characterised by the process involved to create the mask

Industry

CPC
H01L21/3086

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3086characterised by the process involved to create the mask

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Memory circuitry and method used in forming memory circuitry
- Patent number 12,369,321
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film forming method and semiconductor production apparatus
- Patent number 12,359,308
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Yusuke Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self aligned contact scheme
- Patent number 12,362,239
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resist underlayer film-forming composition
- Patent number 12,360,452
- Issue date Jul 15, 2025
- NISSAN CHEMICAL CORPORATION
- Hikaru Tokunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,363,895
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench plug hardmask for advanced integrated circuit structure fabr...
- Patent number 12,349,450
- Issue date Jul 1, 2025
- Intel Corporation
- Anthony St. Amour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up fill dielectric materials for semiconductor structure fab...
- Patent number 12,341,061
- Issue date Jun 24, 2025
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning underlying structure
- Patent number 12,341,007
- Issue date Jun 24, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Yun-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor FinFET device and method
- Patent number 12,327,729
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-color self-aligned double patterning (SADP) to yield static ran...
- Patent number 12,327,730
- Issue date Jun 10, 2025
- Adeia Semiconductor Solutions LLC
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating hardmasks for tight-pitch line formation
- Patent number 12,322,601
- Issue date Jun 3, 2025
- Adeia Semiconductor Solutions LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating Fin-type field-effect transistor device havin...
- Patent number 12,324,224
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resist underlayer film-forming composition
- Patent number 12,313,972
- Issue date May 27, 2025
- NISSAN CHEMICAL CORPORATION
- Hiroto Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming same
- Patent number 12,315,759
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Cyuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for non-resist nanolithography
- Patent number 12,308,368
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Miin-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating same
- Patent number 12,310,095
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Jongchan Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure etching solution and method for fabricating...
- Patent number 12,308,239
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chung-Chieh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure, and semiconductor...
- Patent number 12,300,492
- Issue date May 13, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mengmeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of cutting a fine pattern, methods of forming active patter...
- Patent number 12,293,921
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Sanggyo Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure manufacturing method
- Patent number 12,293,920
- Issue date May 6, 2025
- FUJIFILM Corporation
- Tomokazu Umezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic method for reactive development of photoresists
- Patent number 12,287,578
- Issue date Apr 29, 2025
- Tokyo Electron Limited
- Hamed Hajibabaeinajafabadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge fin trim process
- Patent number 12,283,526
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern decomposition lithography techniques
- Patent number 12,278,204
- Issue date Apr 15, 2025
- Intel Corporation
- Charles H. Wallace
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,279,458
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Joong Gun Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 12,278,113
- Issue date Apr 15, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhaohui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing memory device with first and second isolati...
- Patent number 12,278,138
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Ling Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices
- Patent number 12,272,555
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Jinyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oblique deposition and etch processes
- Patent number 12,272,559
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Akiteru Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,272,596
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Junghyuck Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming epitaxial source/drain features and semiconducto...
- Patent number 12,272,732
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hung Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Composition For Forming Adhesive Film And Patterning Process
- Publication number 20250237955
- Publication date Jul 24, 2025
- Shin-Etsu Chemical Co., Ltd.
- Naoki KOBAYASHI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A WIDE BAN...
- Publication number 20250239459
- Publication date Jul 24, 2025
- INFINEON TECHNOLOGIES AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR AUTO-ALIGNED MANUFACTURING OF A VDMOS TRANSISTOR, AND AU...
- Publication number 20250241044
- Publication date Jul 24, 2025
- STMicroelectronics S.r.l.
- Vincenzo ENEA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDATION BASED ATOMIC LAYER ETCHING
- Publication number 20250232982
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Kangyi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING EPITAXIAL SOURCE/DRAIN FEATURES AND SEMICONDUCTO...
- Publication number 20250234582
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Hung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250226219
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Da HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ENERGY ATOMIC LAYER ETCH OF A CARBON CONTAINING LAYER
- Publication number 20250218774
- Publication date Jul 3, 2025
- LAM RESEARCH CORPORATION
- Wenbing YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MID-PROCESSING REMOVAL OF SEMICONDUCTOR FINS DURING FABRICATION OF...
- Publication number 20250218787
- Publication date Jul 3, 2025
- Intel Corporation
- Mehmet O. Baykan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT HAVING AT LEAST ONE FEATURE FORMED BY APPLYING AT LEAST T...
- Publication number 20250210365
- Publication date Jun 26, 2025
- Quantinuum LLC
- Adam Jay OLLANIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compound For Forming Metal-Containing Film, Composition For Forming...
- Publication number 20250208506
- Publication date Jun 26, 2025
- Shin-Etsu Chemical Co., Ltd.
- Naoki KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDUCED LOADING EFFECT
- Publication number 20250212497
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Lun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PATTERNED MASK LAYER
- Publication number 20250201562
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20250194201
- Publication date Jun 12, 2025
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIST UNDERLAYER FILM FORMATION COMPOSITION
- Publication number 20250189896
- Publication date Jun 12, 2025
- NISSAN CHEMICAL CORPORATION
- Yuki MITSUTAKE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SEMICONDUCTO...
- Publication number 20250191933
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Do Young CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PHOTORESIST APPLICATION METHOD AND SEMICONDUCTOR PACKAGE...
- Publication number 20250180994
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Juhyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SMOOTHENING PROFILE OF PHOTORESIST
- Publication number 20250183034
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jia-Lin WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING POWER SEMICONDUCTOR DEVICES AND POWER SEM...
- Publication number 20250183035
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Alexander Viktorovich BOLOTNIKOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY STRUCTURE INCLUDING A PLURALITY OF SPACERS AND METHOD OF M...
- Publication number 20250174459
- Publication date May 29, 2025
- NANYA TECHNOLOGY CORPORATION
- PIN-YUAN SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUT EPI PROCESS AND STRUCTURES
- Publication number 20250176249
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Feng-Ching Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FIN END SPACER DUMMY GATE AND METHOD OF M...
- Publication number 20250176240
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Tai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING NANOSTRUCTURES UTILIZING SELF-ASSEMBLED NUCLEIC...
- Publication number 20250166993
- Publication date May 22, 2025
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PATTERNING PROCESSES UTILIZING DIRECTIONAL DEPOSITION
- Publication number 20250167001
- Publication date May 22, 2025
- Applied Materials, Inc.
- Tong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20250169173
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Joong Gun OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICES HAVING LINERS
- Publication number 20250159944
- Publication date May 15, 2025
- Micron Technology, Inc.
- Christopher J. Larsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20250142820
- Publication date May 1, 2025
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250142943
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A REDUCED SIZE FEATURE
- Publication number 20250140557
- Publication date May 1, 2025
- NXP USA, Inc.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PATTERNS, SEMICONDUCTOR MEMORY DEVICE, AND METHOD...
- Publication number 20250140558
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Yeongsup SOHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF A VERTICAL FIN FIELD EFFECT TRANSISTOR WITH REDUCED...
- Publication number 20250142938
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the process involved to create the mask

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Memory circuitry and method used in forming memory circuitry

Film forming method and semiconductor production apparatus

Self aligned contact scheme

Resist underlayer film-forming composition

Integrated assemblies and methods of forming integrated assemblies

Trench plug hardmask for advanced integrated circuit structure fabr...

Bottom-up fill dielectric materials for semiconductor structure fab...

Method of patterning underlying structure

Semiconductor FinFET device and method

Two-color self-aligned double patterning (SADP) to yield static ran...

Alternating hardmasks for tight-pitch line formation

Method of fabricating Fin-type field-effect transistor device havin...

Resist underlayer film-forming composition

FinFET device and method of forming same

Method for non-resist nanolithography

Semiconductor device and method of fabricating same

Semiconductor structure etching solution and method for fabricating...

Method for manufacturing semiconductor structure, and semiconductor...

Methods of cutting a fine pattern, methods of forming active patter...

Structure manufacturing method

Cyclic method for reactive development of photoresists

Edge fin trim process

Pattern decomposition lithography techniques

Semiconductor device

Method for manufacturing semiconductor structure

Method of manufacturing memory device with first and second isolati...

Methods of forming semiconductor devices

Oblique deposition and etch processes

Method of manufacturing semiconductor devices

Method for forming epitaxial source/drain features and semiconducto...

Patents Applicationslast 30 patents

Composition For Forming Adhesive Film And Patterning Process

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A WIDE BAN...

METHOD FOR AUTO-ALIGNED MANUFACTURING OF A VDMOS TRANSISTOR, AND AU...

OXIDATION BASED ATOMIC LAYER ETCHING

METHOD FOR FORMING EPITAXIAL SOURCE/DRAIN FEATURES AND SEMICONDUCTO...

SEMICONDUCTOR DEVICE STRUCTURES AND METHODS OF FORMING THE SAME

HIGH ENERGY ATOMIC LAYER ETCH OF A CARBON CONTAINING LAYER

MID-PROCESSING REMOVAL OF SEMICONDUCTOR FINS DURING FABRICATION OF...

COMPONENT HAVING AT LEAST ONE FEATURE FORMED BY APPLYING AT LEAST T...

Compound For Forming Metal-Containing Film, Composition For Forming...

SEMICONDUCTOR DEVICE WITH REDUCED LOADING EFFECT

METHOD FOR FORMING PATTERNED MASK LAYER

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

RESIST UNDERLAYER FILM FORMATION COMPOSITION

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SEMICONDUCTO...

SELECTIVE PHOTORESIST APPLICATION METHOD AND SEMICONDUCTOR PACKAGE...

METHOD OF SMOOTHENING PROFILE OF PHOTORESIST

METHODS FOR MANUFACTURING POWER SEMICONDUCTOR DEVICES AND POWER SEM...

ASSEMBLY STRUCTURE INCLUDING A PLURALITY OF SPACERS AND METHOD OF M...

CUT EPI PROCESS AND STRUCTURES

SEMICONDUCTOR DEVICE WITH FIN END SPACER DUMMY GATE AND METHOD OF M...

METHODS OF FORMING NANOSTRUCTURES UTILIZING SELF-ASSEMBLED NUCLEIC...

PATTERNING PROCESSES UTILIZING DIRECTIONAL DEPOSITION

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

METHODS OF FORMING SEMICONDUCTOR DEVICES HAVING LINERS

Integrated Assemblies and Methods of Forming Integrated Assemblies

SEMICONDUCTOR DEVICE

METHOD FOR FORMING A REDUCED SIZE FEATURE

METHOD OF FORMING PATTERNS, SEMICONDUCTOR MEMORY DEVICE, AND METHOD...

FABRICATION OF A VERTICAL FIN FIELD EFFECT TRANSISTOR WITH REDUCED...