characterised by the insulating layers or materials

Industry

CPC
H05K3/4626

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4626characterised by the insulating layers or materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Component-containing substrate
- Patent number 12,200,871
- Issue date Jan 14, 2025
- Shinko Electric Industries Co., Ltd.
- Takao Koshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 12,133,339
- Issue date Oct 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-flex component carrier with dielectric material surrounding an...
- Patent number 12,127,338
- Issue date Oct 22, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,120,817
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer board and manufacturing method thereof
- Patent number 12,058,811
- Issue date Aug 6, 2024
- AZOTEK CO., LTD.
- Hung-Jung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive film for multilayer printed-wiring board
- Patent number 11,930,594
- Issue date Mar 12, 2024
- Resonac Corporation
- Aya Kasahara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Planar coil element and method for producing planar coil element
- Patent number 11,785,724
- Issue date Oct 10, 2023
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Hiroshi Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for measuring eccentricity of blind via hole f...
- Patent number 11,769,270
- Issue date Sep 26, 2023
- SMART RADAR SYSTEM, INC.
- Jae Yong Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual conductor laminated substrate
- Patent number 11,744,023
- Issue date Aug 29, 2023
- Gentherm GmbH
- Timothy Hughes
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Multilayer printed wiring board and method of manufacturing the same
- Patent number 11,690,178
- Issue date Jun 27, 2023
- Toppan Printing Co., Ltd.
- Hiroshi Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a three-dimensional liquid crystal polymer multil...
- Patent number 11,657,989
- Issue date May 23, 2023
- Harris Corporation
- Louis Joseph Rendek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 11,553,601
- Issue date Jan 10, 2023
- Ibiden Co., Ltd.
- Kazuyuki Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board insulating sheet, multilayer board, and method of...
- Patent number 11,546,989
- Issue date Jan 3, 2023
- TDK Corporation
- Seiko Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,382,218
- Issue date Jul 5, 2022
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 11,370,857
- Issue date Jun 28, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and system for providing dynamic personalized recommendation...
- Patent number 11,354,372
- Issue date Jun 7, 2022
- Google LLC
- Jignashu Parikh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and processes for forming electrical circuitries on three-d...
- Patent number 11,304,303
- Issue date Apr 12, 2022
- DUJUD LLC
- Reza Abbaspour
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Multi-layered circuit board
- Patent number 11,297,722
- Issue date Apr 5, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Zhi Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer laminate and method for producing multilayer printed wir...
- Patent number 11,285,700
- Issue date Mar 29, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate, multilayer substrate array, and transmission/...
- Patent number 11,178,750
- Issue date Nov 16, 2021
- Fujikura Ltd.
- Hideyuki Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual conductor laminated substrate
- Patent number 11,134,575
- Issue date Sep 28, 2021
- Gentherm GmbH
- Timothy Hughes
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Printed wiring board, printed circuit board, prepreg
- Patent number 11,114,354
- Issue date Sep 7, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Akira Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered fabrication processing
- Patent number 11,089,676
- Issue date Aug 10, 2021
- The Charles Stark Draper Laboratory, Inc.
- John R. Burns
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Planar coil element and method for producing planar coil element
- Patent number 11,083,092
- Issue date Aug 3, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Hiroshi Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-clad laminate, circuit board, and multilayer circuit board
- Patent number 10,959,330
- Issue date Mar 23, 2021
- Murata Manufacturing Co., Ltd.
- Kazuhiko Ohashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multilayer board and manufacturing method of the same
- Patent number 10,939,562
- Issue date Mar 2, 2021
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered circuit board and method for manufacturing the same
- Patent number 10,881,008
- Issue date Dec 29, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Zhi Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a three-dimensional liquid crystal polymer multil...
- Patent number 10,818,448
- Issue date Oct 27, 2020
- Harris Corporation
- Louis Joseph Rendek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, electronic device, and method for mounting el...
- Patent number 10,772,216
- Issue date Sep 8, 2020
- Murata Manufacturing Co., Ltd.
- Shingo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate for electronic component inspection apparatus
- Patent number 10,674,614
- Issue date Jun 2, 2020
- NGK Spark Plug Co., Ltd.
- Takakuni Nasu
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
LAMINATED STRUCTURE, AND METHOD FOR MANUFACTURING LAMINATED STRUCTURE
- Publication number 20250031319
- Publication date Jan 23, 2025
- Panasonic Holdings Corporation
- HIROKI KITAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...
- Publication number 20240393686
- Publication date Nov 28, 2024
- Resonac Corporation
- Hideyuki KATAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240324100
- Publication date Sep 26, 2024
- AZOTEK CO., LTD.
- Hung-Jung LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRING BOARD UNIT AND METHOD FOR DESIGNING THE SAME
- Publication number 20240224421
- Publication date Jul 4, 2024
- TOPPAN Holdings Inc.
- Ryoma TANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SHEET AND RESIN MULTILAYER SUBSTRATE
- Publication number 20240206060
- Publication date Jun 20, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke TAKADA
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH HYBRID CORE STRUCTURE AND METH...
- Publication number 20240079303
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240032208
- Publication date Jan 25, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED WIRING BOARD
- Publication number 20230413452
- Publication date Dec 21, 2023
- Shinko Electric Industries Co., Ltd.
- Shota MIKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE ASSEMBLY, OPTICAL MODULE, PACKAGE FOR OPTICAL MODULE...
- Publication number 20230380056
- Publication date Nov 23, 2023
- Sumitomo Electric Industries, Ltd.
- Taichi MISAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL CONNECTION BETWEEN PRINTED CIRCUIT BOARD AND BASE PLATE WIT...
- Publication number 20230352861
- Publication date Nov 2, 2023
- Vitesco Technologies USA, LLC
- Uwe Stephan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20230309219
- Publication date Sep 28, 2023
- AZOTEK CO., LTD.
- Hung-Jung LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPONENT-CONTAINING SUBSTRATE
- Publication number 20230300990
- Publication date Sep 21, 2023
- Shinko Electric Industries Co., Ltd.
- Takao KOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR MEASURING ECCENTRICITY OF BLIND VIA HOLE F...
- Publication number 20230252665
- Publication date Aug 10, 2023
- SMART RADAR SYSTEM, INC.
- Jae Yong LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...
- Publication number 20230238197
- Publication date Jul 27, 2023
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semi-Flex Component Carrier With Dielectric Material Surrounding an...
- Publication number 20220256686
- Publication date Aug 11, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING RESIN MULTI...
- Publication number 20220151066
- Publication date May 12, 2022
- Murata Manufacturing Co., Ltd.
- Ryosuke TAKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...
- Publication number 20220071025
- Publication date Mar 3, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Yune KUMAZAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PLANAR COIL ELEMENT AND METHOD FOR PRODUCING PLANAR COIL ELEMENT
- Publication number 20210329795
- Publication date Oct 21, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Hiroshi UEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...
- Publication number 20210206892
- Publication date Jul 8, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Yune KUMAZAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DUAL CONDUCTOR LAMINATED SUBSTRATE
- Publication number 20210136930
- Publication date May 6, 2021
- Gentherm Inc.
- Timothy HUGHES
- B60 - VEHICLES IN GENERAL
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210136929
- Publication date May 6, 2021
- IBIDEN CO., LTD.
- Kazuyuki UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED CIRCUIT BOARD
- Publication number 20210136926
- Publication date May 6, 2021
- Avary Holding (Shenzhen) Co., Limited.
- ZHI GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual Conductor Laminated Substrate
- Publication number 20210100109
- Publication date Apr 1, 2021
- Gentherm Inc.
- Timothy HUGHES
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...
- Publication number 20210005405
- Publication date Jan 7, 2021
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200337156
- Publication date Oct 22, 2020
- Toppan Printing Co., Ltd.
- Hiroshi MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER BOARD AND MANUFACTURING METHOD OF THE SAME
- Publication number 20200315032
- Publication date Oct 1, 2020
- Taiyo Yuden Co., Ltd.
- Yuichi SUGIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER BOARD INSULATING SHEET, MULTILAYER BOARD, AND METHOD OF...
- Publication number 20200315008
- Publication date Oct 1, 2020
- TDK Corporation
- Seiko KOMATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE, MULTILAYER SUBSTRATE ARRAY, AND TRANSMISSION/...
- Publication number 20200128661
- Publication date Apr 23, 2020
- FUJIKURA LTD.
- Hideyuki WADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR PROVIDING DYNAMIC PERSONALIZED RECOMMENDATION...
- Publication number 20200095398
- Publication date Mar 26, 2020
- Google LLC
- Jignashu PARIKH
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTI-LAYERED STRUCTURE AND SUBSTRATE
- Publication number 20190390061
- Publication date Dec 26, 2019
- ITEQ Corporation
- Chen-Hsi CHENG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

characterised by the insulating layers or materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Component-containing substrate

Resin composition, resin sheet, multilayer printed wiring board, an...

Semi-flex component carrier with dielectric material surrounding an...

Resin multilayer substrate and method for manufacturing resin multi...

Multilayer board and manufacturing method thereof

Adhesive film for multilayer printed-wiring board

Planar coil element and method for producing planar coil element

Method and apparatus for measuring eccentricity of blind via hole f...

Dual conductor laminated substrate

Multilayer printed wiring board and method of manufacturing the same

Method for making a three-dimensional liquid crystal polymer multil...

Wiring board and method for manufacturing the same

Multilayer board insulating sheet, multilayer board, and method of...

Printed wiring board and method for manufacturing the same

Resin composition, resin sheet, multilayer printed wiring board, an...

Method and system for providing dynamic personalized recommendation...

Methods and processes for forming electrical circuitries on three-d...

Multi-layered circuit board

Multilayer laminate and method for producing multilayer printed wir...

Multilayer substrate, multilayer substrate array, and transmission/...

Dual conductor laminated substrate

Printed wiring board, printed circuit board, prepreg

Multi-layered fabrication processing

Planar coil element and method for producing planar coil element

Metal-clad laminate, circuit board, and multilayer circuit board

Multilayer board and manufacturing method of the same

Multi-layered circuit board and method for manufacturing the same

Method for making a three-dimensional liquid crystal polymer multil...

Electronic component, electronic device, and method for mounting el...

Wiring substrate for electronic component inspection apparatus

Patents Applicationslast 30 patents

LAMINATED STRUCTURE, AND METHOD FOR MANUFACTURING LAMINATED STRUCTURE

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...

MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF

WIRING BOARD UNIT AND METHOD FOR DESIGNING THE SAME

RESIN SHEET AND RESIN MULTILAYER SUBSTRATE

SEMICONDUCTOR PACKAGE SUBSTRATE WITH HYBRID CORE STRUCTURE AND METH...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

LAMINATED WIRING BOARD

OPTICAL MODULE ASSEMBLY, OPTICAL MODULE, PACKAGE FOR OPTICAL MODULE...

THERMAL CONNECTION BETWEEN PRINTED CIRCUIT BOARD AND BASE PLATE WIT...

MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF

COMPONENT-CONTAINING SUBSTRATE

METHOD AND APPARATUS FOR MEASURING ECCENTRICITY OF BLIND VIA HOLE F...

METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...

Semi-Flex Component Carrier With Dielectric Material Surrounding an...

RESIN MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING RESIN MULTI...

RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...

PLANAR COIL ELEMENT AND METHOD FOR PRODUCING PLANAR COIL ELEMENT

RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...

DUAL CONDUCTOR LAMINATED SUBSTRATE

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTI-LAYERED CIRCUIT BOARD

Dual Conductor Laminated Substrate

METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...

MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

MULTILAYER BOARD AND MANUFACTURING METHOD OF THE SAME

MULTILAYER BOARD INSULATING SHEET, MULTILAYER BOARD, AND METHOD OF...

MULTILAYER SUBSTRATE, MULTILAYER SUBSTRATE ARRAY, AND TRANSMISSION/...

METHOD AND SYSTEM FOR PROVIDING DYNAMIC PERSONALIZED RECOMMENDATION...

MULTI-LAYERED STRUCTURE AND SUBSTRATE