characterised by the leads

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H05K3/3426

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3426characterised by the leads

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High performance semiconductor device
- Patent number 12,159,817
- Issue date Dec 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package structure and method for fabricating the same
- Patent number 12,089,346
- Issue date Sep 10, 2024
- Realtek Semiconductor Corp.
- Hai-Tao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, printed circuit board (PCB), and method of in...
- Patent number 12,080,634
- Issue date Sep 3, 2024
- The Noco Company
- James P. McBride
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional functional integration
- Patent number 12,074,098
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient wave guide transition between package and PCB using solde...
- Patent number 11,963,291
- Issue date Apr 16, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated semiconductor devices
- Patent number 11,791,248
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly with electronic surface mount device and mou...
- Patent number 11,785,711
- Issue date Oct 10, 2023
- Honeywell International Inc.
- Scott A. Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making electrical connectors with an electrical interposer
- Patent number 11,715,895
- Issue date Aug 1, 2023
- Seagate Technology LLC
- Michael J. Peterson
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional functional integration
- Patent number 11,682,609
- Issue date Jun 20, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated semiconductor devices
- Patent number 11,552,006
- Issue date Jan 10, 2023
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic sensor component and assembly
- Patent number 11,474,165
- Issue date Oct 18, 2022
- Melexis Technologies SA
- Jian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,443,897
- Issue date Sep 13, 2022
- TDK Corporation
- Toshihiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical component package with reinforced molded pins
- Patent number 11,432,407
- Issue date Aug 30, 2022
- XFMRS, Inc.
- Tung Kong Luk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-to-bottom interconnects with molded lead-frame module for integ...
- Patent number 11,322,434
- Issue date May 3, 2022
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for compensating for thermal expansion caused by...
- Patent number 11,267,062
- Issue date Mar 8, 2022
- Dell Products L.P.
- Brian D. Kennedy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanically-compliant and electrically and thermally conductive le...
- Patent number 11,272,618
- Issue date Mar 8, 2022
- Analog Devices International Unlimited Company
- John David Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly with electronic surface mount device and mou...
- Patent number 11,219,121
- Issue date Jan 4, 2022
- Honeywell International Inc.
- Scott A. Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, device package, and method of fabrication
- Patent number 11,114,239
- Issue date Sep 7, 2021
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic sensor component and assembly
- Patent number 11,067,645
- Issue date Jul 20, 2021
- Melexis Technologies SA
- Jian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMD diode taking a runner as body and manufacturing method thereof
- Patent number 11,024,567
- Issue date Jun 1, 2021
- SIYANG GRANDE ELECTRONICS CO., LTD.
- Yunhui Zhong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting arrangement and corresponding method for mounting an ele...
- Patent number 10,905,010
- Issue date Jan 26, 2021
- Robert Bosch GmbH
- Helmut Seiband
- G01 - MEASURING TESTING
Information Patent Grant
Ceramic electronic component, method of producing the same, and ele...
- Patent number 10,854,388
- Issue date Dec 1, 2020
- Taiyo Yuden Co., Ltd.
- Masaki Mochigi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 10,818,432
- Issue date Oct 27, 2020
- TDK Corporation
- Norihisa Ando
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component
- Patent number 10,811,191
- Issue date Oct 20, 2020
- TDK Corporation
- Fumiaki Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector
- Patent number 10,784,613
- Issue date Sep 22, 2020
- Lotes Co., Ltd.
- Ted Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,734,161
- Issue date Aug 4, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Beom Joon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-cost SMT printed circuit board connector
- Patent number 10,709,024
- Issue date Jul 7, 2020
- Universal Lighting Technologies, Inc.
- Christopher Radzinski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having bonding regions exposed through protect...
- Patent number 10,699,994
- Issue date Jun 30, 2020
- Fuji Electric Co., Ltd.
- Kenshi Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,650,970
- Issue date May 12, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component and mounting structure therefor
- Patent number 10,614,954
- Issue date Apr 7, 2020
- Murata Manufacturing Co., Ltd.
- Teppei Akiyoshi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...
- Publication number 20240422904
- Publication date Dec 19, 2024
- Chongqing BOE Electronic Technology Co., Ltd.
- Jie ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ALIGNING CONTACT SURFACES OF AN ELECTRICAL AND/OR ELECTR...
- Publication number 20240381542
- Publication date Nov 14, 2024
- ROBERT BOSCH GmbH
- Jivan Kapoor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20240145351
- Publication date May 2, 2024
- STMicroelectronics S.r.l
- Matteo DE SANTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME
- Publication number 20240006403
- Publication date Jan 4, 2024
- Molex, LLC
- Victor Zaderej
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Efficient Wave Guide Transition Between Package and PCB Using Solde...
- Publication number 20230345623
- Publication date Oct 26, 2023
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL FUNCTIONAL INTEGRATION
- Publication number 20230260879
- Publication date Aug 17, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230232543
- Publication date Jul 20, 2023
- Realtek Semiconductor Corp.
- Hai-Tao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED ELECTRICAL CONTACT FOR 3D LEDS
- Publication number 20230187419
- Publication date Jun 15, 2023
- Lumileds LLC
- Erik Wenmaekers
- F21 - LIGHTING
Information Patent Application
COATED SEMICONDUCTOR DEVICES
- Publication number 20230163050
- Publication date May 25, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH
- Publication number 20230121347
- Publication date Apr 20, 2023
- Raytheon Company
- Andrew R. Southworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PRINTED CIRCUIT BOARD (PCB), AND METHOD OF IN...
- Publication number 20220399256
- Publication date Dec 15, 2022
- The NOCO Company
- James P. McBRIDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Frequency Line Connecting Structure
- Publication number 20220384928
- Publication date Dec 1, 2022
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CURRENT SURFACE MOUNT TOROID INDUCTOR
- Publication number 20220165471
- Publication date May 26, 2022
- STEERING SOLUTIONS IP HOLDING CORPORATION
- Michael C. Hallman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMBLY WITH ELECTRONIC SURFACE MOUNT DEVICE AND MOU...
- Publication number 20220110208
- Publication date Apr 7, 2022
- Honeywell International Inc.
- Scott A. Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED SEMICONDUCTOR DEVICES
- Publication number 20220028765
- Publication date Jan 27, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MAKING ELECTRICAL CONNECTORS WITH AN ELECTRICAL INTERPOSER
- Publication number 20220013940
- Publication date Jan 13, 2022
- SEAGATE TECHNOLOGY LLC
- Michael J. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR COMPENSATING FOR THERMAL EXPANSION CAUSED BY...
- Publication number 20210370428
- Publication date Dec 2, 2021
- Dell Products L.P.
- BRIAN D. KENNEDY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20210358690
- Publication date Nov 18, 2021
- TDK Corporation
- Toshihiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN AND PACKAGING METHOD FOR PCB BOARD TO AVOID PATCH ELEMENT TO...
- Publication number 20210227701
- Publication date Jul 22, 2021
- ZHENGZHOU YUNHAI INFORMATION TECHNOLOGY CO., LTD.
- Yingna WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY WITH ELECTRONIC SURFACE MOUNT DEVICE AND MOU...
- Publication number 20210212200
- Publication date Jul 8, 2021
- HONEYWELL INTERNATIONAL INC.
- Scott A. Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS FOR ELEC...
- Publication number 20210185829
- Publication date Jun 17, 2021
- Jan Franck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, DEVICE PACKAGE, AND METHOD OF FABRICATION
- Publication number 20210151251
- Publication date May 20, 2021
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP-TO-BOTTOM INTERCONNECTS WITH MOLDED LEAD-FRAME MODULE FOR INTEG...
- Publication number 20210057318
- Publication date Feb 25, 2021
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC SENSOR COMPONENT AND ASSEMBLY
- Publication number 20210048489
- Publication date Feb 18, 2021
- Melexis Technologies SA
- Jian CHEN
- G01 - MEASURING TESTING
Information Patent Application
THREE-DIMENSIONAL FUNCTIONAL INTEGRATION
- Publication number 20200411420
- Publication date Dec 31, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200395259
- Publication date Dec 17, 2020
- DENSO CORPORATION
- Syuhei Miyachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC BOARD, COMPOSITE SHEET, AND ELEC...
- Publication number 20200163230
- Publication date May 21, 2020
- LENOVO (SINGAPORE) PTE. LTD.
- Tadashi Kosuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMD DIODE TAKING A RUNNER AS BODY AND MANUFACTURING METHOD THEREOF
- Publication number 20200075465
- Publication date Mar 5, 2020
- Siyang Grande Electronics Co., Ltd.
- Yunhui Zhong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...
- Publication number 20190304702
- Publication date Oct 3, 2019
- EPCOS AG
- Markus Koini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTOR
- Publication number 20190199029
- Publication date Jun 27, 2019
- LOTES CO., LTD
- Ted Ju
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High performance semiconductor device

Die package structure and method for fabricating the same

Semiconductor device, printed circuit board (PCB), and method of in...

Three-dimensional functional integration

Efficient wave guide transition between package and PCB using solde...

Coated semiconductor devices

Circuit board assembly with electronic surface mount device and mou...

Methods for making electrical connectors with an electrical interposer

Three-dimensional functional integration

Coated semiconductor devices

Magnetic sensor component and assembly

Electronic component

Electrical component package with reinforced molded pins

Top-to-bottom interconnects with molded lead-frame module for integ...

System and method for compensating for thermal expansion caused by...

Mechanically-compliant and electrically and thermally conductive le...

Circuit board assembly with electronic surface mount device and mou...

Electronic device, device package, and method of fabrication

Magnetic sensor component and assembly

SMD diode taking a runner as body and manufacturing method thereof

Connecting arrangement and corresponding method for mounting an ele...

Ceramic electronic component, method of producing the same, and ele...

Electronic device

Electronic component

Electrical connector

Multilayer electronic component and board having the same

Low-cost SMT printed circuit board connector

Semiconductor device having bonding regions exposed through protect...

Multilayer electronic component and board having the same

Ceramic electronic component and mounting structure therefor

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...

METHOD FOR ALIGNING CONTACT SURFACES OF AN ELECTRICAL AND/OR ELECTR...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME

Efficient Wave Guide Transition Between Package and PCB Using Solde...

THREE-DIMENSIONAL FUNCTIONAL INTEGRATION

DIE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

LED ELECTRICAL CONTACT FOR 3D LEDS

COATED SEMICONDUCTOR DEVICES

ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH

SEMICONDUCTOR DEVICE, PRINTED CIRCUIT BOARD (PCB), AND METHOD OF IN...

High-Frequency Line Connecting Structure

HIGH CURRENT SURFACE MOUNT TOROID INDUCTOR

CIRCUIT BOARD ASSEMBLY WITH ELECTRONIC SURFACE MOUNT DEVICE AND MOU...

COATED SEMICONDUCTOR DEVICES

METHODS FOR MAKING ELECTRICAL CONNECTORS WITH AN ELECTRICAL INTERPOSER

SYSTEM AND METHOD FOR COMPENSATING FOR THERMAL EXPANSION CAUSED BY...

ELECTRONIC COMPONENT

DESIGN AND PACKAGING METHOD FOR PCB BOARD TO AVOID PATCH ELEMENT TO...

CIRCUIT BOARD ASSEMBLY WITH ELECTRONIC SURFACE MOUNT DEVICE AND MOU...

DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS FOR ELEC...

ELECTRONIC DEVICE, DEVICE PACKAGE, AND METHOD OF FABRICATION

TOP-TO-BOTTOM INTERCONNECTS WITH MOLDED LEAD-FRAME MODULE FOR INTEG...

MAGNETIC SENSOR COMPONENT AND ASSEMBLY

THREE-DIMENSIONAL FUNCTIONAL INTEGRATION

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING ELECTRONIC BOARD, COMPOSITE SHEET, AND ELEC...

SMD DIODE TAKING A RUNNER AS BODY AND MANUFACTURING METHOD THEREOF

ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...

ELECTRICAL CONNECTOR