Characterised by the substrate

Industry

CPC
H01L21/2003

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/2003Characterised by the substrate

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Laser irradiation apparatus and method for manufacturing semiconduc...
- Patent number 11,676,818
- Issue date Jun 13, 2023
- JSW AKTINA SYSTEM CO., LTD.
- Daisuke Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sense amplifier layout for FinFET technology
- Patent number 11,238,905
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Huei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing apparatus, semiconductor device manufacturing meth...
- Patent number 11,187,953
- Issue date Nov 30, 2021
- The Japan Steel Works, Ltd.
- Suk-Hwan Chung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a semiconductor device
- Patent number 11,011,377
- Issue date May 18, 2021
- International Business Machines Corporation
- Svenja Mauthe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser irradiation apparatus and method for manufacturing semiconduc...
- Patent number 10,943,785
- Issue date Mar 9, 2021
- The Japan Steel Works, Ltd.
- Daisuke Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device and method for evalua...
- Patent number 10,886,129
- Issue date Jan 5, 2021
- Shin-Etsu Handotai Co., Ltd.
- Tsuyoshi Ohtsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC epitaxial wafer and method for manufacturing SiC epitaxial wafer
- Patent number 10,865,500
- Issue date Dec 15, 2020
- Showa Denko K.K.
- Jun Norimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN laminate and method of manufacturing the same
- Patent number 10,707,309
- Issue date Jul 7, 2020
- SCIOCS COMPANY LIMITED
- Hajime Fujikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device and method of manufacturing si...
- Patent number 10,665,681
- Issue date May 26, 2020
- Fuji Electric Co., Ltd.
- Takeshi Tawara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN material and method of manufacturing semiconductor device
- Patent number 10,665,683
- Issue date May 26, 2020
- SCIOCS COMPANY LIMITED
- Fumimasa Horikiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sense amplifier layout for FinFET technology
- Patent number 10,636,458
- Issue date Apr 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Huei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mirror plate for a fabry-perot interferometer and a fabry-perot int...
- Patent number 10,495,514
- Issue date Dec 3, 2019
- Teknologian tutkimuskeskus VTT Oy
- Aapo Varpula
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 10,134,593
- Issue date Nov 20, 2018
- Denso Corporation
- Takeshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sense amplifier layout for FinFET technology
- Patent number 10,032,490
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Huei Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 9,590,075
- Issue date Mar 7, 2017
- MaxPower Semiconductor, Inc.
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sense amplifier layout for FinFET technology
- Patent number 9,466,493
- Issue date Oct 11, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Huei Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacture for a semiconductor device
- Patent number 8,962,426
- Issue date Feb 24, 2015
- MaxPower Semiconductor Inc.
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitrides on nanopatterned substrates
- Patent number 8,927,398
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Can Bayram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,907,412
- Issue date Dec 9, 2014
- MaxPower Semiconductor Inc.
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for molecular adhesion bonding at low pressure
- Patent number 8,871,611
- Issue date Oct 28, 2014
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a power semiconductor device having charg...
- Patent number 8,866,223
- Issue date Oct 21, 2014
- STMicroelectronics S.R.L.
- Alfio Guarnera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a power semiconductor device having charg...
- Patent number 8,853,779
- Issue date Oct 7, 2014
- STMicroelectronics S.R.L.
- Alfio Guarnera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of treating a silicon carbide substrate for improved epitax...
- Patent number 8,822,315
- Issue date Sep 2, 2014
- Cree, Inc.
- Davis Andrew McClure
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device
- Patent number 8,659,074
- Issue date Feb 25, 2014
- MaxPower Semiconductor, Inc.
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,629,493
- Issue date Jan 14, 2014
- MaxPower Semiconductor, Inc.
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture for a semiconductor device
- Patent number 8,618,599
- Issue date Dec 31, 2013
- MaxPower Semiconductor, Inc.
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device incorporating charge balancing
- Patent number 8,546,878
- Issue date Oct 1, 2013
- MaxPower Semiconductor, Inc.
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a power semiconductor device having charg...
- Patent number 8,455,318
- Issue date Jun 4, 2013
- STMicroelectronics S.r.l.
- Alfio Guarnera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture for a semiconductor device
- Patent number 8,420,483
- Issue date Apr 16, 2013
- MaxPower Semiconductor, Inc.
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,344,451
- Issue date Jan 1, 2013
- MaxPower Semiconductor, Inc.
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SILICON CHANNEL FOR BONDED 3D NAND DEVICES
- Publication number 20240363345
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Chang Seok KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER LAYER ON SILICON CARBIDE SUBSTRATE, AND METHOD FOR FORMING B...
- Publication number 20230118623
- Publication date Apr 20, 2023
- SEMICONDUCTOR MANUFACTURING ELECTRONICS (SHAOXING) CORPORATION
- Xiang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER IRRADIATION APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUC...
- Publication number 20210066082
- Publication date Mar 4, 2021
- THE JAPAN STEEL WORKS, LTD.
- Daisuke ITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20200321214
- Publication date Oct 8, 2020
- International Business Machines Corporation
- Svenja Mauthe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING APPARATUS, SEMICONDUCTOR DEVICE MANUFACTURING METH...
- Publication number 20190271871
- Publication date Sep 5, 2019
- THE JAPAN STEEL WORKS, LTD
- Suk-Hwan CHUNG
- G02 - OPTICS
Information Patent Application
GaN LAMINATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190273138
- Publication date Sep 5, 2019
- SCIOCS COMPANY LIMITED
- Hajime FUJIKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GaN MATERIAL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190273137
- Publication date Sep 5, 2019
- SCIOCS COMPANY LIMITED
- Fumimasa HORIKIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR EVALUA...
- Publication number 20190267239
- Publication date Aug 29, 2019
- Shin-Etsu Handotai Co., Ltd.
- Tsuyoshi OHTSUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SI...
- Publication number 20190237547
- Publication date Aug 1, 2019
- Fuji Electric Co., Ltd.
- Takeshi TAWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER IRRADIATION APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUC...
- Publication number 20190198322
- Publication date Jun 27, 2019
- THE JAPAN STEEL WORKS, LTD
- Daisuke ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20190051743
- Publication date Feb 14, 2019
- MaxPower Semiconductor, Inc.
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSE AMPLIFIER LAYOUT FOR FINFET TECHNOLOGY
- Publication number 20180330765
- Publication date Nov 15, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Yen-Huei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20180151366
- Publication date May 31, 2018
- Denso Corporation
- Takeshi ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A MIRROR PLATE FOR A FABRY-PEROT INTERFEROMETER AND A FABRY-PEROT I...
- Publication number 20180052049
- Publication date Feb 22, 2018
- Teknologian Tutkimuskeskus VTT Oy
- Aapo Varpula
- G02 - OPTICS
Information Patent Application
SIC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SIC EPITAXIAL WAFER
- Publication number 20180016706
- Publication date Jan 18, 2018
- SHOWA DENKO K.K.
- Jun NORIMATSU
- C30 - CRYSTAL GROWTH
Information Patent Application
Gallium Nitride Growth on Silicon
- Publication number 20170260651
- Publication date Sep 14, 2017
- Joshua A. ROBINSON
- C30 - CRYSTAL GROWTH
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140203354
- Publication date Jul 24, 2014
- MaxPower Semiconductor, Inc.
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURE FOR A SEMICONDUCTOR DEVICE
- Publication number 20140199814
- Publication date Jul 17, 2014
- MaxPower Semiconductor, Inc.
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III NITRIDES ON NANOPATTERNED SUBSTRATES
- Publication number 20140191283
- Publication date Jul 10, 2014
- International Business Machines Corporation
- Can Bayram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III NITRIDES ON NANOPATTERNED SUBSTRATES
- Publication number 20140191284
- Publication date Jul 10, 2014
- International Business Machines Corporation
- Can Bayram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20140183625
- Publication date Jul 3, 2014
- MaxPower Semiconductor, Inc.
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140070308
- Publication date Mar 13, 2014
- MaxPower Semiconductor, Inc.
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOLECULAR ADHESION BONDING AT LOW PRESSURE
- Publication number 20140065759
- Publication date Mar 6, 2014
- SOITEC
- Marcel BROEKAART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURE FOR A SEMICONDUCTOR DEVICE
- Publication number 20130267080
- Publication date Oct 10, 2013
- MaxPower Semiconductor, Inc.
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130168762
- Publication date Jul 4, 2013
- MaxPower Semiconductor, Inc.
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOLECULAR ADHESION BONDING AT LOW PRESSURE
- Publication number 20130105932
- Publication date May 2, 2013
- SOITEC
- Marcel BROEKAART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MANUFACTURING A POWER SEMICONDUCTOR DEVICE HAVING CHARG...
- Publication number 20120187479
- Publication date Jul 26, 2012
- STMicroelectronics S.r.l.
- Alfio Guarnera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MANUFACTURING A POWER SEMICONDUCTOR DEVICE HAVING CHARG...
- Publication number 20120187480
- Publication date Jul 26, 2012
- STMicroelectronics S.r.l.
- Alfio Guarnera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20120161226
- Publication date Jun 28, 2012
- MAXPOWER SEMICONDUCTOR INC.
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOLECULAR ADHESION BONDING AT LOW PRESSURE
- Publication number 20120038027
- Publication date Feb 16, 2012
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS

Characterised by the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laser irradiation apparatus and method for manufacturing semiconduc...

Sense amplifier layout for FinFET technology

Laser processing apparatus, semiconductor device manufacturing meth...

Method for fabricating a semiconductor device

Laser irradiation apparatus and method for manufacturing semiconduc...

Method for manufacturing semiconductor device and method for evalua...

SiC epitaxial wafer and method for manufacturing SiC epitaxial wafer

GaN laminate and method of manufacturing the same

Silicon carbide semiconductor device and method of manufacturing si...

GaN material and method of manufacturing semiconductor device

Sense amplifier layout for FinFET technology

Mirror plate for a fabry-perot interferometer and a fabry-perot int...

Semiconductor device and method for manufacturing same

Sense amplifier layout for FinFET technology

Semiconductor device

Sense amplifier layout for FinFET technology

Method of manufacture for a semiconductor device

Group III nitrides on nanopatterned substrates

Semiconductor device

Method for molecular adhesion bonding at low pressure

Process for manufacturing a power semiconductor device having charg...

Process for manufacturing a power semiconductor device having charg...

Methods of treating a silicon carbide substrate for improved epitax...

Semiconductor device

Semiconductor device

Method of manufacture for a semiconductor device

Semiconductor device incorporating charge balancing

Process for manufacturing a power semiconductor device having charg...

Method of manufacture for a semiconductor device

Semiconductor device

Patents Applicationslast 30 patents

SILICON CHANNEL FOR BONDED 3D NAND DEVICES

BUFFER LAYER ON SILICON CARBIDE SUBSTRATE, AND METHOD FOR FORMING B...

LASER IRRADIATION APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUC...

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE

LASER PROCESSING APPARATUS, SEMICONDUCTOR DEVICE MANUFACTURING METH...

GaN LAMINATE AND METHOD OF MANUFACTURING THE SAME

GaN MATERIAL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR EVALUA...

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SI...

LASER IRRADIATION APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUC...

Semiconductor Device

SENSE AMPLIFIER LAYOUT FOR FINFET TECHNOLOGY

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

A MIRROR PLATE FOR A FABRY-PEROT INTERFEROMETER AND A FABRY-PEROT I...

SIC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SIC EPITAXIAL WAFER

Gallium Nitride Growth on Silicon

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURE FOR A SEMICONDUCTOR DEVICE

GROUP III NITRIDES ON NANOPATTERNED SUBSTRATES

GROUP III NITRIDES ON NANOPATTERNED SUBSTRATES

Semiconductor Device

SEMICONDUCTOR DEVICE

METHOD FOR MOLECULAR ADHESION BONDING AT LOW PRESSURE

METHOD OF MANUFACTURE FOR A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD FOR MOLECULAR ADHESION BONDING AT LOW PRESSURE

PROCESS FOR MANUFACTURING A POWER SEMICONDUCTOR DEVICE HAVING CHARG...

PROCESS FOR MANUFACTURING A POWER SEMICONDUCTOR DEVICE HAVING CHARG...

Semiconductor Device

METHOD FOR MOLECULAR ADHESION BONDING AT LOW PRESSURE