characterised by the patterning method

Industry

CPC
H05K3/182

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/182characterised by the patterning method

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plasma treatments for flexures of hard disk drives
- Patent number 12,129,567
- Issue date Oct 29, 2024
- Hutchinson Technology Incorporated
- Kurt F. Fischer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit structure
- Patent number 12,035,467
- Issue date Jul 9, 2024
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure
- Patent number 11,729,908
- Issue date Aug 15, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 11,503,718
- Issue date Nov 15, 2022
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit board with traces thicker than a circuit board
- Patent number 11,406,024
- Issue date Aug 2, 2022
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for selectively metallizing surface of ceramic substrate, ce...
- Patent number 11,382,216
- Issue date Jul 5, 2022
- BYD Company Limited
- Qing Gong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mask structure and manufacturing method thereof
- Patent number 11,366,381
- Issue date Jun 21, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing plated component, plated component, catalytic...
- Patent number 11,310,918
- Issue date Apr 19, 2022
- MAXELL, LTD.
- Naoki Usuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Display device and method of fabricating the same
- Patent number 11,199,935
- Issue date Dec 14, 2021
- Samsung Display Co., Ltd.
- Gyung Min Baek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring on curved surfaces
- Patent number 11,194,179
- Issue date Dec 7, 2021
- Tectus Corporation
- Eric Anthony Perozziello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition for LDS, resin molded article, and...
- Patent number 11,174,402
- Issue date Nov 16, 2021
- Sumitomo Bakelite Co., Ltd.
- Toru Meura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flexible printed circuit board
- Patent number 11,140,785
- Issue date Oct 5, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double-sided circuit board and method for preparing the same
- Patent number 11,134,574
- Issue date Sep 28, 2021
- Taiwan Green Point Enterprises Co., Ltd.
- I-Lin Tseng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a polymer printed circuit board
- Patent number 11,102,891
- Issue date Aug 24, 2021
- BGT MATERIALS LIMITED
- Kuo-Hsin Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microcircuit forming method and etching fluid composition
- Patent number 11,089,691
- Issue date Aug 10, 2021
- Inktec Co., Ltd.
- Su Han Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Catalytic ink comprising metallic material made from diamminesilver...
- Patent number 11,089,692
- Issue date Aug 10, 2021
- Taiwan Green Point Enterprises Co., Ltd.
- Pen-Yi Liao
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Multi-layer circuit board with traces thicker than a circuit board...
- Patent number 11,039,540
- Issue date Jun 15, 2021
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing plated component, plated component, catalytic...
- Patent number 11,013,125
- Issue date May 18, 2021
- MAXELL HOLDINGS, LTD.
- Naoki Usuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board using non-catalytic laminate with catalytic adhesive...
- Patent number 10,959,329
- Issue date Mar 23, 2021
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pretreating liquid for electroless plating to be used during reduct...
- Patent number 10,927,463
- Issue date Feb 23, 2021
- C. Uyemura & Co., Ltd.
- Yoshikazu Saijo
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 10,905,014
- Issue date Jan 26, 2021
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing electroconductive laminate, three-dimensional...
- Patent number 10,889,897
- Issue date Jan 12, 2021
- FUJIFILM Corporation
- Naoki Tsukamoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Imprinted metallization on polymeric substrates
- Patent number 10,874,020
- Issue date Dec 22, 2020
- The University of Hong Kong
- Wendi Li
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Metalization of surfaces
- Patent number 10,822,702
- Issue date Nov 3, 2020
- Cuptronic Technology Ltd.
- Björn Atthoff
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Catalytic circuit board with traces and vias
- Patent number 10,806,029
- Issue date Oct 13, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless copper plating polydopamine nanoparticles
- Patent number 10,760,162
- Issue date Sep 1, 2020
- The Research Foundation for the State University of New York
- Siyuan Ma
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Display device and method of fabricating the same
- Patent number 10,684,698
- Issue date Jun 16, 2020
- Samsung Display Co., Ltd.
- Gyung Min Baek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 10,667,407
- Issue date May 26, 2020
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of fast fabrication of single and multilayer circuit with h...
- Patent number 10,660,217
- Issue date May 19, 2020
- Jun Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Photosensitive resin composition, photosensitive element, cured pro...
- Patent number 10,656,521
- Issue date May 19, 2020
- Hitachi Chemical Company, Ltd.
- Tetsuya Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SENSING DEVICE AND PREPARATION METHOD THEREFOR
- Publication number 20240365474
- Publication date Oct 31, 2024
- Beijing BOE Technology Development Co., Ltd.
- Fanli MENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CATALYST INK FOR PLATING AND ELECTROLESS PLATING METHOD USING SAME
- Publication number 20240360331
- Publication date Oct 31, 2024
- Korea Electrotechnology Research Institute
- Seung Kwon SEOL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240008191
- Publication date Jan 4, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT, PRINTED CIRCUIT, AND METHOD OF M...
- Publication number 20230371176
- Publication date Nov 16, 2023
- Sumitomo Electric Industries, Ltd.
- Takuto HIDANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Structure
- Publication number 20230354515
- Publication date Nov 2, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Articles and Structures with Laser Breakable and Platable Compounds
- Publication number 20230340226
- Publication date Oct 26, 2023
- SHPP Global Technologies B.V.
- Yunan CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMI ADDITIVE MANUFACTURING PROCESS FOR PRODUCING PRINTED ELECTRONICS
- Publication number 20230074639
- Publication date Mar 9, 2023
- CREATIVE IC3D LTD.
- Yacov MAZUZ
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
System, Apparatus and Method for Utilizing Surface Mount Technology...
- Publication number 20220408565
- Publication date Dec 22, 2022
- Jabil Inc.
- Weiping (aka Jonathan) Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CATALYST INK FOR PLATING AND ELECTROLESS PLATING METHOD USING SAME
- Publication number 20210340397
- Publication date Nov 4, 2021
- Korea Electrotechnology Research Institute
- Seung Kwon SEOL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING A STRUCTURE HAVING CONDUCTIVE LINES
- Publication number 20210329790
- Publication date Oct 21, 2021
- Industrial Technology Research Institute
- Yu-Ming WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Layer Circuit Board with Traces Thicker than a Circuit Board
- Publication number 20210282274
- Publication date Sep 9, 2021
- CATLAM LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Structure
- Publication number 20210274652
- Publication date Sep 2, 2021
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING PLATED COMPONENT, PLATED COMPONENT, CATALYTIC...
- Publication number 20210235587
- Publication date Jul 29, 2021
- Maxell Holdings, Ltd.
- Naoki USUKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...
- Publication number 20210144861
- Publication date May 13, 2021
- Molex, LLC
- Marko SPIEGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRETREATING LIQUID FOR ELECTROLESS PLATING TO BE USED DURING REDUCT...
- Publication number 20210047734
- Publication date Feb 18, 2021
- C. Uyemura & Co., Ltd.
- Yoshikazu SAIJO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Circuit Board using non-catalytic laminate with catalytic adhesive...
- Publication number 20200404785
- Publication date Dec 24, 2020
- CATLAM, LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...
- Publication number 20200352032
- Publication date Nov 5, 2020
- Molex, LLC
- Marko SPIEGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING LAMINATED STRUCTURE OF TOUCH PANEL
- Publication number 20200337155
- Publication date Oct 22, 2020
- INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.
- Han Lung TSAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20200264706
- Publication date Aug 20, 2020
- SAMSUNG DISPLAY CO., LTD.
- Gyung Min BAEK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMPRINTED METALLIZATION ON POLYMERIC SUBSTRATES
- Publication number 20200260590
- Publication date Aug 13, 2020
- The University of Hong Kong
- Wendi LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multi-Layer Circuit Board with Traces Thicker than a Circuit Board...
- Publication number 20200214144
- Publication date Jul 2, 2020
- CATLAM, LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System, Apparatus and Method for Utilizing Surface Mount Technology...
- Publication number 20200205295
- Publication date Jun 25, 2020
- Jabil Inc.
- Weiping (aka Jonathan) Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS COPPER PLATING POLYDOPAMINE NANOPARTICLES
- Publication number 20200157684
- Publication date May 21, 2020
- The Research Foundation for The State University of New York
- Siyuan Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20200113064
- Publication date Apr 9, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- XIAN-QIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIAL DEPOSITION IN A MAGNETIC FIELD
- Publication number 20200024741
- Publication date Jan 23, 2020
- Coventry University
- Andrew Cobley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...
- Publication number 20200022265
- Publication date Jan 16, 2020
- Molex, LLC
- Marko SPIEGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTING ASSEMBLIES
- Publication number 20200008297
- Publication date Jan 2, 2020
- SOLVAY SPECIALTY POLYMERS ITALY S.P.A.
- Paula COJOCARU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UV curable Catalytic Adhesive for Circuit Boards with Traces and Vias
- Publication number 20200008306
- Publication date Jan 2, 2020
- SIERRA CIRCUITS, INC.
- Konstantine KARAVAKIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING RESIN COMPOSITION FOR LDS, RESIN MOLDED ARTICLE, AND...
- Publication number 20190292386
- Publication date Sep 26, 2019
- SUMITOMO BAKELITE CO., LTD.
- Toru MEURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRETREATING LIQUID FOR ELECTROLESS PLATING TO BE USED DURING REDUCT...
- Publication number 20190264329
- Publication date Aug 29, 2019
- C. Uyemura & Co., Ltd.
- Yoshikazu SAIJO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

characterised by the patterning method

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plasma treatments for flexures of hard disk drives

Circuit structure

Circuit structure

Application specific electronics packaging systems, methods and dev...

Multi-layer circuit board with traces thicker than a circuit board

Method for selectively metallizing surface of ceramic substrate, ce...

Mask structure and manufacturing method thereof

Method for producing plated component, plated component, catalytic...

Display device and method of fabricating the same

Wiring on curved surfaces

Thermosetting resin composition for LDS, resin molded article, and...

Flexible printed circuit board

Double-sided circuit board and method for preparing the same

Method of manufacturing a polymer printed circuit board

Microcircuit forming method and etching fluid composition

Catalytic ink comprising metallic material made from diamminesilver...

Multi-layer circuit board with traces thicker than a circuit board...

Method for producing plated component, plated component, catalytic...

Circuit board using non-catalytic laminate with catalytic adhesive...

Pretreating liquid for electroless plating to be used during reduct...

Application specific electronics packaging systems, methods and dev...

Method for producing electroconductive laminate, three-dimensional...

Imprinted metallization on polymeric substrates

Metalization of surfaces

Catalytic circuit board with traces and vias

Electroless copper plating polydopamine nanoparticles

Display device and method of fabricating the same

Application specific electronics packaging systems, methods and dev...

Methods of fast fabrication of single and multilayer circuit with h...

Photosensitive resin composition, photosensitive element, cured pro...

Patents Applicationslast 30 patents

SENSING DEVICE AND PREPARATION METHOD THEREFOR

CATALYST INK FOR PLATING AND ELECTROLESS PLATING METHOD USING SAME

WIRING SUBSTRATE

BASE MATERIAL FOR PRINTED CIRCUIT, PRINTED CIRCUIT, AND METHOD OF M...

Circuit Structure

Articles and Structures with Laser Breakable and Platable Compounds

SEMI ADDITIVE MANUFACTURING PROCESS FOR PRODUCING PRINTED ELECTRONICS

System, Apparatus and Method for Utilizing Surface Mount Technology...

CATALYST INK FOR PLATING AND ELECTROLESS PLATING METHOD USING SAME

METHOD OF MANUFACTURING A STRUCTURE HAVING CONDUCTIVE LINES

Multi-Layer Circuit Board with Traces Thicker than a Circuit Board

Circuit Structure

METHOD FOR PRODUCING PLATED COMPONENT, PLATED COMPONENT, CATALYTIC...

APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...

PRETREATING LIQUID FOR ELECTROLESS PLATING TO BE USED DURING REDUCT...

Circuit Board using non-catalytic laminate with catalytic adhesive...

APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...

METHOD FOR FORMING LAMINATED STRUCTURE OF TOUCH PANEL

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

IMPRINTED METALLIZATION ON POLYMERIC SUBSTRATES

Multi-Layer Circuit Board with Traces Thicker than a Circuit Board...

System, Apparatus and Method for Utilizing Surface Mount Technology...

ELECTROLESS COPPER PLATING POLYDOPAMINE NANOPARTICLES

FLEXIBLE PRINTED CIRCUIT BOARD

MATERIAL DEPOSITION IN A MAGNETIC FIELD

APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...

ELECTRICALLY CONDUCTING ASSEMBLIES

UV curable Catalytic Adhesive for Circuit Boards with Traces and Vias

THERMOSETTING RESIN COMPOSITION FOR LDS, RESIN MOLDED ARTICLE, AND...

PRETREATING LIQUID FOR ELECTROLESS PLATING TO BE USED DURING REDUCT...