characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Industry

CPC
H05K7/2039

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/2039characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Industries

Patents Grantslast 30 patents

Information Patent Grant
System and method for using waste heat generated by digital process...
- Patent number 11,974,412
- Issue date Apr 30, 2024
- HUNT ENERGY, L.L.C.
- Todd W. Benson
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Heatsink having air partitioning baffle
- Patent number 11,968,805
- Issue date Apr 23, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Stefan Skoglund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vehicular vision system with forward viewing camera module
- Patent number 11,964,617
- Issue date Apr 23, 2024
- Magna Electronics Inc.
- Garret F. Achenbach
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Heat sink, heat sink arrangement and module for liquid immersion co...
- Patent number 11,968,802
- Issue date Apr 23, 2024
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural midframe for an electronic device having a camera and a...
- Patent number 11,968,795
- Issue date Apr 23, 2024
- Google LLC
- Laurie Man Sum Kwan
- G08 - SIGNALLING
Information Patent Grant
Electronic apparatus and cooling module
- Patent number 11,968,806
- Issue date Apr 23, 2024
- Lenovo (Singapore) Pte. Ltd.
- Masahiro Kitamura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Liquid-cooling block and liquid-cooling block assembly and liquid-c...
- Patent number 11,963,330
- Issue date Apr 16, 2024
- DONGGUAN HANXU HARDWARE PLASTIC TECHNOLOGY CO., LTD.
- Tsung-Hsien Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink with a sandwich plate construction
- Patent number 11,963,335
- Issue date Apr 16, 2024
- Intel Corporation
- Juha Tapani Paavola
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Unified fan-less radiator for datacenter cooling systems
- Patent number 11,963,339
- Issue date Apr 16, 2024
- NVIDIA Corporation
- Ali Heydari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for heat dissipation and use of such apparatus
- Patent number 11,957,303
- Issue date Apr 16, 2024
- Karl Storz SE & Co. KG
- Andreas Heni
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal module for a circuit board
- Patent number 11,963,288
- Issue date Apr 16, 2024
- Apple Inc.
- Trevor J. Edmonds
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power allocation to heat a processing chip of a network device
- Patent number 11,960,268
- Issue date Apr 16, 2024
- Hewlett Packard Enterprise Development LP
- Khai Chiah Chng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic apparatus, cooling device, and method for manufacturing...
- Patent number 11,963,333
- Issue date Apr 16, 2024
- Lenovo (Singapore) Pte. Ltd.
- Masahiro Kitamura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Quantum processing circuitry cooling systems and methods
- Patent number 11,956,924
- Issue date Apr 9, 2024
- Montana Instruments Corporation
- Josh Doherty
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Outdoor unit
- Patent number 11,956,926
- Issue date Apr 9, 2024
- Mitsubishi Electric Corporation
- Kenji Iwazaki
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Electric component and refrigeration apparatus
- Patent number 11,946,657
- Issue date Apr 2, 2024
- Daikin Industries, Ltd.
- Yuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical junction box
- Patent number 11,949,219
- Issue date Apr 2, 2024
- Autonetworks Technologies, Ltd.
- Yusuke Okuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual camera prism assembly for stencil printer
- Patent number 11,947,094
- Issue date Apr 2, 2024
- Illinois Tool Works Inc.
- Thomas C. Prentice
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Control device for robot with blower device at opening
- Patent number 11,943,894
- Issue date Mar 26, 2024
- Kawasaki Jukogyo Kabushiki Kaisha
- Noriaki Fujisawa
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Electronic device
- Patent number 11,943,898
- Issue date Mar 26, 2024
- Sony Interactive Entertainment Inc.
- Nobuyuki Sugawara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink module with through-hole
- Patent number 11,940,222
- Issue date Mar 26, 2024
- Sumitomo Precision Products Co., Ltd.
- Shota Hanafusa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic device for ensuring electronic part cooling performance...
- Patent number 11,937,397
- Issue date Mar 19, 2024
- NEC Platforms, Ltd.
- Kenji Okumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imaging device with cooling mechanism
- Patent number 11,936,966
- Issue date Mar 19, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiko Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation device having anisotropic thermally conductive sec...
- Patent number 11,933,555
- Issue date Mar 19, 2024
- Intel Corporation
- Feras Eid
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Progressive heatsink
- Patent number 11,937,403
- Issue date Mar 19, 2024
- Lumentum Operations LLC
- Roozbeh Ahmadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board structure, electronic apparatus, and method of manufacturing...
- Patent number 11,930,623
- Issue date Mar 12, 2024
- FUJIFILM Business Innovation Corp.
- Takanobu Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inverter and heat radiation structure thereof
- Patent number 11,930,626
- Issue date Mar 12, 2024
- SUNGROW POWER SUPPLY CO., LTD.
- Renbin Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Folding thermal ground plane
- Patent number 11,930,621
- Issue date Mar 12, 2024
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan J. Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for implementing an access point supporting m...
- Patent number 11,929,545
- Issue date Mar 12, 2024
- Juniper Networks, Inc.
- Joshua Rosenthal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooling head and liquid cooling device with the same
- Patent number 11,930,618
- Issue date Mar 12, 2024
- AURAS TECHNOLOGY CO., LTD.
- Chien-Yu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION STRUCTURE HAVING POROUS S...
- Publication number 20240147662
- Publication date May 2, 2024
- Amulaire thermal technology, INC.
- CHING-MING YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR AN UNEVEN THICKNESS HEAT SPREADER
- Publication number 20240147669
- Publication date May 2, 2024
- DELL PRODUCTS, L.P.
- Qinghong He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPUTER HOUSING
- Publication number 20240143043
- Publication date May 2, 2024
- Apple Inc.
- Eugene A. Whang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SINK AND HEAT DISSIPATION DEVICE
- Publication number 20240147670
- Publication date May 2, 2024
- Cooler Master Co., Ltd.
- Yan-Sian JHENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL VAPOR CHAMBER DEVICE AND THE METHOD FOR MANUFACTU...
- Publication number 20240147666
- Publication date May 2, 2024
- GUANGZHOU NEOGENE THERMAL MANAGEMENT TECHNOLOGY CO., LTD.
- JEN-SHYAN CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT DISSIPATION DESIGN FOR OPTICAL TRANSCEIVER
- Publication number 20240138050
- Publication date Apr 25, 2024
- Prime World International Holdings Ltd.
- Ling-An KUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WATER BLOCK WITH AIR-COOLING MODULE AND MULTI-LAYER HEAT-CONDUCTING...
- Publication number 20240138110
- Publication date Apr 25, 2024
- Huizhou Xunshuo Technology Co., Ltd
- Yanzhun LIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...
- Publication number 20240136252
- Publication date Apr 25, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
POINT OF LOAD MODULE AND HEATSINK THEREFOR
- Publication number 20240138051
- Publication date Apr 25, 2024
- AcLeap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Conversion Apparatus
- Publication number 20240136936
- Publication date Apr 25, 2024
- Hitachi Astemo, Ltd.
- Akira MIMA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD AND APPARATUS FOR AN AUTOMATIC BATTERY HEAT SINKING OPERATIO...
- Publication number 20240138099
- Publication date Apr 25, 2024
- DELL PRODUCTS, L.P.
- Qinghong He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COVER FOR SEALING A POWER MODULE
- Publication number 20240130064
- Publication date Apr 18, 2024
- Lunar Energy, Inc.
- Kevin Richard Fine
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
HEAT-CONDUCTIVE SHEET, HEAT-CONDUCTIVE SHEET PRODUCTION METHOD, AND...
- Publication number 20240124758
- Publication date Apr 18, 2024
- DEXERIALS CORPORATION
- Marina TOBATA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
VEHICLE WATER-COOLING HEAT SINK PLATE HAVING FIN SETS WITH DIFFEREN...
- Publication number 20240121913
- Publication date Apr 11, 2024
- Amulaire thermal technology, INC.
- CHUN-LI HSIUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT RADIATION STRUCTURE, ELECTRONIC DEVICE, AND HEAT TRANSFER STRU...
- Publication number 20240121916
- Publication date Apr 11, 2024
- LENOVO (SINGAPORE) PTE. LTD.
- Masahiro Kitamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND...
- Publication number 20240121881
- Publication date Apr 11, 2024
- Huawei Technologies Co., Ltd
- Wei CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING DEVICE
- Publication number 20240121915
- Publication date Apr 11, 2024
- ERWIN QUARDER SYSTEMTECHNIK GMBH
- Georg Siewert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL SCHEME FOR REGULATING THERMOELECTRIC COOLING DEVICE POWER F...
- Publication number 20240111344
- Publication date Apr 4, 2024
- ADVANCED MICRO DEVICES, INC.
- MICHAEL J. AUSTIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
UNIFIED SOLID-STATE DRIVE ENCLOSURE DESIGN
- Publication number 20240114660
- Publication date Apr 4, 2024
- Micron Technology, Inc.
- Suresh Reddy Yarragunta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING HEAT EMISSION STRUCTURE
- Publication number 20240114662
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Youngwook KIM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT SINK FOR COMPUTE BLADE NETWORK CARD
- Publication number 20240114666
- Publication date Apr 4, 2024
- BULL SAS
- Pierre LAMY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-PLANAR ANTENNAS FOR PORTABLE STORAGE DEVICES
- Publication number 20240114659
- Publication date Apr 4, 2024
- Western Digital Technologies, Inc.
- Aadesh Gupta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL CONDUCTIVE MEMBER, ELECTRONIC DEVICE, METHOD OF MANUFACTURI...
- Publication number 20240114661
- Publication date Apr 4, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Youji SHIRATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING DEVICE
- Publication number 20240114268
- Publication date Apr 4, 2024
- Hitron Technologies Inc.
- Hui-Liang Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COMPONENT COOLER WITH MULTIPLE HEAT TRANSFER PATHS
- Publication number 20240114657
- Publication date Apr 4, 2024
- ADVANCED MICRO DEVICES, INC.
- CHRISTOPHER M. HELBERG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
UNIVERSAL RUGGEDIZED COMPUTER SYSTEM ENCLOSURE
- Publication number 20240114653
- Publication date Apr 4, 2024
- United States of America as Represented by The Secretary of The Army
- Joshua D. Wattier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240107711
- Publication date Mar 28, 2024
- NIDEC CORPORATION
- Takeru INAYOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICLE SAFETY DEVICE
- Publication number 20240103346
- Publication date Mar 28, 2024
- Cambridge Mobile Telematics Inc.
- Melinda Liggett
- B60 - VEHICLES IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR ELECTRONICS COOLING
- Publication number 20240107710
- Publication date Mar 28, 2024
- Eagle Technology, LLC
- Donald S. George
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL TRANSCEIVER INCLUDING HEAT DISSIPATION COMPONENTS THERMALLY...
- Publication number 20240107655
- Publication date Mar 28, 2024
- Prime World International Holdings Ltd.
- Ling-An KUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

System and method for using waste heat generated by digital process...

Heatsink having air partitioning baffle

Vehicular vision system with forward viewing camera module

Heat sink, heat sink arrangement and module for liquid immersion co...

Structural midframe for an electronic device having a camera and a...

Electronic apparatus and cooling module

Liquid-cooling block and liquid-cooling block assembly and liquid-c...

Heatsink with a sandwich plate construction

Unified fan-less radiator for datacenter cooling systems

Apparatus for heat dissipation and use of such apparatus

Thermal module for a circuit board

Power allocation to heat a processing chip of a network device

Electronic apparatus, cooling device, and method for manufacturing...

Quantum processing circuitry cooling systems and methods

Outdoor unit

Electric component and refrigeration apparatus

Electrical junction box

Dual camera prism assembly for stencil printer

Control device for robot with blower device at opening

Electronic device

Heat sink module with through-hole

Electronic device for ensuring electronic part cooling performance...

Imaging device with cooling mechanism

Heat dissipation device having anisotropic thermally conductive sec...

Progressive heatsink

Board structure, electronic apparatus, and method of manufacturing...

Inverter and heat radiation structure thereof

Folding thermal ground plane

Methods and apparatus for implementing an access point supporting m...

Liquid cooling head and liquid cooling device with the same

Patents Applicationslast 30 patents

TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION STRUCTURE HAVING POROUS S...

METHOD AND APPARATUS FOR AN UNEVEN THICKNESS HEAT SPREADER

COMPUTER HOUSING

HEAT SINK AND HEAT DISSIPATION DEVICE

THREE-DIMENSIONAL VAPOR CHAMBER DEVICE AND THE METHOD FOR MANUFACTU...

HEAT DISSIPATION DESIGN FOR OPTICAL TRANSCEIVER

WATER BLOCK WITH AIR-COOLING MODULE AND MULTI-LAYER HEAT-CONDUCTING...

PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...

POINT OF LOAD MODULE AND HEATSINK THEREFOR

Power Conversion Apparatus

METHOD AND APPARATUS FOR AN AUTOMATIC BATTERY HEAT SINKING OPERATIO...

COVER FOR SEALING A POWER MODULE

HEAT-CONDUCTIVE SHEET, HEAT-CONDUCTIVE SHEET PRODUCTION METHOD, AND...

VEHICLE WATER-COOLING HEAT SINK PLATE HAVING FIN SETS WITH DIFFEREN...

HEAT RADIATION STRUCTURE, ELECTRONIC DEVICE, AND HEAT TRANSFER STRU...

HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND...

COOLING DEVICE

CONTROL SCHEME FOR REGULATING THERMOELECTRIC COOLING DEVICE POWER F...

UNIFIED SOLID-STATE DRIVE ENCLOSURE DESIGN

ELECTRONIC DEVICE COMPRISING HEAT EMISSION STRUCTURE

HEAT SINK FOR COMPUTE BLADE NETWORK CARD

NON-PLANAR ANTENNAS FOR PORTABLE STORAGE DEVICES

THERMAL CONDUCTIVE MEMBER, ELECTRONIC DEVICE, METHOD OF MANUFACTURI...

HEAT DISSIPATING DEVICE

COMPONENT COOLER WITH MULTIPLE HEAT TRANSFER PATHS

UNIVERSAL RUGGEDIZED COMPUTER SYSTEM ENCLOSURE

ELECTRONIC DEVICE

VEHICLE SAFETY DEVICE

SYSTEMS AND METHODS FOR ELECTRONICS COOLING

OPTICAL TRANSCEIVER INCLUDING HEAT DISSIPATION COMPONENTS THERMALLY...