,639
- Issue date May 16, 2023
- Applied Materials, Inc.
- William Ming-ye Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Neutral to alkaline chemical mechanical polishing compositions and...
- Patent number 11,591,495
- Issue date Feb 28, 2023
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Yi Guo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Polishing liquid, polishing liquid set, and polishing method
- Patent number 11,572,490
- Issue date Feb 7, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Tomohiro Iwano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing pad and method for producing the same, and method for pro...
- Patent number 11,565,366
- Issue date Jan 31, 2023
- Fujibo Holdings, Inc.
- Shin Tokushige
- B24 - GRINDING POLISHING
Information Patent Grant
Modified colloidal silica and method for producing the same, and po...
- Patent number 11,530,335
- Issue date Dec 20, 2022
- FUJIMI INCORPORATED
- Keiji Ashitaka
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Polishing composition based on mixture of colloidal silica particles
- Patent number 11,525,071
- Issue date Dec 13, 2022
- FUJIMI INCORPORATED
- Jie Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing composition, manufacturing method of polishing compositio...
- Patent number 11,518,911
- Issue date Dec 6, 2022
- FUJIMI INCORPORATED
- Yukinobu Yoshizaki
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for chemical mechanical polishing and forming interconnect...
- Patent number 11,508,585
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ji Cui
- B24 - GRINDING POLISHING
Information Patent Grant
Barrier ruthenium chemical mechanical polishing slurry
- Patent number 11,505,718
- Issue date Nov 22, 2022
- FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
- David (Tawei) Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Modified colloidal silica and method for producing the same, and po...
- Patent number 11,499,070
- Issue date Nov 15, 2022
- FUJIMI INCORPORATED
- Keiji Ashitaka
- B24 - GRINDING POLISHING
Information Patent Grant
Derivatized polyamino acids
- Patent number 11,492,514
- Issue date Nov 8, 2022
- CMC Materials, Inc.
- Na Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Tools for polishing and refinishing concrete and methods for using...
- Patent number 11,471,998
- Issue date Oct 18, 2022
- Mark Wetherell
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Methods for polishing dielectric layer in forming semiconductor device
- Patent number 11,462,415
- Issue date Oct 4, 2022
- Yangtze Memory Technologies Co., Ltd.
- Xiaohong Zhou
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME
- Publication number 20240124744
- Publication date Apr 18, 2024
- Hooi-Sung KIM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING COMPOSITION
- Publication number 20240117219
- Publication date Apr 11, 2024
- Fujimi Incorporated
- Yasuaki ITO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20240091900
- Publication date Mar 21, 2024
- Disco Corporation
- Shun NAKAGAWA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
- Publication number 20240087963
- Publication date Mar 14, 2024
- EBARA CORPORATION
- Akira FUKUNAGA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING COMPOSITION AND METHOD OF POLISHING SILICON WAFER
- Publication number 20240052202
- Publication date Feb 15, 2024
- NITTA DuPont Incorporated
- Noriaki SUGITA
- B24 - GRINDING POLISHING
Information Patent Application
ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM
- Publication number 20240050995
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wen Liu
- B08 - CLEANING
Information Patent Application
Ruthenium CMP Chemistry Based On Halogenation
- Publication number 20240043721
- Publication date Feb 8, 2024
- TOKYO ELECTRON LIMITED
- Paul Abel
- B24 - GRINDING POLISHING
Information Patent Application
METHODS FOR REMOVING DEPOSITS ON THE SURFACE OF A CHAMBER COMPONENT
- Publication number 20240017299
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Tuochuan Huang
- B08 - CLEANING
Information Patent Application
FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Publication number 20230390887
- Publication date Dec 7, 2023
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS WITH INTEGRATED SLURRY MIXE...
- Publication number 20230373062
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chen Wei
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING AND CLEANING METHOD, CLEANER AND POLISHING CLEANING SET
- Publication number 20230364732
- Publication date Nov 16, 2023
- Fujimi Incorporated
- SACHIKO HIRAKO
- B08 - CLEANING
Information Patent Application
SLURRY, POLISHING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR CO...
- Publication number 20230357600
- Publication date Nov 9, 2023
- Satoshi FURUKAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING COMPOSTION FOR SEMICONDUCTOR PROCESS, MANUFACTURING METHO...
- Publication number 20230332014
- Publication date Oct 19, 2023
- SK enpulse Co., Ltd.
- Han Teo PARK
- B24 - GRINDING POLISHING
Information Patent Application
DUAL ADDITIVE POLISHING COMPOSITION FOR GLASS SUBSTRATES
- Publication number 20230323158
- Publication date Oct 12, 2023
- CMC Materials, Inc.
- Tong LI
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PRODUCING INORGANIC PARTICLE-CONTAINING SLURRY AND ZIRCO...
- Publication number 20230312981
- Publication date Oct 5, 2023
- FUJIMI INCORPORATED
- Ryota MAE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20230294241
- Publication date Sep 21, 2023
- EBARA CORPORATION
- Ban ITO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING COMPOSITION, POLISHING METHOD, AND METHOD OF MANUFACTURIN...
- Publication number 20230287243
- Publication date Sep 14, 2023
- FUJIMI INCORPORATED
- Masaki TADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Polishing Compositions and Methods of Using Same
- Publication number 20230265313
- Publication date Aug 24, 2023
- Fujifilm Electronic Materials U.S.A., Inc.
- Eric Turner
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LARGE AREA QUARTZ CRYSTAL WAFER LAPPING DEVICE AND A LAPPING METHOD...
- Publication number 20230249312
- Publication date Aug 10, 2023
- TANGSHAN GUOXIN JINGYUAN ELECTRONICS CO., LTD.
- Jianmin XU
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD AND POLISHING COMPOSITION SET
- Publication number 20230235194
- Publication date Jul 27, 2023
- Fujimi Incorporated
- Shinichiro TAKAMI
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY COMPOSITIONS FOR POLISHING METAL LAYERS, CHEMICAL MECHANICAL...
- Publication number 20230193080
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- YEA RIN BYUN
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD USING THE SAME
- Publication number 20230191555
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- Chaelyoung Kim
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR POLISHING WAFER
- Publication number 20230137813
- Publication date May 4, 2023
- Shin-Etsu Handotai Co., Ltd.
- Masaaki OSEKI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING LIQUID AND POLISHING METHOD
- Publication number 20230128096
- Publication date Apr 27, 2023
- Showa Denko Materials Co., Ltd.
- Daisuke IIKURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CMP PROCESS APPLIED TO A THIN SIC WAFER FOR STRESS RELEASE AND DAMA...
- Publication number 20230128739
- Publication date Apr 27, 2023
- STMicroelectronics S.r.l.
- Agata GRASSO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLS FOR CHEMICAL PLANARIZATION
- Publication number 20230077988
- Publication date Mar 16, 2023
- CHEMPOWER CORPORATION
- Sudhanshu Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT...
- Publication number 20230082084
- Publication date Mar 16, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JI CUI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING COMPOSITION AND METHOD FOR PRODUCING SAME
- Publication number 20230073290
- Publication date Mar 9, 2023
- FUJIMI INCORPORATED
- Kohsuke TSUCHIYA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
High Oxide Film Removal Rate Shallow Trench (STI) Chemical Mechanic...
- Publication number 20230020073
- Publication date Jan 19, 2023
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- B24 - GRINDING POLISHING
Information Patent Application
METHODS FOR POLISHING DIELECTRIC LAYER IN FORMING SEMICONDUCTOR DEVICE
- Publication number 20220406612
- Publication date Dec 22, 2022
- Yangtze Memory Technologies Co., Ltd.
- Xiaohong Zhou
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the composition of the lapping agent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of reducing semiconductor substrate surface unevenness

Method for polishing silicon substrate and polishing composition set

Method of polishing silicon wafer

Methods for polishing dielectric layer in forming semiconductor device

Hard abrasive particle-free polishing of hard materials

Ruthenium CMP chemistry based on halogenation

Calcium carbonate slurry

Polishing liquid composition for silicon oxide film

Polishing composition and polishing method

Polishing liquid, polishing liquid set, and polishing method

Polishing compositions and methods of use thereof

Chemical mechanical planarization composition for polishing oxide m...

Polishing agent, polishing method, and liquid additive for polishing

Polishing pad for chemical mechanical planarization

Polishing compositions and methods of using same

Method for manufacturing polishing particles and method for polishi...

Polishing solution and polishing method

Polishing jig assembly for a new or refurbished electrostatic chuck

Neutral to alkaline chemical mechanical polishing compositions and...

Polishing liquid, polishing liquid set, and polishing method

Polishing pad and method for producing the same, and method for pro...

Modified colloidal silica and method for producing the same, and po...

Polishing composition based on mixture of colloidal silica particles

Polishing composition, manufacturing method of polishing compositio...

Methods for chemical mechanical polishing and forming interconnect...

Barrier ruthenium chemical mechanical polishing slurry

Modified colloidal silica and method for producing the same, and po...

Derivatized polyamino acids

Tools for polishing and refinishing concrete and methods for using...

Methods for polishing dielectric layer in forming semiconductor device

Patents Applicationslast 30 patents

POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME

POLISHING COMPOSITION

POLISHING APPARATUS AND POLISHING METHOD

SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD

POLISHING COMPOSITION AND METHOD OF POLISHING SILICON WAFER

ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM

Ruthenium CMP Chemistry Based On Halogenation

METHODS FOR REMOVING DEPOSITS ON THE SURFACE OF A CHAMBER COMPONENT

FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS

CHEMICAL MECHANICAL POLISHING APPARATUS WITH INTEGRATED SLURRY MIXE...

POLISHING AND CLEANING METHOD, CLEANER AND POLISHING CLEANING SET

SLURRY, POLISHING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR CO...

POLISHING COMPOSTION FOR SEMICONDUCTOR PROCESS, MANUFACTURING METHO...

DUAL ADDITIVE POLISHING COMPOSITION FOR GLASS SUBSTRATES

METHOD FOR PRODUCING INORGANIC PARTICLE-CONTAINING SLURRY AND ZIRCO...

POLISHING METHOD AND POLISHING APPARATUS

POLISHING COMPOSITION, POLISHING METHOD, AND METHOD OF MANUFACTURIN...

Polishing Compositions and Methods of Using Same

LARGE AREA QUARTZ CRYSTAL WAFER LAPPING DEVICE AND A LAPPING METHOD...

POLISHING METHOD AND POLISHING COMPOSITION SET

SLURRY COMPOSITIONS FOR POLISHING METAL LAYERS, CHEMICAL MECHANICAL...

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD USING THE SAME

METHOD AND APPARATUS FOR POLISHING WAFER

POLISHING LIQUID AND POLISHING METHOD

CMP PROCESS APPLIED TO A THIN SIC WAFER FOR STRESS RELEASE AND DAMA...

TOOLS FOR CHEMICAL PLANARIZATION

METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT...

POLISHING COMPOSITION AND METHOD FOR PRODUCING SAME

High Oxide Film Removal Rate Shallow Trench (STI) Chemical Mechanic...

METHODS FOR POLISHING DIELECTRIC LAYER IN FORMING SEMICONDUCTOR DEVICE