characterised by the presence of antistatic elements

Industry

CPC
H01L21/67396

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67396characterised by the presence of antistatic elements

Industries

Patents Grantslast 30 patents

Information Patent Grant
EFEM and method of controlling supply amount of inert gas
- Patent number 12,087,606
- Issue date Sep 10, 2024
- Sinfonia Technology Co., Ltd.
- Masahiro Osawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reticle pod with antistatic capability
- Patent number 12,087,605
- Issue date Sep 10, 2024
- Gudeng Precision Industrial Co., Ltd.
- Ming-Chien Chiu
- G08 - SIGNALLING
Information Patent Grant
Semiconductor die carrier structure
- Patent number 11,881,421
- Issue date Jan 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Chung Tsai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Tray module, tray assembly including the same, and method for manuf...
- Patent number 11,810,806
- Issue date Nov 7, 2023
- Samsung Display Co., Ltd.
- Jahuem Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame cassette for holding tape-frames
- Patent number 11,594,439
- Issue date Feb 28, 2023
- Infineon Technologies AG
- Germar Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of ESD protection device
- Patent number 11,328,946
- Issue date May 10, 2022
- Industrial Technology Research Institute
- Ding-Shiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection composite structure, ESD protection device, and manu...
- Patent number 11,044,798
- Issue date Jun 22, 2021
- Industrial Technology Research Institute
- Ding-Shiang Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate-storing container
- Patent number 11,011,400
- Issue date May 18, 2021
- Sumco Corporation
- Hirotsugu Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die carrier structure
- Patent number 10,964,569
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Cheng Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rechargeable wafer carrier systems
- Patent number 10,931,143
- Issue date Feb 23, 2021
- GLOBALFOUNDRIES U.S. INC.
- Abner Bello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly for thin wafer shipping and method of use
- Patent number 10,784,137
- Issue date Sep 22, 2020
- ELPIS TECHNOLOGIES INC.
- Damyon L. Corbin
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Package assembly for thin wafer shipping and method of use
- Patent number 10,622,235
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Damyon L. Corbin
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Array substrate, fabricating method thereof, and display device
- Patent number 10,573,595
- Issue date Feb 25, 2020
- Beijing BOE Optoelectronics Technology Co., Ltd
- Jingang Hao
- G02 - OPTICS
Information Patent Grant
Package assembly for thin wafer shipping and method of use
- Patent number 10,468,280
- Issue date Nov 5, 2019
- International Business Machines Corporation
- Damyon L. Corbin
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Array substrate, fabricating method thereof, and display device
- Patent number 10,304,682
- Issue date May 28, 2019
- BOE Technology Group Co., Ltd.
- Jingang Hao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly for thin wafer shipping and method of use
- Patent number 10,090,180
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Damyon L. Corbin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame cassette
- Patent number 10,020,215
- Issue date Jul 10, 2018
- Infineon Technologies AG
- Germar Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-electrostatic substrate cassette
- Patent number 9,396,980
- Issue date Jul 19, 2016
- Gudeng Precision Industrial Co., Ltd.
- Chien-Feng Wang
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Manufacturing method and method for operating treatment apparatus
- Patent number 9,111,974
- Issue date Aug 18, 2015
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Front opening wafer carrier with path to ground effectuated by door
- Patent number 8,276,759
- Issue date Oct 2, 2012
- Entegris, Inc.
- Gregory Bores
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reduction of electric-field-induced damage in field-sensitive articles
- Patent number 8,016,114
- Issue date Sep 13, 2011
- Microtome Precision, Inc.
- Gavin Charles Rider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front opening wafer carrier with path to ground effectuated by door
- Patent number 7,886,910
- Issue date Feb 15, 2011
- Entegris, Inc.
- Gregory Bores
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Clean container having elastic positioning structure
- Patent number 7,850,009
- Issue date Dec 14, 2010
- Industrial Technology Research Institute
- Tzong-Ming Wu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method by treating substrate introduced into treatmen...
- Patent number 7,842,205
- Issue date Nov 30, 2010
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vehicle with electrostatic charge eliminators
- Patent number 7,697,259
- Issue date Apr 13, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chian-Chen Chiou
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Airtight semiconductor transferring container
- Patent number 7,469,788
- Issue date Dec 30, 2008
- Ming-Lung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Container for an electronic component
- Patent number 7,364,778
- Issue date Apr 29, 2008
- Denki Kagaku Kogyo Kabushiki Kaisha
- Takeshi Miyakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clean container module
- Patent number 7,337,911
- Issue date Mar 4, 2008
- Industrial Technology Research Institute
- Tzong-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate container
- Patent number 7,316,325
- Issue date Jan 8, 2008
- Entegris, Inc.
- John Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photomask container
- Patent number 7,309,460
- Issue date Dec 18, 2007
- Entegris, Inc.
- Michael L. Johnson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EFEM AND METHOD OF CONTROLLING SUPPLY AMOUNT OF INERT GAS
- Publication number 20240420980
- Publication date Dec 19, 2024
- SINFONIA TECHNOLOGY CO., LTD.
- Masahiro Osawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION DEVICE FOR SUBSTRATE CONTAINER
- Publication number 20240371670
- Publication date Nov 7, 2024
- GUDENG PRECISION INDUSTRIAL CO., LTD.
- MING-CHIEN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STORAGE DEVICE WITH PARTICLE-ATTRACTION OBJECT
- Publication number 20240347360
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Cheng KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE CARRIER STRUCTURE
- Publication number 20240087932
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Chung TSAI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
UNDER BOAT SUPPORT WITH ELECTROSTATIC DISCHARGE STRUCTURE
- Publication number 20230386875
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Hao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATED DIE SHIPPING TRAY ASSEMBLY
- Publication number 20230290661
- Publication date Sep 14, 2023
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS HAVING CONDUCTIVE POLYMER COATING FOR ELECTROST...
- Publication number 20230197491
- Publication date Jun 22, 2023
- Entegris, Inc.
- Zhifeng Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EFEM AND METHOD OF CONTROLLING SUPPLY AMOUNT OF INERT GAS
- Publication number 20230066029
- Publication date Mar 2, 2023
- SINFONIA TECHNOLOGY CO., LTD.
- Masahiro Osawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETICLE POD WITH ANTISTATIC CAPABILITY
- Publication number 20220102177
- Publication date Mar 31, 2022
- GUDENG PRECISION INDUSTRIAL CO., LTD.
- Ming-Chien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ESD PROTECTION DEVICE
- Publication number 20210282253
- Publication date Sep 9, 2021
- Industrial Technology Research Institute
- Ding-Shiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE CARRIER STRUCTURE
- Publication number 20210217642
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Chung TSAI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
TRAY MODULE, TRAY ASSEMBLY INCLUDING THE SAME, AND METHOD FOR MANUF...
- Publication number 20200043768
- Publication date Feb 6, 2020
- SAMSUNG DISPLAY CO., LTD.
- Jahuem KOO
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE
- Publication number 20200027766
- Publication date Jan 23, 2020
- International Business Machines Corporation
- Damyon L. Corbin
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SEMICONDUCTOR DIE CARRIER STRUCTURE
- Publication number 20200006105
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Cheng KO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ESD PROTECTION COMPOSITE STRUCTURE, ESD PROTECTION DEVICE, AND MANU...
- Publication number 20190364653
- Publication date Nov 28, 2019
- Industrial Technology Research Institute
- Ding-Shiang Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ARRAY SUBSTRATE, FABRICATING METHOD THEREOF, AND DISPLAY DEVICE
- Publication number 20190311904
- Publication date Oct 10, 2019
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jingang HAO
- G02 - OPTICS
Information Patent Application
SUBSTRATE-STORING CONTAINER
- Publication number 20190080946
- Publication date Mar 14, 2019
- SUMCO CORPORATION
- Hirotsugu EGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Frame Cassette for Holding Tape-Frames
- Publication number 20180308721
- Publication date Oct 25, 2018
- INFINEON TECHNOLOGIES AG
- Germar Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE
- Publication number 20180308734
- Publication date Oct 25, 2018
- International Business Machines Corporation
- Damyon L. Corbin
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE
- Publication number 20170032993
- Publication date Feb 2, 2017
- International Business Machines Corporation
- Damyon L. Corbin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRAME CASSETTE
- Publication number 20160141189
- Publication date May 19, 2016
- INFINEON TECHNOLOGIES AG
- Germar Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRAME CASSETTE
- Publication number 20150214084
- Publication date Jul 30, 2015
- INFINEON TECHNOLOGIES AG
- Germar Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SYSTEM FOR PROTECTION OF IC WAFERS DURING FABRICATION, TR...
- Publication number 20150008154
- Publication date Jan 8, 2015
- Ray G. Brooks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING TRANSPORTATION OF SUBSTRATE OF LI...
- Publication number 20140374307
- Publication date Dec 25, 2014
- SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD.
- Minghu Qi
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
ANTI-ELECTROSTATIC SUBSTRATE CASSETTE
- Publication number 20140299508
- Publication date Oct 9, 2014
- GUDENG PRECISION INDUSTRIAL CO., LTD.
- CHIEN-FENG WANG
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
TRANSPORTNG APPARATUS AND PROCESSING APPARATUS
- Publication number 20140086712
- Publication date Mar 27, 2014
- TOKYO ELECTRON LIMITED
- Katsuhiko Oyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STORAGE CONTAINER
- Publication number 20120298549
- Publication date Nov 29, 2012
- Shin-Etsu Polymer Co., Ltd.
- Yoshiaki Fujimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SYSTEM FOR PROTECTION OF IC WAFERS DURING FABRICATION, TR...
- Publication number 20120181215
- Publication date Jul 19, 2012
- Ray G. Brooks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT OPENING WAFER CONTANER WITH PATH TO GROUND EFFECTUATED BY DOOR
- Publication number 20110131800
- Publication date Jun 9, 2011
- Entegris, Inc.
- Gregory Bores
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD AND METHOD FOR OPERATING TREATMENT APPARATUS
- Publication number 20110065259
- Publication date Mar 17, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei YAMAZAKI
- G06 - COMPUTING CALCULATING COUNTING

characterised by the presence of antistatic elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

EFEM and method of controlling supply amount of inert gas

Reticle pod with antistatic capability

Semiconductor die carrier structure

Tray module, tray assembly including the same, and method for manuf...

Frame cassette for holding tape-frames

Manufacturing method of ESD protection device

ESD protection composite structure, ESD protection device, and manu...

Substrate-storing container

Semiconductor die carrier structure

Rechargeable wafer carrier systems

Package assembly for thin wafer shipping and method of use

Package assembly for thin wafer shipping and method of use

Array substrate, fabricating method thereof, and display device

Package assembly for thin wafer shipping and method of use

Array substrate, fabricating method thereof, and display device

Package assembly for thin wafer shipping and method of use

Frame cassette

Anti-electrostatic substrate cassette

Manufacturing method and method for operating treatment apparatus

Front opening wafer carrier with path to ground effectuated by door

Reduction of electric-field-induced damage in field-sensitive articles

Front opening wafer carrier with path to ground effectuated by door

Clean container having elastic positioning structure

Manufacturing method by treating substrate introduced into treatmen...

Vehicle with electrostatic charge eliminators

Airtight semiconductor transferring container

Container for an electronic component

Clean container module

Substrate container

Photomask container

Patents Applicationslast 30 patents

EFEM AND METHOD OF CONTROLLING SUPPLY AMOUNT OF INERT GAS

PROTECTION DEVICE FOR SUBSTRATE CONTAINER

WAFER STORAGE DEVICE WITH PARTICLE-ATTRACTION OBJECT

SEMICONDUCTOR DIE CARRIER STRUCTURE

UNDER BOAT SUPPORT WITH ELECTROSTATIC DISCHARGE STRUCTURE

SINGULATED DIE SHIPPING TRAY ASSEMBLY

METHODS AND SYSTEMS HAVING CONDUCTIVE POLYMER COATING FOR ELECTROST...

EFEM AND METHOD OF CONTROLLING SUPPLY AMOUNT OF INERT GAS

RETICLE POD WITH ANTISTATIC CAPABILITY

MANUFACTURING METHOD OF ESD PROTECTION DEVICE

SEMICONDUCTOR DIE CARRIER STRUCTURE

TRAY MODULE, TRAY ASSEMBLY INCLUDING THE SAME, AND METHOD FOR MANUF...

PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE

SEMICONDUCTOR DIE CARRIER STRUCTURE

ESD PROTECTION COMPOSITE STRUCTURE, ESD PROTECTION DEVICE, AND MANU...

ARRAY SUBSTRATE, FABRICATING METHOD THEREOF, AND DISPLAY DEVICE

SUBSTRATE-STORING CONTAINER

Frame Cassette for Holding Tape-Frames

PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE

PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE

FRAME CASSETTE

FRAME CASSETTE

PACKAGING SYSTEM FOR PROTECTION OF IC WAFERS DURING FABRICATION, TR...

SYSTEM AND METHOD FOR CONTROLLING TRANSPORTATION OF SUBSTRATE OF LI...

ANTI-ELECTROSTATIC SUBSTRATE CASSETTE

TRANSPORTNG APPARATUS AND PROCESSING APPARATUS

SUBSTRATE STORAGE CONTAINER

PACKAGING SYSTEM FOR PROTECTION OF IC WAFERS DURING FABRICATION, TR...

FRONT OPENING WAFER CONTANER WITH PATH TO GROUND EFFECTUATED BY DOOR

MANUFACTURING METHOD AND METHOD FOR OPERATING TREATMENT APPARATUS