characterised by the materials of the lead frames or layers thereon

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H01L23/49579

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49579characterised by the materials of the lead frames or layers thereon

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 12,205,870
- Issue date Jan 21, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for a die
- Patent number 12,136,587
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit power module and related methods
- Patent number 12,119,576
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,119,290
- Issue date Oct 15, 2024
- Rohm Co., Ltd.
- Takumi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with adjustable clip
- Patent number 12,046,540
- Issue date Jul 23, 2024
- Infineon Technologies AG
- Christian Feuerbaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package, and method for manufacturing power semiconductor module
- Patent number 11,978,682
- Issue date May 7, 2024
- NGK Electronics Devices, Inc.
- Yoshio Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary protective film for semiconductor sealing molding, lead f...
- Patent number 11,908,762
- Issue date Feb 20, 2024
- Resonac Corporation
- Naoki Tomori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Reinforced semiconductor die and related methods
- Patent number 11,791,288
- Issue date Oct 17, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic power module
- Patent number 11,776,940
- Issue date Oct 3, 2023
- Kyocera AVX Components (Salzburg) GmbH
- Louis Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module including lead frame unit connecting first substrate a...
- Patent number 11,756,867
- Issue date Sep 12, 2023
- LG Electronics Inc.
- Siho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the manufacture of integrated devices including a die fi...
- Patent number 11,756,916
- Issue date Sep 12, 2023
- STMicroelectronics S.r.l.
- Michele Calabretta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 11,721,614
- Issue date Aug 8, 2023
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 11,688,670
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,670,572
- Issue date Jun 6, 2023
- Rohm Co., Ltd.
- Takumi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and semiconductor device
- Patent number 11,581,246
- Issue date Feb 14, 2023
- Sumitomo Electric Device Innovations, Inc.
- Shingo Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,538,733
- Issue date Dec 27, 2022
- Denso Corporation
- Toshihiro Miyake
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device
- Patent number 11,538,745
- Issue date Dec 27, 2022
- Mitsubishi Electric Corporation
- Kazuki Takakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of heat sinks for a semiconductor package
- Patent number 11,515,237
- Issue date Nov 29, 2022
- Agency for Science, Technology and Research
- Gongyue Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 11,508,635
- Issue date Nov 22, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the manufacture of integrated devices including a die fi...
- Patent number 11,482,503
- Issue date Oct 25, 2022
- STMicroelectronics S.r.l.
- Michele Calabretta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making flexible semiconductor device with graphene tape
- Patent number 11,456,188
- Issue date Sep 27, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer frame for semiconductor packages
- Patent number 11,450,593
- Issue date Sep 20, 2022
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced semiconductor die and related methods
- Patent number 11,348,878
- Issue date May 31, 2022
- Semiconductor Components Industries, LLC
- Erik Nino Tolentino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods and apparatus to produce such sem...
- Patent number 11,296,016
- Issue date Apr 5, 2022
- Texas Instruments Incorporated
- Robert Allan Neidorff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with copper corrosion inhibitors
- Patent number 11,282,757
- Issue date Mar 22, 2022
- Infineon Technologies Austria AG
- Sabine Reither
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe in packages of integrated circuits
- Patent number 11,251,111
- Issue date Feb 15, 2022
- Intel Corporation
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame package
- Patent number 11,239,141
- Issue date Feb 1, 2022
- Industrial Technology Research Institute
- Ren-Shin Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic power module
- Patent number 11,222,878
- Issue date Jan 11, 2022
- A.B. MIKROELEKTRONIK GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
- Louis Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,211,312
- Issue date Dec 28, 2021
- Rohm Co., Ltd.
- Takumi Kanda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME FOR A DIE
- Publication number 20250022776
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Dolores Babaran MILO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20240404928
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20240321665
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROTECTING LEADFRAME, LEADFRAME COMPOSITE, BOX AND OUTSI...
- Publication number 20240294322
- Publication date Sep 5, 2024
- ADVANCED ASSEMBLY MATERIALS ANHUI LIMITED
- Ching Leung Lawrence KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240297102
- Publication date Sep 5, 2024
- ROHM CO., LTD.
- Masato IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240274490
- Publication date Aug 15, 2024
- Hitachi Power Semiconductor Device, Ltd.
- Yujiro Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP POWER CARD HAVING EMBEDDED THERMAL CONDUCTOR
- Publication number 20240266262
- Publication date Aug 8, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adaptive Flip Chip Bonding for Semiconductor Packages
- Publication number 20240213035
- Publication date Jun 27, 2024
- INFINEON TECHNOLOGIES AG
- Chew Yeek Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240178100
- Publication date May 30, 2024
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGE AND FABRICATING METHOD OF THE SAME
- Publication number 20240128168
- Publication date Apr 18, 2024
- UNITED MICROELECTRONICS CORP.
- Chiu-Feng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240124799
- Publication date Apr 18, 2024
- Kabushiki Kaisha Toshiba
- Masato YASUI
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
REDUCED STRESS CLIP FOR SEMICONDUCTOR DIE
- Publication number 20240096765
- Publication date Mar 21, 2024
- NEXPERIA B.V.
- Homer Gler Malveda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240079296
- Publication date Mar 7, 2024
- ROHM CO., LTD.
- Takumi KANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR EQUIPMENT
- Publication number 20240047438
- Publication date Feb 8, 2024
- Rohm Co., Ltd.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230402349
- Publication date Dec 14, 2023
- STMicroelectronics S.r.l.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PRODUCT, METHOD AND ELECTRONIC DEVICE
- Publication number 20230352377
- Publication date Nov 2, 2023
- Hitachi Energy Switzerland AG
- Dominik TRUESSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20230290709
- Publication date Sep 14, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230253297
- Publication date Aug 10, 2023
- Rohm Co., Ltd.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230245954
- Publication date Aug 3, 2023
- Rohm Co., Ltd.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREOF, CONVERTER, AND ELECT...
- Publication number 20230215788
- Publication date Jul 6, 2023
- Huawei Technologies Co., Ltd
- Wengang LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods for Forming a Semiconductor Device
- Publication number 20230095162
- Publication date Mar 30, 2023
- Intel Corporation
- Georg SEIDEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20230083412
- Publication date Mar 16, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE MANUFACTURE OF INTEGRATED DEVICES INCLUDING A DIE FI...
- Publication number 20230080594
- Publication date Mar 16, 2023
- STMicroelectronics S.r.l.
- Michele CALABRETTA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP PACKAGED DEVICES WITH THERMAL INTERPOSER
- Publication number 20230059142
- Publication date Feb 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE DIES AND METHODS OF FORMING AND PLACEMENT...
- Publication number 20220415813
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Shang-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE METAL FRAME FOR A POWER ELECTRONIC MODULE AND ASSOCIATED...
- Publication number 20220406694
- Publication date Dec 22, 2022
- SAFRAN
- Toni YOUSSEF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220301983
- Publication date Sep 22, 2022
- Kabushiki Kaisha Toshiba
- Kyo TANABIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED SEMICONDUCTOR DIE AND RELATED METHODS
- Publication number 20220254734
- Publication date Aug 11, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20220230989
- Publication date Jul 21, 2022
- Nitto Denko Corporation
- Mayu Sato
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the materials of the lead frames or layers thereon

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method for fabricating a semiconductor pa...

Lead frame for a die

Press-fit power module and related methods

Semiconductor device

Semiconductor package having routable encapsulated conductive subst...

Leadframe package with adjustable clip

Package, and method for manufacturing power semiconductor module

Temporary protective film for semiconductor sealing molding, lead f...

Reinforced semiconductor die and related methods

Electronic power module

Power module including lead frame unit connecting first substrate a...

Method for the manufacture of integrated devices including a die fi...

Method of manufacturing semiconductor devices and corresponding sem...

Semiconductor package and method for fabricating a semiconductor pa...

Semiconductor device

Semiconductor device package and semiconductor device

Electronic device

Semiconductor device

Plurality of heat sinks for a semiconductor package

Semiconductor package having routable encapsulated conductive subst...

Method for the manufacture of integrated devices including a die fi...

Method of making flexible semiconductor device with graphene tape

Spacer frame for semiconductor packages

Reinforced semiconductor die and related methods

Semiconductor devices and methods and apparatus to produce such sem...

Semiconductor device with copper corrosion inhibitors

Leadframe in packages of integrated circuits

Lead frame package

Electronic power module

Semiconductor device

Patents Applicationslast 30 patents

LEAD FRAME FOR A DIE

LEAD FRAME AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

METHOD FOR PROTECTING LEADFRAME, LEADFRAME COMPOSITE, BOX AND OUTSI...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

CHIP-ON-CHIP POWER CARD HAVING EMBEDDED THERMAL CONDUCTOR

Adaptive Flip Chip Bonding for Semiconductor Packages

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

QFN PACKAGE AND FABRICATING METHOD OF THE SAME

CLEANING LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

REDUCED STRESS CLIP FOR SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR EQUIPMENT

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

PRE-PRODUCT, METHOD AND ELECTRONIC DEVICE

Semiconductor Package and Method for Fabricating a Semiconductor Pa...

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

POWER MODULE AND MANUFACTURING METHOD THEREOF, CONVERTER, AND ELECT...

Semiconductor Devices and Methods for Forming a Semiconductor Device

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

METHOD FOR THE MANUFACTURE OF INTEGRATED DEVICES INCLUDING A DIE FI...

FLIP CHIP PACKAGED DEVICES WITH THERMAL INTERPOSER

INTEGRATED PASSIVE DEVICE DIES AND METHODS OF FORMING AND PLACEMENT...

CONDUCTIVE METAL FRAME FOR A POWER ELECTRONIC MODULE AND ASSOCIATED...

SEMICONDUCTOR DEVICE

REINFORCED SEMICONDUCTOR DIE AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE